产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW RESONATOR
MODEL NO 型 号:
HDR293.125M SMD-3
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2006-5-11
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
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E-mail:[email protected]
Page 1 of 8
SAW RESONATOR
HDR293.125M S3
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SAW RESONATOR
HDR293.125M S3
1. SCOPE
This specification shall cover the characteristics of 1-port SAW resonator with 293.125M used
for remote-control security.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
10V
10V50Hz/60Hz
-20℃ to +85℃
-45℃ to +85℃
0dBm
Electronic Characteristics
Item
Unites
Minimum
Center Frequency
MHz
292.050
Insertion Loss
dB
Typical
293.125
1.5
Quality Factor Unload Q
8000
12000
50Ω Loaded Q
1000
2000
℃
Temperature
Turnover Temperature
Stability
Turnover Frequency
KHz
fo±2.7
Freq.temp.Coefficient
ppm/℃2
0.032
ppm/yr
<±10
Frequency Aging
DC. Insulation Resistance
Motional Resistance R1
MΩ
Maximum
293.200
2.5
39
1.0
Ω
16
26
RF Equivalent
RLC Model
Motional Inductance L1
μH
138.46
Motional Capacitance C1
fF
2.1292
pF
2.6
Shunt Static Capacitance
3. TEST CIRCUIT
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SAW RESONATOR
HDR293.125M S3
4. DIMENSION
2.Input
6.Output
1.3.5.7.Gound
4.8 Ground
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the resonator into the room
conditions for 24 hours prior to the measurement. It shall fulfill the specifications in table
1.
5-2 Low temperature exposure
Subject the device to -20℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +80℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in table 1.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in table 1.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
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SAW RESONATOR
HDR293.125M S3
area of the terminals must be covered with new solder. It shall meet the specifications in
table 1.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in table 1.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1.
5-8 Lead fatigue
5-8-1 Pulling test
Weight along with the direction of lead without an shock 1kg. The device shall satisfy all
the initial Characteristics.
5-8-2 Bending test
Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction
of thickness. This operation shall be done toward both direction. The device shall show no
evidence of damage and shall satisfy all the initial electrical characteristics.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
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SAW RESONATOR
HDR293.125M S3
(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
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SAW RESONATOR
HDR293.125M S3
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W
F
E
P0
P1
P2
D0
D1
t1
t2
A
B
12.0
±0.3
5.5
±0.05
1.75
±0.1
4.0
±0.1
8.0
±0.1
2.0
±0.05
Ø1.5
±0.1
Ø1.0
±0.25
0.3
±0.05
2.10
±0.1
6.40
±0.1
5.20
±0.1
[Figure 2]
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Page 7 of 8
SAW RESONATOR
HDR293.125M S3
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
±1.0
Ø100
±0.5
Ø13
±0.5
Ø21
±0.8
2
±0.5
13
±0.3
3
max.
1.0
max.
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Page 8 of 8