Johanson Technology, Inc. Highly temperature-stable Impedance Matched RF Front End Differential Balun-Low Pass Filter Integrated Ceramic Component For the Texas Instruments’ CC253X, CC254X, CC257X, CC853X and CC852X Family of Chipsets October 2012 1. Introduction The CC2530, CC2531, CC2533, CC2540, CC2541, CC2543, CC2544, CC2570, CC2571, CC8530, CC8531, CC8520, and CC8521 chipset family from Texas Instruments are single-chip solutions for 2.4 GHz Bluetooth, IEEE 802.15.4, RF4CE, ZigBee, ANT RF network processors, Smart ENergyand PurePath™ audio transmission. Johanson Technology, Inc.’s 2450BM15A0002 Impedance Matched RF Front End Differential Balun-Low Pass Filter integrated passive component was specifically designed for use with the CC253X, CC254X, CC257X, CC853X and CC852X family of chipsets. This matched balun simplifies the RF front-end by considerably reducing component count and implementation area size. Highly temperature stable ceramic is used to manufacture the 2450BM15A0002 which is optimum for temperature-varied applications such as lighting (rated 125C) or outdoor. The 2450BM15A0002 is a six-pin device with small mechanical dimensions of only 2.0 mm x 1.25 mm x 0.7mm (EIA 0805) and an approximate footprint of 1.65 mm x 2.8 mm. Figure 1. JTI Photograph of Reference Design for the CC2530 www.johnsontechnology.com/ti.html 1 2. Description of the Reference Design 1 CC253X CC254X CC257X CC2530 CC853X CC852X 2 3 4 5 6 7 8 9 31 32 33 34 35 36 37 38 39 40 The traditional reference design for the CC253X, CC254X, CC257X, CC853X and CC852X families have been the discrete solutions like the one shown in Figure 2. Johanson Technology has developed a single-SMD solution with a chip Balun-LPF that is especially matched for the aforementioned family of ICs. The alternate reference design is shown in Figure 3 (pin # and assignment may vary) RBIAS 30 AVDD4 29 AVDD1 28 AVDD2 27 Antenna (50 Ohm) C252 C254 C251 RF_N 26 L252 L251 C253 L261 RF_P 25 AVDD3 24 XOSC_Q2 23 XOSC_Q1 22 AVDD4 21 C261 10 C262 20 19 18 17 16 15 14 13 12 11 1 CC253X CC254X CC257X CC2530 CC853X CC852X 2 3 4 5 6 7 8 9 10 31 32 33 34 35 36 37 38 39 40 Figure 2. Discrete Reference Design example RBIAS 30 AVDD4 29 AVDD1 28 AVDD2 27 3 2 1 RF_N 26 BAL GND Unbal RF_P 25 BAL GND GND 4 5 6 AVDD3 24 XOSC_Q2 23 XOSC_Q1 22 AVDD4 21 Antenna (50 Ohm) U2 2450BM15A0002 20 19 18 17 16 15 14 13 12 11 Figure 3. Johanson Integrated Reference Design example www.johnsontechnology.com/ti.html 2 C255 Referring to Figure 3, U2 is the JTI matched balun 2450BM15A0002. Please refer to Appendix A for the datasheet of this component. For more updated information from the Johanson Technology web site at: http://www.johansontechnology.com/en/integrated-passives/chipset-specific-ipc.html Figure 4. Component Placement The component placement influences the RF performance. It is recommended that the reference PCB layout be copied as closely as possible. In particular, the designer should make note of all dimensions between the CC253X, CC254X, CC257X, CC853X, CC852X and 2450BM15A0002. www.johnsontechnology.com/ti.html 3 Figure 5. Example of CC2530 JTI Reference Design Schematic (with 2450BM15A0002) www.johnsontechnology.com/ti.html 4 3. Layout Johanson’s 2450BM15A0002 Matched Balun-LPF enables the designer to reduce the layout area due to component cutback (to one component); furthermore, PCB sensitivity is also decreased compared to the discrete passive solution. The layout greatly influences the RF performance. It is recommended to copy the reference design as closely as possible. Figure 6. Layer 1 of the CC2530 JTI Reference Design Layout (with 2450BM15A0002) In the event that the reference design can not be copied, then the routing from the RF pins RF_P and RF_N must be symmetrical to the matched balun component, U2. The length of the tracks should be kept to a minimum and preferably the same length and width that are used in the reference design. If this routing is not symmetrical, then the output power may be reduced and the harmonics may increase. Go to: http://www.ti.com/litv/zip/swra297a to download the gerber files. www.johnsontechnology.com/ti.html 5 4. Measurement Results All results presented in this chapter are based on measurements performed with CC2530EM JTI rev 1.0 Reference Design board with Johanson’s 2450BM15A0002. All measurement results presented are the average of each batch tested from typical devices. The output power and harmonics measurements were performed with 0xF5 settings. Johanson’s 2450BM15A0002 Matched Balun-LPF offers improved 2nd and 3rd harmonic, it eases implementation and increases margin to FCC/ETSI compliance when compared to solution with discrete passives. Note: all values are in dBm if not otherwise stated. Datasheet CC2530EM discrete 10 passive components typ Receiver sensitivity PER =1% as specified by [1] [1] requires -85dBm Measured CC2530EM w/2450BM15A0002 1 passive component typ unit -97 -96.6 dBm dBm Ouput Power Delivered to a single ended 50Ω load through a balun using max recomended output setting (0xF5) (0xF5) [1] requires minimum -3dBm 50 4.5 50 3.3 Ω dBm dBm Spurius Emission 25MHz-1000MHz (outside restricted bands) 25MHz-2400MHz (within FCC restricted bands) 25MHz-1000MHz (within ETSI restricted bands) 1800-1900MHz (ETSI restricted band) 5150-5300MHz (ETSI restricted band) At 2xfc and 3xfc (FCC restricted band) At 2xfc and 3xfc (ETSI EN 300-440 and EN300-328) 1GHz-12.75GHz (Outside restricted bands) At 2483.5MHz and above (FCC restricted bands) fc=2480MHz -60 -60 -60 -57 -55 -42 -31 -53 -42 -64 -64 -64 -64 -55 -47.3 -38.2 -57.4 -51.6 dBm dBm dBm dBm dBm dBm dBm dBm dBm EVM Measured as defined by [1] using maximum recommended output power setting [1] Requires maximum 35% 2 2 20.5 21.3 mA 24.3 24.6 mA 28.7 29.1 mA 33.5 33.3 mA Current 32MHz XOSC running, radio in RX mode, -50dBm input power Consumption No peripherials active, CPU idle 32MHz XOSC running, radio in RX mode, -100dBm input power No peripherials active, CPU idle 32MHz XOSC running, radio in Txmode, output power 0xD5 No peripherials active, CPU idle 32MHz XOSC running, radio in Txmode, output power 0xF5 No peripherials active, CPU idle Other datasheet performance expected identical. % All results presented in this chapter are based on measurements performed with CC2530EM JTI rev 1.0 Reference Design board with Johanson’s 2450BM15A0002 5. References [1] IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specification for Low-Rate Wireless Personal Area Network (LR-WPAN) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf www.johnsontechnology.com/ti.html 6 Appendix A High Frequency Ceramic Solutions P/N 2450BM15A0002 2.45 GHz Impedance Matched Balun-Filter: For TI CC253X, CC254X, CC257X, CC853X and CC852X Chipset family Detail Specification: Page 1 of 2 10/25/2012 General Specifications Part Num ber Frequency (MHz) 2400 - 2500 50 Ω Unbalanced Im pedance Phase Diff. Impedance match to T.I. CC253X, CC254X, CC257X, CC853X and CC852X Chipsets Balanced DIfferential Im pedance 12 min. @ 1GHz Differential Mode Attenuation (dB) -40°C to 125°C 2450BM15A0002 18 min. @ 4800~5000MHz 20 min. @ 7200~7500MHz 180° ± 15 (-40°C to 125°C) Input Pow er 2W max. Reel Quanity 4,000 Insertion Loss 1.5 dB max. (-40°C to +85°C) Operating Tem perature -40°C to +125°C Insertion Loss 1.7 dB max. (-40°C to +125°C) Recom m ended Storage Conditions +5 ~ +35 °C, Humidity 45~75%RH, 18 mos. max Return Loss 9.5 dB min. (-40°C to 125°C) Part Number Explanation Packaging Style P/N Suffix Termination Style Bulk Suffix = S Eg. 2450BM15A0002S T&R Suffix = E Eg. 2450BM15A0002E Terminal Configuration 100% Tin Suffix = None Eg. 2450BM15A0002(E or S) No. Evaluation Board Function 1 2450BM15A0002-EBSMA Mechanical Dimensions Unbalanced Port 2 GND 3 Balanced Port In mm 4 Balanced Port L 0.079 ± 0.004 2.00 ± 0.10 5 GND W 0.049 ± 0.004 1.25 ± 0.10 6 GND T 0.028 ± 0.004 0.70 ± 0.10 a 0.012 ± 0.004 0.30 ± 0.10 b 0.008 ± 0.004 0.20 ± 0.10 c 0.012 +.004/-.008 0.30 +0.1/-0.2 g 0.014 ± 0.004 0.35 ± 0.10 p 0.026 ± 0.002 0.65 ± 0.05 W c 3 2 1 4 5 6 L a p T g b Mounting Considerations Mount these devices w ith brow n mark facing up. Units: mm * Line w idth should be designed to provide 50 Ω impedance matching characteristics. 0.35 Solder Resist Note: No DC Blocking Capacitor required (internal) * Land 3 2 1 Through-hole ( φ0.3) T.I. Chipset 0.8 4 5 6 1.0 0.30 Johanson Technology, Inc. reserves the right to make design changes w ithout notice. All sales are subject to Johanson Technology, Inc. terms and conditions. The latest specification can be downloaded from the following link: http://www.johansontechnology.com/en/integrated-passives/chipset-specific-ipc/texas-instruments-ti.html www.johnsontechnology.com/ti.html 7 High Frequency Ceramic Solutions 2.45 GHz Impedance Matched Balun-Filter: For TI CC253X, CC254X, CC257X, CC853X and CC852X Chipset family Detail Specification: P/N 2450BM15A0002 10/25/2012 Page 2 of 2 Typical Electrical Performance at 25°C and 125°C 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 freq, GHz 25C Unbalanced RL 25C Balanced Return Loss 25C Insertion Loss/Attenuation (Differential Mode) 125C Unbalanced RL 125C Balanced Return Loss 125C Insertion Loss/Attenuation (Differential Mode) Technical notes and Reference Designs Technical Note: http://www.johansontechnology.com/en/technical-notes/integrated-passivesrf-comp/2450bm15a0002-matched-balun-for-the-texas-instruments-cc2530zigbee-transceiver.html Technical Note: http://johansontechnology.com/en/integrated-passives/chipset-specificbaluns/texas-instruments-ti.html Reference Design: http://www.ti.com/litv/pdf/swra297a Gerbers: http://www.ti.com/litv/zip/swra297a This component is MSL 1 The latest specification can be downloaded from the following link: http://www.johansontechnology.com/en/integrated-passives/chipset-specific-ipc/texas-instruments-ti.html www.johnsontechnology.com/ti.html 8