MP1766 LxWxH: .750x.750x.210 in

Case Style
MP
Outline Dimensions
MP1766
INDEX
13
12
11
1
10
2
9
3
8
4
5
6
B
PCB Land Pattern
U
T
Z
7
A
C
W
V
Y
D
E
4
5
S
R
X
6
7
M
3
8
2
9
G
13
12
H
A
.750
(19.05)
SOLDER RESIST
10
1
MP1766
METALLIZATION
N
F
CASE#
Q
P
B
.750
(19.05)
11
J
L
K
C
.210
(5.33)
CASE#
D
.139
(3.53)
E
.157
(3.99)
F
.215
(5.46)
G
.160
(4.06)
P
Q
R
S
T
U
V
.790
.541
.790
.499
.384
.203
.080
MP1766
(20.07) (13.74) (20.07) (12.67) (9.75) (5.16) (2.03)
Dimensions are in inches (mm). Tolerances: 2PL. ± .03; 3PL. ± .015
H
.218
(5.54)
W
.069
(1.75)
J
.157
(3.99)
K
.100
(2.54)
X
.630
(16.00)
L
.060
(1.52)
Y
.630
(16.00)
M
.069
(1.75)
Z
.145
(3.68)
N
.149
(3.78)
WT.GRAMS
4.6
Notes:
1.
2.
3.
Case material: Nickel-Silver alloy.
Base: Printed wiring laminate.
Termination finish:
For RoHS Case Styles: 2-5 µ inch (.05-.13 microns) Gold over 120-240 µ inch (3.05-6.10 microns) Nickel plate.
All models, (+) suffix.
98-MP Rev.: A (05/14/13) M141637 File: 98-MP.doc
This document and its contents are the property of Mini-Circuits
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