HE1354 LxWxH: 0.39x0.39x0.15 in

Case Style
HE
HE1354
Outline Dimensions
6
TOP SIDE
5
4
SIDE VIEW
PCB Land Pattern
0
INDEX
E
1
2
3
C
BOTTOM SIDE
B
E
D
1
2
M
3
A
METALLIZATION
H
L
TYP.
SOLDER RESIST
J
6
5
K
TYP.
4
Suggested Layout
G
F
CASE #
HE1354
A
B
C
D
E
F
G
H
.394
.394
.150 .122 .075 .098 .038 .026
(10.01) (10.01) (3.81) (3.10) (1.90) (2.49) (0.97) (0.66)
J
K
L
M
WT.
GRAMS
.051
(1.29)
.038
(0.97)
.046
(1.17)
.434
(11.02)
0.7
Dimensions are in inches (mm). Tolerances: 2 Pl. + .03; 3 Pl. + .015
Notes:
1. Case material: Nickel-Silver alloy.
2. Base: Printed wiring laminate.
3. Termination finish:
For RoHS Case Styles: 3-5 µ inch (.08-.13 microns) Gold over 120-240 µ inch (3.05-6.10 microns) Nickel plate.
For RoHS-5 Case Styles: Tin-Lead plate.
98-HE Rev.: F (11/17/09) M124729 File: 98-HE.doc
This document and its contents are the property of Mini-Circuits.
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