MAXIM MAX5961

MAX5961ETM+
RELIABILITY REPORT
FOR
MAX5961ETM+
PLASTIC ENCAPSULATED DEVICES
December 18, 2008
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX5961ETM+
Conclusion
The MAX5961ETM+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX5961 0 to 16V, quad, hot-swap controller provides complete protection for systems with up to four distinct supply voltages. The device allows
the safe insertion and removal of circuit cards into live backplanes. The MAX5961 is an advanced hot-swap controller that monitors voltage and
current with an internal 10-bit ADC. The device provides two levels of overcurrent circuit-breaker protection; a fast-trip threshold for a fast turn-off, and
a lower slow-trip threshold for a delayed turn-off. The maximum overcurrent circuit-breaker threshold range is set independently for each channel with
a trilevel input (ILIM_) or by programming though an I²C interface. The internal 10-bit ADC is multiplexed to monitor the output voltage and current of
each hot-swap channel. The total time to cycle through all the eight measurements is 100µs (typ). Each 10-bit value is stored in an internal circular
buffer so that 50 past samples of each signal can be read back through the I²C interface at any time or after a fault condition. The MAX5961 can be
configured as four independent hot-swap controllers, hot-swap controllers operating in pairs, or as a group of four hot-swap controllers. The device
also includes five digital comparators per hot-swap channel to implement overcurrent warning, two levels of overvoltage detection, and two levels of
undervoltage detection. The limits for overcurrent, overvoltage, and undervoltage are user-programmable. When any of the measured values violates
the programmable limits, an external active-low ALERT signal is asserted. In addition to the active-low ALERT signal, depending on the selected
operating mode, the MAX5961 can deassert a power-good signal and/or turn-off the external MOSFET. The MAX5961 is available in a 48-pin thin
QFN package and operates over the -40°C to +85°C extended temperature range.
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MAX5961ETM+
II. Manufacturing Information
A. Description/Function:
0 to 16V, Quad, Hot-Swap Controller with 10-Bit Current and Voltage Monitor
B. Process:
B8
C. Number of Device Transistors:
156582
D. Fabrication Location:
California, Texas, or Oregon
E. Assembly Location:
China, Philippines, and Thailand
F. Date of Initial Production:
2008
III. Packaging Information
A. Package Type:
48-pin TQFN 7x7
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Ablestick 8200
E. Bondwire:
Au (.001 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-2905
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
36°C/W
K. Single Layer Theta Jc:
0.8°C/W
L. Multi Layer Theta Ja:
25°C/W
M. Multi Layer Theta Jc:
0.8°C/W
IV. Die Information
A. Dimensions:
216 X 191 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX5961ETM+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.91 x 10
-9
= 22.91 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the B8 Process results in a FIT Rate of 2.71 @ 25C and 17.30 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The NQ09 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per
JEDEC JESD22-A114-D. Latch-Up testing has shown that this device withstands a current pulse of +/-100mA and an
over voltage of 1.5xVcc Max.
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MAX5961ETM+
Table 1
Reliability Evaluation Test Results
MAX5961ETM+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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