ESD/TLSD** Series Low Capacitance TVS Diode Array APPLICATIONS ◆ 10/100 Ethernet ◆ WAN/LAN Equipment SO-08 ◆ Test & Measurement Equipment ◆ Switching Systems ◆ Instrumentation ◆ DSLAMs ◆ Base Stations ◆ Analog Inputs IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) ◆ IEC61000-4-5 (Lightning) 24A (8/20µs) PIN CONFIGURATION FEATURES ◆ 600 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects eight lines (four line Pairs) ◆ Low capacitance ◆ RoHS Compliant MECHANICAL CHARACTERISTICS ◆ JEDEC SO-08 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 70 Millgrams (Approximate) ◆ Quantity Per Reel : 500pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free REV.2015.02.01 01 | www.spsemi.cn ESD/TLSD** Series DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 600 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ PARAMETER SYMBOL Operating Temperature Range Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) SLVU2.8-8 TLSD2.8K8B REV.2015.02.01 SLVU 2.8-8 2.8 3.0 IT VC VC @5A (mA) 1 (max.) (max.) 8.5 17 (@A) 30 IR CT (µA) (pF) (max.) (max.) 1 8 02 | www.spsemi.cn ESD/TLSD** Series SOP-08 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT REV.2015.02.01 03 | www.spsemi.cn