ESD/TUSD**FBX Series Low Capacitance TVS Diode Array APPLICATIONS ◆ Ethernet - 10/100/1000 Base T ◆ Cellular Phones SOD-323 2 ◆ I C Bus Protection ◆ Parallel & Serial Port Protection ◆ Personal Digital Assistant (PDA) ◆ Microcontroller Input Protection ◆ ISDN S/T Interface ◆ WAN/LAN Equipment IEC COMPATIBILITY ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) PIN CONFIGURATION FEATURES ◆ 200 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects One Bidirectional I/O line ◆ Low clamping voltage ◆ Working voltages : 2.5 and 3.3V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ JEDEC SOD-323 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 5.0 Millgrams (Approximate) ◆ Quantity Per Reel : 3,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free REV.2014.05.01 01 | www.spsemi.cn ESD/TUSD**FBX Series DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) SYMBOL VALUE UNITS Peak Pulse Power (tp=8/20µs waveform) PPP 200 Watts Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature Range TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ PARAMETER Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) IT VC IR VC (µA) (pF) (@A) (max.) (typ.) @1A (mA) (max.) (max.) CT TUSD02FBX CA2 2.5 3.0 1 4.8 15.0 15 1 0.6 TUSD03FBX CA1 3.3 3.5 1 5.8 15.0 10 1 0.6 REV.2014.05.01 02 | www.spsemi.cn ESD/TUSD**FBX Series SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT REV.2014.05.01 03 | www.spsemi.cn