F-215 (Rev 05JUN15) QMS–032–06.75–L–D–DP–A TM QMS–026–06.75–L–D–A (0,635 mm) .025" QMS SERIES RUGGED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QMS Insulator Material: Liquid Crystal Polymer Terminal & Ground Plane Material: Phosphor Bronze Plating: Au over 50µ" (1,27 µm) Ni (Tin on Ground Plane Tail) Current Rating: Contact: 2.6 A per pin (1 pin powered per row) Ground Plane: 15.7 A per ground plane (1 ground plane powered) Voltage Rating: 300 VAC mated with QFS Operating Temp: -55°C to +125°C RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (026-052) (0,15 mm) .006" max (078) Board Stacking: For applications requiring more than two connectors per board, contact [email protected] Integral metal plane for power or ground Board Mates: QFS Cable Mates: 6QCD (MOQ Required) Type PINS PER ROW NO. OF PAIRS QMS –026, –052, –078 (52 total pins per bank = –D) LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart –L (16 pairs per bank = –D–DP) TM SUMIT TM 4-Express 10 I/ PC s ocol Prot orted Supp 100 GbE nel Fibre Chan XAUI ® s PCI Expres SATA notes at Download app ppnote /a om c.c te m www.sa @ samtec.com Contact SIG on protocols for questions Note: Some lengths, styles and options are non-standard, non-returnable. • Other platings • Guide Posts • Without PCB Alignment Pins (05.75 and 06.75 only) • Hot Pluggable • 64 (-DP) and 104 positions per row Contact Samtec. Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 8 GHz / 16 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 8.5 GHz / 17 Gbps Differential Pair Signaling –DP 7.5 GHz / 15 Gbps 9 GHz / 18 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QMS or contact [email protected] QMS/QFS 10 mm Stack Height –016, –032, –048 stry Indu ards d Stan ALSO AVAILABLE (1,60 mm) .063" NOMINAL WIPE RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality Increased insertion depth for rugged applications –05.75 –06.75 –09.75 –D (–05.75 and –06.75 lead style only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) = Single-Ended –D–DP = Differential Pair QFS LEAD STYLE –04.25 –06.25 (5,38) .212 10 mm 12 mm (6,35) .250 11 mm 13 mm (9,35) .368 14 mm 16 mm (6,35) .250 *Processing conditions will affect mated height. APPLICATION STACK HEIGHT (0,25) .010 (7,52) .296 (7,26) .286 (0,635) .025 (0,23) .009 INDUSTRY STANDARD 02 A –D (0,44) .017 Requires Standoff SO-1524-03-01-01-L for 15,24 mm or SO-2215-02-01-01-L for 22 mm board spacing. Connectors designed to not fully seat when mated. (No. of Banks) x (21,34) .840 - (0,51) .020 (21,34) .840 01 (2,29) .090 = (5,50 mm) .217" DIA Polyimide film Pick & Place Pad –SL (–09.75 lead style only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) MATED HEIGHT* A OTHER OPTION –K (–078 & –048 Not available with –09.75 lead style) LEAD STYLE A TYPE INTERCONNECTS TERMINAL SOCKET SUMIT™ ASP-129637-01 ASP-129646-01 PCI/104-Express™ ASP-129637-03 ASP-129646-03 PCI/104-Express™ ASP-142781-02 ASP-129646-02 PCI/104-Express™ ASP-142781-03 ASP-129646-03 –D–DP WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. STACK BANKS HEIGHT 1 3 2 3 15,24 mm 15,24 mm 22 mm 22 mm