IC-TO-BOARD CAPABILITIES + DESIGN SOLUTIONS GUIDE JANUARY 2015 ADVANCED IC PACKAGING + MICRO INTERPOSERS STREAMLINED INTERCONNECT PATH END-TO-END SYSTEM DESIGN + CAPABILITIES Samtec combines Advanced IC Packaging and Ultra Micro Interposer technologies to achieve optimized interconnect paths from the bare die to an interface 100 meters away, and all insertion points in between - with expertise in: –– Package and substrate design –– System modeling and prototyping –– Assembly and electrical testing of finished goods –– Ultra low profile, high density and dual compression contact micro interposers –– Advanced IC packaging, including die attach, wirebond, flip chip, dam and encapsulation, and micro optics Samtec offers end-to-end signal integrity support including full channel analysis, high data rate simulations, break out routing and application assistance. Visit SamtecMicroelectronics.com or contact the Microelectronics Group at [email protected]. Advanced IC Packaging FLIP CHIP AND UNDERFILL PRECISION DIE ATTACH FINE PITCH WIREBOND DAM AND ENCAPSULATION TERMINATION FLEXIBILITY ULTRA HIGH DENSITY PROFILE AND PITCH FLEXIBILITY Micro Interposers ULTRA LOW PROFILE 2 MICRO INTERPOSERS END-TO-END SYSTEM DESIGN + CAPABILITIES TM Samtec’s Z-Ray™ micro array interposers are ultra low profile, ultra high density, and highly customizable solutions ideal for complex IC-to-Board applications. –– Ultra low profile, high density arrays, with BeCu micro-formed contacts on 0,80 mm and 1,00 mm pitches –– Ultra flexible, with a variety of standard and custom configurations, including dual compression, solder ball, and an array of sizes and shapes –– Assembled into rugged low profile FR4 substrate under high pressure and temperature –– Choice of fastener options, including application specific designs, screw downs, quick install (easy on/off) and thermal spreaders Contact [email protected] for more information. STANDARD & CUSTOM Z-RAY ™ MICRO INTERPOSER CAPABILITIES Series Pitch ZA8 ZA1 Capabilities 0,80 mm 1,00 mm > 0,65 mm Stack Height 1,00 mm 0,50 mm to 4,00 mm Total I/Os 100 - 400 1,000 + Ruggedizing Screw Down Holes, Alignment Holes Latches, Thermal Spreaders, Quick-Release Spring Constraints Construction Single Layer FR4 Multi-layer FR4 (e.g., Pitch Spreaders) Terminations Dual Compression, Compression + Solder Ball Z-Ray™ Ultra Low Profile Interposers ULTRA HIGH DENSITY ULTRA LOW PROFILE ULTRA FLEXIBLE Choice of 0,80 or 1,00 mm pitch grid One piece design ZA8 Series for up to 1,200 contacts / in 2 Low profile 1,00 mm body height Customer-specific stack heights, pin counts, pitches, shapes and plating thicknesses ZA1 Series for up to 1,024 contacts / in 2 Low 25 g of normal force with .008" (0,20 mm) contact deflection Alignment and fastener options Customizable in X-Y-Z axes Quick-turn customizations with minimal NRE and tooling charges Also Available & In Development 4 4 ULTRA HIGH DENSITY MULTI-LAYER SYSTEM MICRO COAX CABLES Z-Ray™ on 0,635 mm pitch and 1000+ I/Os in development Pitch spreaders and other embedded interconnect circuitry 34 AWG micro twinax cable on 0,80 mm pitch, 8 and 16 pairs standard 1,00 mm pitch with up to 1,024 contacts per square inch ZA1 Series [Actual Size] Cu plated through-hole in PCB core Adhesive-bonded formed BeCu ZA8 Series [Actual Size] Etched Ni & Au plated contacts Adhesive-bonded cover film Ultra low profile 1,00 mm body height 0,80 mm pitch with up to 1,200 contacts per square inch Dual compression Single compression contact system with solder balls Fastener options MODULARIZATION WITH Z-RAY ™ save PCB real estate • reduce cost • eliminate reworks & scrap • gain design flexibility 5 ADVANCED IC PACKAGING DESIGN, MANUFACTURING AND SUPPORT Samtec Microelectronics Group is positioned to provide you with complete signal chain support - from custom package and substrate design, to connector and cable selection, through signal integrity testing and debug of your full system - helping you ensure an optimized signal path. –– Advanced IC package and substrate design –– Flip chip, die attach, wirebond, dam, encapsulation and lid attach –– Modeling and prototyping –– Testing and debug –– In-house optical engine design, manufacturing and packaging Samtec’s worldwide Signal Integrity Group is dedicated to helping you determine and implement the most streamlined signal path possible, with support including full channel analysis, high data rate simulation, break out region design and routing, interconnect selection and application assistance. Visit SamtecMicroelectronics.com for more information, or contact the Microelectronics or Signal Integrity Groups directly at [email protected] or [email protected]. Complex Package Assembly 6 FLIP CHIP & UNDERFILL PRECISION DIE ATTACH FINE PITCH & LOW PROFILE WIREBOND DAM, ENCAPSULATION & LID ATTACH Dam, encapsulation and lid attach Precision die attach Flip chip & underfill Fine pitch and low profile wirebond Custom package design & assembly Full signal chain support PCB design with signal integrity support Interposer integration Engine miniaturization MICRO OPTICS DESIGN & PACKAGING on-board & mid-board engines • high speed micro flyover • future-proof & equalized copper • [email protected] INDUSTRY-SPECIFIC APPLICATIONS LEADING-EDGE TECHNOLOGIES + CONTINUOUS INNOVATION Samtec Microelectronics Group is positioned to support many industry-specific IC packaging applications. We provide leading-edge technologies and on-going development to ensure we are on the forefront of advanced IC packaging design and manufacturing. Our manufacturing facility in Colorado Springs, Colorado, supports all areas of advanced IC packaging design, assembly, testing and manufacturing. Our technologies are supported by a reliable and accessible manufacturing infrastructure, along with full in-house signal integrity and system support. Samtec adheres to a number of industry standard certifications and practices, including: –– TS 16949 –– ISO 9001 –– ISO/TS Quality Manual –– Environmental Compliance (RoHS) –– MIL-STD-883 –– ITAR Regulation Compliance Visit SamtecMicroelectronics.com for more information, or contact the Microelectronics or Signal Integrity Groups directly at [email protected] or [email protected]. MEDICAL & HEALTHCARE Technologies / Capabilities –– MEMs –– Image packaging –– Custom IC package design –– Stacked and custom die –– Chip-scale interconnects End Products –– Neuromodulation –– Implantable pressure sensors –– Surgical assistance robotics –– Endoscopes –– Ultrasound –– DNA and blood analyzers –– Control devices –– Ventilators –– Implantable devices –– Diagnostic meters –– Patient monitoring –– Heart rate and fitness monitoring –– Optical 3D surface scanners –– ECG, portable ECG and EEG 8 AVIONICS & DEFENSE Technologies / Capabilities –– Compliant to MIL-STD-883 –– ITAR Compliant –– Tin-only and Tin-Lead –– Custom design and assembly End Products –– PAA (Phased Array Antenna) –– Missile control –– Data converters –– Avionic pressure sensors –– Hermetic package assemblies –– Laser modules –– Digital signal processors –– Microcontrollers –– Power management –– Analog to digital converters –– FIFOs –– Autonomous vehicle modules OIL, INDUSTRIAL & COMMERCIAL Technologies / Capabilities –– Micro footprint –– Flip chip, MEMs, BGA –– Thermal management –– Custom design and assembly –– Optics packaging End Products –– Geophone seismic sensors –– Downhole sensor assemblies –– Communications –– Automotive –– Optical assemblies –– Smart grid and energy –– Test and measurement –– Digital storage –– Automation –– Motor drive and control –– Servers 9 DESIGN RULES & GUIDELINES ADVANCED DESIGN + ASSEMBLY CAPABILITIES Samtec Microelectronics Group has an extensive offering of advanced package design and assembly capabilities as well as the ability to assist in choosing the best technology and materials for your specific application. In addition to substrate and package design, flip chip, die attach, wirebond and sealing, our capabilities also include thermal management, wafer dicing, lid attach and marking. The following dimensions are designed to help release product to manufacturing as quickly as possible. Please contact Samtec Microelectronics Group at [email protected] if you have tighter requirements. Flip Chip Basic guidelines for laying out flip chip substrates including pad design rules, package sizes, solder ball specs, flux, pad pitch and layout, and general structure: PACKAGE SIZE SUBSTRATE BGA SOLDER BALL SIZE SUBSTRATE BGA PAD PITCH Smallest size (approx.): 10 mm x 10 mm Smallest (approx.): 0.018" diameter Largest size (approx.): 63 mm x 63 mm Largest (approx.): 0.025" diameter Closest pitch (approx.): 0,80 mm x 0,80 mm SOLDER BALL MATERIAL TYPE FLUX Eutectic Pb:Sn = 37:63 Furthest pitch: no constraint TacFlux–025 & WS–609 Pb-Free Other no-clean flux-types, water soluble flux-types TYPICAL SUBSTRATE STRUCTURE Cu Plating Ni Plating LAYER THICKNESS (TYPICAL) Au Plating Solder Bump (Pb:Sn = 37:63) Location Solder Resist 2nd Build Up Core Cu Build Up Cu Core Substrate (BT Resin) 2nd Build Up 400* 25 21 14.5 2 Insulation Layer 33 12 Solder Resist Layer 21 18 3~7 Gold Plating [BACK] Solder Resist Au Plating 800 Nickel Plating 1st Build Up Ni Plating Standard (µm) Custom (µm) Core Substrate [FRONT] 1st Build Up Cu Plating Any configuration of the pad layout is acceptable 0.03 ~ 0.12 No. of Build Up Layers: 1, 2, 3, 4 per side; No. of Core Layers: 2, 4 *Coreless also available PTH SPECIFICATIONS (TYPICAL) FLIP CHIP PAD DESIGN RULE Item C A Solder Resist Filled Via B 10 A Flip Chip Pad Dia. (Solder Resist Opening) 100 75 B Flip Chip Pad Metal Land Diameter 145 100 C Flip Chip Pad Pitch 225 130 D Solder Bump Height Solder Bump D Standard (µm) Custom (µm) 32 +/- 5 Die Attach –– Minimum distance between surrounding square of fiducial and neighboring objects must be 0,048 mm –– Gray level contrast between background and fiducial must be a minimum of 100 gray levels out of 256 DIE ATTACH REQUIREMENTS TOP DOWN –– Background of fiducial must not have a structure & background must be single-colored gray level C –– Maximum die size for dipping: 50 mm x 50 mm –– No waffle-pack handling for die < 1 mm 2 Organic (min) Ceramic (min) Inches (µm) Inches (µm) Description Minimum Die Size 0.010" (250) 0.010" (250) A Overlap of Die Attach Ground Plane to Die Edge 0.020" (500) 0.020" (500) B Space Between Die Attach Ground Plane to Wirebond Pad 0.020" (500) 0.020" (500) Space Between Fiducial Edge to Die Attach Ground Plane Edge 0.010" (250) 0.006" (150) B A –– Maximum length to width ratio for components: 5:1 C –– Saw kerfs must be at least 25μm and into the dicing tape (through the entire wafer thickness) –– Die attach materials can be non-conductive, conductive, die-attach-films (DAF) and solder preforms; other processes can be discussed per customer requirements Wirebond WIREBOND DESIGN RULES Plating and layout requirements for substrate pad design as well as wire parameters: Rule –– Wedge Bond: ENIG plating is acceptable; typical wire types are Al, Au and Pt Organic (min) Ceramic (min) Inches (µm) Inches (µm) Description A Wirebond Pad 0.004" (100) 0.003" (75) B Wirebond Pad Pitch 0.008" (200) 0.006" (150) C 0.008" (200) 0.007" (175) Processes that use Au ball bond, require Gold plate per MIL-G–45204, Type III, Grade A, Class 1: Overlap of Wirebond Lead Edge to Via D 0.004" (100) - –– 99.9% purity minimum Space Solder Mask to Wirebond Lead Edge E Overlap of Wirebond Lead Edge to Solder Mask 0.008" (200) - F Space of Die Edge to Wirebond Lead Edge* 0.015" (375) or 2x Die Thickness (whichever is greater) G Maximum Wire Length 0.250" (6350) H Maximum Wire Height 0.100" (2540) –– Ball Bond: ENEPIG plating is recommended; typical wire types are Au and Cu TOP DOWN –– < 90 Knoop hardness –– 50μ" thick, minimum SIDE PROFILE EE GG DD HH BB FF AA DIE DIE SUBSTRATE SUBSTRATE CC *Assumes no ground plane for die attach Dam & Encapsulation PACKAGE ENCAPSULATION RULES –– Maximum encapsulation thickness (board surface to top of encapsulation): 0.024" (600) –– Automated dispense tool heated work area: 12" x 16" –– Total work area: 20" x 30" –– Machine positioning accuracy and repeatability: +/- 0.001" TOP DOWN C C A A Rule Description Organic (min) Inches (µm) A Dam Width 0.012" (300) B Space of Dam to Wirebond Lead Edge 0.012" (300) C Space of Fiducial to Dam* 0.007" (175) D Overlap of Encapsulation to Top of Wirebond Loop 0.007" (175) E Height of Encapsulation** =A/2 SIDE PROFILE D D B B E E SUBSTRATE SUBSTRATE DIEDIE *Must be outside encapsulated region **Board surface to top of encapsulation 11 SAMTEC USA P.O. Box 1147 • New Albany, IN 47151-1147 USA +1-800-SAMTEC-9 (USA & Canada) • Tel: +1-812-944-6733 • Fax: +1-812-948-5047 • Email: [email protected] SAMTEC NORTHERN CALIFORNIA 2323 Owen St., Ste 120 • Santa Clara, CA 95054 +1-800-726-8329 (USA & Canada) • Tel: +1-812-944-6733 • Fax: +1-408-217-5171 • Email: [email protected] SAMTEC SOUTHERN CALIFORNIA 5410 Trabuco Road • Suite 120 • Irvine, CA 92620 Tel: +1-800-726-8329 • Email: [email protected] SAMTEC SOUTH AMERICA Rua Alagoas Nr 1460 • Sala 805 • Bairro Savassi • Belo Horizonte - Minas Gerais 30130-160 • Brazil Tel: +55 31 3786 3227 • Fax: +55 31 3786 3229 • Email: [email protected] SAMTEC UNITED KINGDOM 11 Mollins Court • Westfield, Cumbernauld • Scotland G68 9HP Tel: +44 01236 739292 • Fax: +44 01236 727113 • Email: [email protected] SAMTEC GERMANY Streiflacher Str. 7 • 82110 Germering • Germany • +0800 SAMTEC9 (+0800 / 72 68 329) Germany only Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 • Email: [email protected] SAMTEC FRANCE Val d’ Europe Park • 11, rue du Courtalin - Bâtiment B • 77700 Magny le Hongre • France Tel: +33 1 60 95 06 60 • Fax: +33 1 60 95 06 61 • Email: [email protected] SAMTEC ITALY Via Colleoni 25 • Centro Direzionale Colleoni • Palazzo Pegaso Ingresso 3 • 20864 Agrate Brianza-Monza Brianza (MB) • Italy Tel: +39 039 6890337 • Fax: +39 039 6890315 • Email: [email protected] SAMTEC NORDIC/BALTIC Solkraftsvägen 25 • 13570 Stockholm • Sweden Tel: +46 8 4477280 • Fax: +46 8 7420413 • Email: [email protected] SAMTEC BENELUX 11 Mollins Court • Westfield, Cumbernauld • Scotland G68 9HP Tel: +44 01236 739292 • Fax: +44 01236 727113 • Email: [email protected] SAMTEC ISRAEL 21 Bar-Kochva St. • Concord Tower • B'nei Brak, Israel 51260 Tel: +972 3 7526600 • Fax: +972 3 7526690 • Email: [email protected] SAMTEC INDIA #11, 2nd Floor, Chetana, Dattatreya Road • Basavanagudi • Bangalore • 560 004 India Tel: +91 80 3272 1612 • Fax: +91 80 2662 0967 • Email: [email protected] SAMTEC ANZ 2A San Antonio Court • Mentone 3194 • Victoria, Australia Tel: +613 9580 0683 • Fax: +613 9580 0684 • Email: [email protected] SAMTEC SINGAPORE 1 Kallang Sector #05-01/02 • Kolam Ayer Industrial Park • Singapore 349276 Tel: +65 6745 5955 • Fax: +65 6841 1502 • Email: [email protected] SAMTEC JAPAN Nisso No. 16 Bldg. • 3-8-8, Shinyokohama, Kohoku-ku • Yokohama-shi, Kanagawa 222-0033 Japan Tel: +81 45 475 1385 • Fax: +81 45 475 1340 • Email: [email protected] SAMTEC SHANGHAI Unit 601, Qilai Building • No 889 Yishan Road • Shanghai, China 200233 Tel: +86 21 6083 3766 • Fax: +86 21 5423 4575 • Email: [email protected] SAMTEC SHENZHEN Rm 906B 9/F New World Center Tower • Yi Tian Road, Fu Tian District • Shenzhen, China 518026 Tel: +86 755 83776780 • Fax: +86 755 83776767 • Email: [email protected] SAMTEC TAIWAN 10F, No. 182, Sec. 2 • Dunhua S. Rd. • Da-an District • Taipei City 10669 • Taiwan (R.O.C.) Tel: 00801 14 9916 (Taiwan only) • Tel: +886 2 2735 6109 • Fax: +886 2 2735 5036 • Email: [email protected] SAMTEC HONG KONG Room 18, 13/F, Shatin Galleria • 18-24 Shan Mei Street • Fo Tan, Shatin, Hong Kong Tel: +852 26904858 • Fax: +852 26904842 • Email: [email protected] SAMTEC KOREA RM#758, Sungwoo Starwoos Officetel Gumi-dong • Seongnam Si, Bundang-gu, Gyeonggi-Do • 463-860 South Korea Tel: +82 31 717 5685 • Fax: +82 31 717 5681 • Email: [email protected] SAMTEC ONLINE www.samtec.com ISO-9001 and/or TS 16949 Certified 141125