CAPABILITIES + DESIGN SOLUTIONS GUIDE

IC-TO-BOARD
CAPABILITIES + DESIGN SOLUTIONS GUIDE
JANUARY 2015
ADVANCED IC PACKAGING
+
MICRO INTERPOSERS
STREAMLINED INTERCONNECT PATH
END-TO-END SYSTEM DESIGN + CAPABILITIES
Samtec combines Advanced IC Packaging and Ultra Micro Interposer technologies to achieve optimized interconnect paths from the bare die to an interface 100 meters away, and all insertion points in between - with expertise in:
–– Package and substrate design
–– System modeling and prototyping
–– Assembly and electrical testing of finished goods
–– Ultra low profile, high density and dual compression contact micro interposers
–– Advanced IC packaging, including die attach, wirebond, flip chip, dam and encapsulation, and micro optics
Samtec offers end-to-end signal integrity support including full channel analysis, high data rate simulations, break out routing
and application assistance.
Visit SamtecMicroelectronics.com or contact the Microelectronics Group at [email protected]
Advanced IC Packaging
FLIP CHIP
AND UNDERFILL
PRECISION
DIE ATTACH
FINE PITCH
WIREBOND
DAM AND
ENCAPSULATION
TERMINATION
FLEXIBILITY
ULTRA HIGH DENSITY
PROFILE AND PITCH
FLEXIBILITY
Micro Interposers
ULTRA LOW PROFILE
2
MICRO INTERPOSERS
END-TO-END SYSTEM DESIGN + CAPABILITIES
TM
Samtec’s Z-Ray™ micro array interposers are ultra low profile, ultra high density, and
highly customizable solutions ideal for complex IC-to-Board applications.
–– Ultra low profile, high density arrays, with BeCu micro-formed contacts on 0,80 mm
and 1,00 mm pitches
–– Ultra flexible, with a variety of standard and custom
configurations, including dual compression, solder ball,
and an array of sizes and shapes
–– Assembled into rugged low profile
FR4 substrate under high pressure
and temperature
–– Choice of fastener options, including
application specific designs, screw downs,
quick install (easy on/off) and thermal spreaders
Contact [email protected] for more information.
STANDARD & CUSTOM Z-RAY ™ MICRO INTERPOSER CAPABILITIES
Series
Pitch
ZA8
ZA1
Capabilities
0,80 mm 1,00 mm
> 0,65 mm
Stack Height
1,00 mm
0,50 mm to 4,00 mm
Total I/Os
100 - 400
1,000 +
Ruggedizing
Screw Down Holes,
Alignment Holes
Latches, Thermal Spreaders,
Quick-Release Spring Constraints
Construction
Single Layer FR4
Multi-layer FR4
(e.g., Pitch Spreaders)
Terminations
Dual Compression, Compression + Solder Ball
Z-Ray™ Ultra Low Profile Interposers
ULTRA HIGH DENSITY
ULTRA LOW PROFILE
ULTRA FLEXIBLE
Choice of 0,80 or 1,00 mm pitch grid
One piece design
ZA8 Series for up to 1,200 contacts / in 2
Low profile 1,00 mm body height
Customer-specific stack heights, pin counts,
pitches, shapes and plating thicknesses
ZA1 Series for up to 1,024 contacts / in 2
Low 25 g of normal force with
.008" (0,20 mm) contact deflection
Alignment and fastener options
Customizable in X-Y-Z axes
Quick-turn customizations with minimal NRE
and tooling charges
Also Available & In Development
4 4
ULTRA HIGH DENSITY
MULTI-LAYER SYSTEM
MICRO COAX CABLES
Z-Ray™ on 0,635 mm pitch and 1000+
I/Os in development
Pitch spreaders and other embedded
interconnect circuitry
34 AWG micro twinax cable
on 0,80 mm pitch, 8 and 16 pairs standard
1,00 mm pitch with
up to 1,024 contacts
per square inch
ZA1 Series
[Actual Size]
Cu plated through-hole in PCB core
Adhesive-bonded formed BeCu
ZA8 Series
[Actual Size]
Etched Ni & Au plated contacts
Adhesive-bonded cover film
Ultra low profile
1,00 mm body height
0,80 mm pitch with
up to 1,200 contacts
per square inch
Dual compression Single compression
contact system with solder balls
Fastener options
MODULARIZATION WITH Z-RAY ™
save PCB real estate • reduce cost • eliminate reworks & scrap • gain design flexibility
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ADVANCED IC PACKAGING
DESIGN, MANUFACTURING AND SUPPORT
Samtec Microelectronics Group is positioned to provide you with complete signal chain support - from custom package and
substrate design, to connector and cable selection, through signal integrity testing and debug of your full system - helping
you ensure an optimized signal path.
–– Advanced IC package and substrate design
–– Flip chip, die attach, wirebond, dam, encapsulation and lid attach
–– Modeling and prototyping
–– Testing and debug
–– In-house optical engine design, manufacturing and packaging
Samtec’s worldwide Signal Integrity Group is dedicated to helping you determine and implement the most streamlined signal
path possible, with support including full channel analysis, high data rate simulation, break out region design and routing,
interconnect selection and application assistance.
Visit SamtecMicroelectronics.com for more information, or contact the Microelectronics or Signal Integrity Groups directly at
[email protected] or [email protected]
Complex Package Assembly
6
FLIP CHIP & UNDERFILL
PRECISION DIE ATTACH
FINE PITCH & LOW PROFILE WIREBOND
DAM, ENCAPSULATION & LID ATTACH
Dam, encapsulation
and lid attach
Precision die attach
Flip chip & underfill
Fine pitch and
low profile wirebond
Custom package
design & assembly
Full signal chain support
PCB design with
signal integrity support
Interposer integration
Engine miniaturization
MICRO OPTICS DESIGN & PACKAGING
on-board & mid-board engines • high speed micro flyover • future-proof & equalized copper • [email protected]
INDUSTRY-SPECIFIC APPLICATIONS
LEADING-EDGE TECHNOLOGIES + CONTINUOUS INNOVATION
Samtec Microelectronics Group is positioned to support many industry-specific IC packaging applications. We provide leading-edge
technologies and on-going development to ensure we are on the forefront of advanced IC packaging design and manufacturing.
Our manufacturing facility in Colorado Springs, Colorado, supports all areas of advanced IC packaging design, assembly, testing
and manufacturing. Our technologies are supported by a reliable and accessible manufacturing infrastructure, along with full
in-house signal integrity and system support.
Samtec adheres to a number of industry standard certifications and practices, including:
–– TS 16949
–– ISO 9001
–– ISO/TS Quality Manual
–– Environmental Compliance (RoHS)
–– MIL-STD-883
–– ITAR Regulation Compliance
Visit SamtecMicroelectronics.com for more information, or contact the Microelectronics or Signal Integrity Groups directly at
[email protected] or [email protected]
MEDICAL & HEALTHCARE
Technologies / Capabilities
–– MEMs
–– Image packaging
–– Custom IC package design
–– Stacked and custom die
–– Chip-scale interconnects
End Products
–– Neuromodulation
–– Implantable pressure sensors
–– Surgical assistance robotics
–– Endoscopes
–– Ultrasound
–– DNA and blood analyzers
–– Control devices
–– Ventilators
–– Implantable devices
–– Diagnostic meters
–– Patient monitoring
–– Heart rate and fitness
monitoring
–– Optical 3D surface scanners
–– ECG, portable ECG and EEG
8
AVIONICS & DEFENSE
Technologies / Capabilities
–– Compliant to MIL-STD-883
–– ITAR Compliant
–– Tin-only and Tin-Lead
–– Custom design and assembly
End Products
–– PAA (Phased Array Antenna)
–– Missile control
–– Data converters
–– Avionic pressure sensors
–– Hermetic package assemblies
–– Laser modules
–– Digital signal processors
–– Microcontrollers
–– Power management
–– Analog to digital converters
–– FIFOs
–– Autonomous vehicle modules
OIL, INDUSTRIAL & COMMERCIAL
Technologies / Capabilities
–– Micro footprint
–– Flip chip, MEMs, BGA
–– Thermal management
–– Custom design and assembly
–– Optics packaging
End Products
–– Geophone seismic sensors
–– Downhole sensor assemblies
–– Communications
–– Automotive
–– Optical assemblies
–– Smart grid and energy
–– Test and measurement
–– Digital storage
–– Automation
–– Motor drive and control
–– Servers
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DESIGN RULES & GUIDELINES
ADVANCED DESIGN + ASSEMBLY CAPABILITIES
Samtec Microelectronics Group has an extensive offering of advanced package design and assembly capabilities as well as the
ability to assist in choosing the best technology and materials for your specific application.
In addition to substrate and package design, flip chip, die attach, wirebond and sealing, our capabilities also include thermal
management, wafer dicing, lid attach and marking.
The following dimensions are designed to help release product to manufacturing as quickly as possible. Please contact Samtec
Microelectronics Group at [email protected] if you have tighter requirements.
Flip Chip
Basic guidelines for laying out flip chip substrates including pad design rules, package sizes, solder ball specs, flux, pad pitch and
layout, and general structure:
PACKAGE SIZE
SUBSTRATE BGA SOLDER BALL SIZE
SUBSTRATE BGA PAD PITCH
Smallest size (approx.): 10 mm x 10 mm
Smallest (approx.): 0.018" diameter
Largest size (approx.): 63 mm x 63 mm
Largest (approx.): 0.025" diameter
Closest pitch (approx.):
0,80 mm x 0,80 mm
SOLDER BALL MATERIAL TYPE
FLUX
Eutectic Pb:Sn = 37:63
Furthest pitch: no constraint
TacFlux–025 & WS–609
Pb-Free
Other no-clean flux-types, water soluble flux-types
TYPICAL SUBSTRATE STRUCTURE
Cu Plating
Ni Plating
LAYER THICKNESS (TYPICAL)
Au Plating
Solder Bump
(Pb:Sn = 37:63)
Location
Solder Resist
2nd Build Up
Core Cu
Build Up Cu
Core Substrate (BT Resin)
2nd Build Up
400*
25
21
14.5
2
Insulation Layer
33
12
Solder Resist Layer
21
18
3~7
Gold Plating
[BACK]
Solder Resist
Au Plating
800
Nickel Plating
1st Build Up
Ni Plating
Standard (µm) Custom (µm)
Core Substrate
[FRONT]
1st Build Up
Cu Plating
Any configuration of the pad
layout is acceptable
0.03 ~ 0.12
No. of Build Up Layers: 1, 2, 3, 4 per side; No. of Core Layers: 2, 4
*Coreless also available
PTH
SPECIFICATIONS (TYPICAL)
FLIP CHIP PAD DESIGN RULE
Item
C
A
Solder Resist
Filled Via
B
10
A
Flip Chip Pad Dia.
(Solder Resist Opening)
100
75
B
Flip Chip Pad Metal
Land Diameter
145
100
C
Flip Chip Pad Pitch
225
130
D
Solder Bump Height
Solder Bump
D
Standard (µm) Custom (µm)
32 +/- 5
Die Attach
–– Minimum distance between surrounding square of
fiducial and neighboring objects must be 0,048 mm
–– Gray level contrast between background and
fiducial must be a minimum of 100 gray levels
out of 256
DIE ATTACH REQUIREMENTS
TOP DOWN
–– Background of fiducial must not have a structure
& background must be single-colored gray level
C
–– Maximum die size for dipping: 50 mm x 50 mm
–– No waffle-pack handling for die < 1 mm 2
Organic (min) Ceramic (min)
Inches (µm) Inches (µm)
Description
Minimum Die Size
0.010" (250)
0.010" (250)
A
Overlap of Die Attach
Ground Plane to Die Edge
0.020" (500)
0.020" (500)
B
Space Between Die
Attach Ground Plane to
Wirebond Pad
0.020" (500)
0.020" (500)
Space Between Fiducial
Edge to Die Attach
Ground Plane Edge
0.010" (250)
0.006" (150)
B
A
–– Maximum length to width ratio for
components: 5:1
C
–– Saw kerfs must be at least 25μm and into the
dicing tape (through the entire wafer thickness)
–– Die attach materials can be non-conductive, conductive, die-attach-films (DAF) and solder preforms; other processes can be
discussed per customer requirements
Wirebond
WIREBOND DESIGN RULES
Plating and layout requirements for substrate pad design as well as
wire parameters:
Rule
–– Wedge Bond: ENIG plating is acceptable; typical wire types are Al,
Au and Pt
Organic (min) Ceramic (min)
Inches (µm) Inches (µm)
Description
A
Wirebond Pad
0.004" (100)
0.003" (75)
B
Wirebond Pad Pitch
0.008" (200)
0.006" (150)
C
0.008" (200)
0.007" (175)
Processes that use Au ball bond, require Gold plate per MIL-G–45204,
Type III, Grade A, Class 1:
Overlap of Wirebond Lead
Edge to Via
D
0.004" (100)
-
–– 99.9% purity
minimum
Space Solder Mask to
Wirebond Lead Edge
E
Overlap of Wirebond Lead
Edge to Solder Mask
0.008" (200)
-
F
Space of Die Edge to
Wirebond Lead Edge*
0.015" (375) or 2x Die Thickness
(whichever is greater)
G
Maximum Wire Length
0.250" (6350)
H
Maximum Wire Height
0.100" (2540)
–– Ball Bond: ENEPIG plating is recommended; typical wire types are
Au and Cu
TOP DOWN
–– < 90 Knoop
hardness
–– 50μ" thick,
minimum
SIDE PROFILE
EE
GG
DD
HH
BB
FF
AA
DIE
DIE
SUBSTRATE
SUBSTRATE
CC
*Assumes no ground plane for die attach
Dam & Encapsulation
PACKAGE ENCAPSULATION RULES
–– Maximum encapsulation thickness (board surface to top of encapsulation):
0.024" (600)
–– Automated dispense tool heated work area: 12" x 16"
–– Total work area: 20" x 30"
–– Machine positioning accuracy
and repeatability: +/- 0.001"
TOP DOWN
C C
A A
Rule
Description
Organic (min)
Inches (µm)
A
Dam Width
0.012" (300)
B
Space of Dam to Wirebond
Lead Edge
0.012" (300)
C
Space of Fiducial to Dam*
0.007" (175)
D
Overlap of Encapsulation
to Top of Wirebond Loop
0.007" (175)
E
Height of Encapsulation**
=A/2
SIDE PROFILE
D D
B B
E E
SUBSTRATE
SUBSTRATE
DIEDIE
*Must be outside encapsulated region
**Board surface to top of encapsulation
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SAMTEC USA
P.O. Box 1147 • New Albany, IN 47151-1147 USA
+1-800-SAMTEC-9 (USA & Canada) • Tel: +1-812-944-6733 • Fax: +1-812-948-5047 • Email: [email protected]
SAMTEC NORTHERN CALIFORNIA
2323 Owen St., Ste 120 • Santa Clara, CA 95054
+1-800-726-8329 (USA & Canada) • Tel: +1-812-944-6733 • Fax: +1-408-217-5171 • Email: [email protected]
SAMTEC SOUTHERN CALIFORNIA
5410 Trabuco Road • Suite 120 • Irvine, CA 92620
Tel: +1-800-726-8329 • Email: [email protected]
SAMTEC SOUTH AMERICA
Rua Alagoas Nr 1460 • Sala 805 • Bairro Savassi • Belo Horizonte - Minas Gerais 30130-160 • Brazil
Tel: +55 31 3786 3227 • Fax: +55 31 3786 3229 • Email: [email protected]
SAMTEC UNITED KINGDOM
11 Mollins Court • Westfield, Cumbernauld • Scotland G68 9HP
Tel: +44 01236 739292 • Fax: +44 01236 727113 • Email: [email protected]
SAMTEC GERMANY
Streiflacher Str. 7 • 82110 Germering • Germany • +0800 SAMTEC9 (+0800 / 72 68 329) Germany only
Tel: +49 (0) 89 / 89460-0 • Fax: +49 (0) 89 / 89460-299 • Email: [email protected]
SAMTEC FRANCE
Val d’ Europe Park • 11, rue du Courtalin - Bâtiment B • 77700 Magny le Hongre • France
Tel: +33 1 60 95 06 60 • Fax: +33 1 60 95 06 61 • Email: [email protected]
SAMTEC ITALY
Via Colleoni 25 • Centro Direzionale Colleoni • Palazzo Pegaso Ingresso 3 • 20864 Agrate Brianza-Monza Brianza (MB) • Italy
Tel: +39 039 6890337 • Fax: +39 039 6890315 • Email: [email protected]
SAMTEC NORDIC/BALTIC
Solkraftsvägen 25 • 13570 Stockholm • Sweden
Tel: +46 8 4477280 • Fax: +46 8 7420413 • Email: [email protected]
SAMTEC BENELUX
11 Mollins Court • Westfield, Cumbernauld • Scotland G68 9HP
Tel: +44 01236 739292 • Fax: +44 01236 727113 • Email: [email protected]
SAMTEC ISRAEL
21 Bar-Kochva St. • Concord Tower • B'nei Brak, Israel 51260
Tel: +972 3 7526600 • Fax: +972 3 7526690 • Email: [email protected]
SAMTEC INDIA
#11, 2nd Floor, Chetana, Dattatreya Road • Basavanagudi • Bangalore • 560 004 India
Tel: +91 80 3272 1612 • Fax: +91 80 2662 0967 • Email: [email protected]
SAMTEC ANZ
2A San Antonio Court • Mentone 3194 • Victoria, Australia
Tel: +613 9580 0683 • Fax: +613 9580 0684 • Email: [email protected]
SAMTEC SINGAPORE
1 Kallang Sector #05-01/02 • Kolam Ayer Industrial Park • Singapore 349276
Tel: +65 6745 5955 • Fax: +65 6841 1502 • Email: [email protected]
SAMTEC JAPAN
Nisso No. 16 Bldg. • 3-8-8, Shinyokohama, Kohoku-ku • Yokohama-shi, Kanagawa 222-0033 Japan
Tel: +81 45 475 1385 • Fax: +81 45 475 1340 • Email: [email protected]
SAMTEC SHANGHAI
Unit 601, Qilai Building • No 889 Yishan Road • Shanghai, China 200233
Tel: +86 21 6083 3766 • Fax: +86 21 5423 4575 • Email: [email protected]
SAMTEC SHENZHEN
Rm 906B 9/F New World Center Tower • Yi Tian Road, Fu Tian District • Shenzhen, China 518026
Tel: +86 755 83776780 • Fax: +86 755 83776767 • Email: [email protected]
SAMTEC TAIWAN
10F, No. 182, Sec. 2 • Dunhua S. Rd. • Da-an District • Taipei City 10669 • Taiwan (R.O.C.)
Tel: 00801 14 9916 (Taiwan only) • Tel: +886 2 2735 6109 • Fax: +886 2 2735 5036 • Email: [email protected]
SAMTEC HONG KONG
Room 18, 13/F, Shatin Galleria • 18-24 Shan Mei Street • Fo Tan, Shatin, Hong Kong
Tel: +852 26904858 • Fax: +852 26904842 • Email: [email protected]
SAMTEC KOREA
RM#758, Sungwoo Starwoos Officetel Gumi-dong • Seongnam Si, Bundang-gu, Gyeonggi-Do • 463-860 South Korea
Tel: +82 31 717 5685 • Fax: +82 31 717 5681 • Email: [email protected]
SAMTEC ONLINE
www.samtec.com
ISO-9001 and/or TS 16949 Certified
141125