SLIM BODY GROUND PLANE SOCKET

F-215
QRF8–078–05.0–L–D–A
QRF8–036–05.0–L–D–DP–A
®
QRF8–026–05.0–L–D–A
(0,80 mm) .0315"
QRF8 SERIES
SLIM BODY GROUND PLANE SOCKET
®
SPECIFICATIONS
Board Mates:
QRM8
For complete specifications and
recommended PCB layouts see
www.samtec.com?QRF8
Cable Mates:
EQRD
Insulator Material:
Black LCP
Contact Material:
BeCu
Ground Plane Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
2.2 A per pin
(1 pin powered per row)
Ground Plane:
8.5 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
215 VAC
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (018-026)
(0,15 mm) .006" max (036-078)
(1,20 mm)
.047"
NOMINAL
WIPE
Integral
ground/power
plane
Edge Rate®
contacts
s
ocol
Prot orted
Supp
100 GbE
notes at
Download app ppnote
om/a
www.samtec.c mtec.com
@ sa
Contact SIG
on protocols
for questions
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D 9.5 GHz / 19 Gbps 11 GHz / 22 Gbps
Differential Pair Signaling –D 8.5 GHz / 17 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling –DP 9 GHz / 18 Gbps 17.5 GHz / 35 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QRF8 or contact [email protected]
QRM8/QRF8
7 mm Stack Height
QRF8
Type
PINS PER ROW
NO. OF PAIRS
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
–026, –052, –078
(52 total pins per bank = –D)
–018, –036, –054
(18 pairs per bank = –D–DP)
MATED HEIGHT*
QRF8
LEAD
STYLE
Increased wipe
for rugged applications
LEAD
STYLE
PLATING
OPTION
–05.0
–L
= 5 mm
Body
Height
= 10 µ"
(0,25 µm)
Gold on
contact,
Matte Tin
on tail
–07.0
= 7 mm
Body
Height
A
TYPE
–D
= Single-Ended
–D–DP
= Differential
Pair
No. of Banks x (24,80) .976 + (3,57) .140
*Processing conditions will
affect mated height.
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
–TR
02
(0,80)
.0315
(4,60)
.181
(1,04)
.041
(1,25) A
.049
(0,23) .009
LEAD
STYLE
A
–05.0 (5,01)
.197
–07.0 (7,01)
.276
–K
= Tape & Reel
(–018, –026,
–036, –052 only)
01
(4,60)
.181
(12,00) (14,00)
–07.0 (9,00)
.354
.472
.551
–GP
= Guide Post
(Requires –GP on
mating connector)
= (5,00 mm) .197" DIA
Polyimide Film
Pick & Place Pad
QRM8 LEAD STYLE
–02.0 –05.0 –07.0
(10,00) (12,00)
–05.0 (7,00)
.276
.394
.472
OTHER
OPTION
(1,00) .039 DIA
(0,20)
.008
No. of Banks x (24,80) .976 - (2,00) .078
• Edge Rate®
contacts
No. of Banks x (24,80) .976 + (5,25) .206
• Increased contact
wipe
• 10 year MFG
Note: Patented
• Guide post option
–GP OPTION
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.