Product Specification

Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
MEC6 Series – Socket, Vertical Orientation
Other configurations available for:
Right Angle Application
See www.samtec.com for more information.
Revision: A
Date: August 29, 2013
Page 1
© Samtec, Inc.
Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec’s MEC6 Series 0,635 mm (.025”)
Mini Edge Card Connector. All information contained in this specification is for a Vertical 1,57 mm (.062”) Edge Card
configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
http://www.samtec.com/?MEC6-DV.
3.0 TESTING
3.1 Current Rating: 1.7A (6 Adjacent contacts powered)
3.2 Voltage Rating: 210 VAC
3.3 Operating Temperature Range: -55°C to +125°C
3.4 Electrical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
630 VAC
Pass
Insulation Resistance
EIA-364-21 (1000 MΩ
minimum)
5,000 MΩ
Pass
Contact Resistance
(LLCR)
EIA-364-23
Δ 15 mΩ maximum
(Samtec defined)/ No damage
Pass
REQUIREMENT
STATUS
3.5 Mechanical:
ITEM
TEST CONDITION
Durability
EIA-364-09C
100 cycles (10µ" Au)
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Pass
Mechanical Shock
EIA-364-27 100 G, 6
milliseconds, sawtooth wave,
11.3 fps, 3 shocks/direction, 3
axis (18 total shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Pass
Normal Force
EIA-364-04
30 grams minimum for Gold
interface
Pass
Revision: A
Date: August 29, 2013
Page 2
© Samtec, Inc.
Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
3.6 Environmental:
ITEM
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 630 VAC
IR: >50,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C
Condition B for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 630 VAC
IR: >50,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 630 VAC
IR: >50,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
Revision: A
TEST CONDITION
Date: August 29, 2013
Page 3
© Samtec, Inc.
Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
4.0 MATED SYSTEM
5.0 POLARIZING FEATURES
Revision: A
Date: August 29, 2013
Page 4
© Samtec, Inc.
Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
6.0 HIGH SPEED PERFORMANCE
6.1 Based on a 3 dB insertion loss
6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair
7.0 PROCESSING RECOMMENDATIONS
7.1 Mating Alignment Requirements:
7.1.1
Revision: A
The parts can be rigidly misaligned by no more than 0,07 mm (.003”) in the X- and 0,14 mm (.006”) in the
Y-direction to ensure a good mate.
Date: August 29, 2013
Page 5
© Samtec, Inc.
Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
7.2 Mating Angle Requirements:
7.2.1
7.2.2
7.3 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum oven temperature of 260°C.
7.4 Stencil Thickness: The stencil thickness is .006” (0,15 mm).
7.5 Placement: Machine placement of the parts is strongly recommended.
7.6 Thermal Profile: Due to the large number of processing variables (printed wiring board design, reflow oven type,
component quantity, solder paste type, etc.), Samtec does not provide specific reflow profiles for any
connector. We recommend that the solder paste manufacturer’s guidelines be followed for optimum soldering
results.
7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through
Nitrogen gas infusion) in the reflow process to improve solderability.
Revision: A
Date: August 29, 2013
Page 6
© Samtec, Inc.
Product Specification
Series: MEC6 0,635mm (.025”) Mini Edge Card Connector, Vertical
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
Revision: A
Date: August 29, 2013
Page 7
© Samtec, Inc.