Characterization Details

High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height
Characterization Details
This report presents data which characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to
reveal typical best-case responses inherent to the system under test (SUT).
In this report, the SUT includes the test PCB from drive side probe tips to receive side
probe tips. PCB effects are not removed or de-embedded from test data. PCB designs
with impedance mismatch, large losses, skew, cross talk, or similar impairments can
have a significant impact on observed test data. Therefore, great design effort is put
forth to limit these effects in the PCB utilized in these tests. Some board related effects,
such as pad-to-ground capacitance and trace loss, are included in the data presented in
this report. But other effects, such as via coupling or stub resonance, are not evaluated
here. Such effects are addressed and characterized fully by the Samtec Final Inch®
products.
Additionally, intermediate test signal connections can mask the connectors’ true performance. Such connection effects are minimized by using high performance test cables, adapters, and microwave probes. Where appropriate, calibration and deembedding routines are also used to reduce residual effects.
Differential and Single-Ended Data
Most Samtec connectors can be used successfully in both differential and single-ended
applications. However, electrical performance will differ depending on the signal drive
type. In this report, data is presented for both differential and single-ended drive scenarios.
Connector Signal to Ground Ratio
Samtec connectors are most often designed for generic applications, and can be implemented using various signal and ground pin assignments. In high speed systems,
provisions must be made in the interconnect for signal return currents. Such paths are
often referred to as “ground”. In some connectors, a ground plane or blade, or an outer
shield is used as the signal return, while in others; connector pins are used as signal
returns. Various combinations of signal pins, ground blades, and shields can also be
utilized. Electrical performance can vary significantly depending upon the number and
location of ground pins.
In general, the more pins dedicated to ground, the better electrical performance will be.
But dedicating pins to ground reduces signal density of a connector. So care must be
taken when choosing signal/ground ratios in cost- or density-sensitive applications.
For this connector, the following array configurations are evaluated:
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:9
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height
open pin field
P#
grounded pin field
signal aggressor or signal victim pins
1
M
L
K
J
I
H
G
F
E
D
C
B
A
X
X
X
X
X
X
1
2
3
X
X
X
B2
X
2
X
D3
C3
X
X
3
SE4
SE2
4
X
X
X
X
X
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
X
X
X
X
X
12
13
14
X
X
X D14
X
X
B13 B14
X
X
13
14
SE3
15
X
X
X
X
X
15
M
L
K
J
I
H
G
F
E
D
C
B
A
SE 1
Single-Ended Impedance:
• Well-referenced line (reference SE1:1)
Single-Ended Crosstalk:
• Well-referenced line; mimics 1:1 S:G ratio (reference SE1:1)
• 2:1 S:G ratio (reference SE2:1)
Only one single-ended signal was driven for crosstalk measurements.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:10
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height
1
M
L
K
J
I
H
G
F
E
D
C
B
A
2
3
4
5
6
7
8
9
10
11
12
X
X
X
X
X
X
1
X
X
X E3
X D3
X C3
X B3
X
X
2
3
DP 2
X
X
X
X
X
X
4
5
6
7
8
9
10
11
12
1
2
4
5
6
7
8
9
10
11
12
3
M
L
K
J
I
H
G
F
E
D
C
B
A
1
2
3
4
5
X
X
X
X
X
X
X
6
X
X
F7 F8
E7 E8
X
X
C7 C8
B7 B8
X
X
7
8
DP3
X
X
X
X
X
X
X
9
13
14
X
X
X F14
X E14
X
X
X C14
X B14
X
X
13 14
DP 1
13
14
15
X
X
X
X
X
X
X
15
M
L
K
J
I
H
G
F
E
D
C
B
A
15
M
L
K
J
I
H
G
F
E
D
C
B
A
10
11
12
13
14
15
Differential Impedance:
• Well-referenced line (reference DP1)
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:11
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height
Differential Crosstalk:
• Well-referenced line; mimics 1:1 S:G ratio (reference DP1)
• Higher Signal Density (reference DP3)
• Full-Column Differential (reference DP2)
Only one differential pair was driven for crosstalk measurements.
In all cases where a center ground blade is present in the connector it is always
grounded to the PCB. Only one single-ended signal or differential pair was driven for
crosstalk measurements.
Other configurations can be evaluated upon request. Please contact [email protected]
for more information.
In a real system environment, active signals might be located at the outer edges of the
signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single
ended signals, might be encountered, as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary
slightly from laboratory results. But in most applications, performance can safely be considered equivalent.
Signal Edge Speed (Rise Time):
In pulse signaling applications, the perceived performance of the interconnect, can vary
significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 35 +/-5 ps. Generally, this should demonstrate worst case performance.
In many systems, the signal edge rate will be significantly slower at the connector than
at the driver launch point. To estimate interconnect performance at other edge rates,
data is provided for several rise times between 30 ps and 1.0 ns.
For this report, measured rise times were at 10%-90% signal levels.
Frequency Domain Data
Frequency domain parameters are helpful in evaluating the connector system’s signal
loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the frequency domain are insertion loss, return loss, and
near-end and far-end crosstalk. Other parameters or formats, such as VSWR or Sparameters, may be available upon request. Please contact our Signal Integrity Group
at [email protected] for more information.
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:12
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved
High Speed Characterization Report
Series: HDAM/HDAF Series (HDMezz)
Description: 1.2mm x 2mm grid interconnect system, high density array, 35mm Stack Height
Frequency performance characteristics for the SUT are generated from time domain
measurements using Fourier Transform calculations. Procedures and methods used in
generating the SUT’s frequency domain data are provided in the frequency domain test
procedures in Appendix E of this report.
Time Domain Data
Time Domain parameters indicate impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. Time Domain data is provided
in Appendix E of this report. Parameters or formats not included in this report may be
available upon request. Please contact our Signal Integrity Group at [email protected]
for more information.
Reference plane impedance is 50 ohms for single-ended measurements and 100 ohms
for differential measurements. The fastest risetime signal exciting the SUT is 35 ± 5
picoseconds.
In this report, propagation delay is defined as the signal propagation time through the
PCB connector pads and connector pair. It does not include PCB traces. Delay is
measured at 35 ± 5 picoseconds signal risetime. Delay is calculated as the difference
in time measured between the 50% amplitude levels of the input and output pulses.
Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage
to the coupled line voltage. The input line is sometimes described as the active or drive
line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio
is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT.
Data for other configurations may be available. Please contact our Signal Integrity
Group at [email protected] for further information.
As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for
determining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications,
please contact our Signal Integrity Group at [email protected]
Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal
Integrity Group at [email protected]
Samtec Inc.
520 Park East Blvd.
New Albany IN 47151-1147 USA
©Samtec, Inc. 2005
WWW.SAMTEC.COM
1-800-SAMTEC-9 (US & Canada)
[email protected]
Page:13
Phone: 812-944-6733
Fax: 812-948-5047
Report Revision: 6/4/2007
All Rights Reserved