High Speed Characterization Report QRM8-052-02.0-S-D-A QRF8-052-05.0-S-D-A Description: Q Rate® Slim Body Ground Plane Header Board-to-Board, 0.8mm (.0315”) Pitch, 7mm (.276”) Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved Table of Contents Connector Overview ........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Bandwidth Chart – Single-Ended & Differential Insertion Loss .................................... 3 Time Domain Data Summary .......................................................................................... 4 Characterization Details .................................................................................................. 6 Differential and Single-Ended Data.............................................................................. 6 Connector Signal to Ground Ratio ............................................................................... 6 Frequency Domain Data .............................................................................................. 8 Time Domain Data ....................................................................................................... 8 Appendix A – Frequency Domain Response Graphs .................................................... 10 Single-Ended Application – Insertion Loss ................................................................ 10 Single-Ended Application – Return Loss ................................................................... 10 Single-Ended Application – NEXT Configurations ..................................................... 11 Single-Ended Application – FEXT Configurations ..................................................... 11 Differential Application – Insertion Loss ..................................................................... 12 Differential Application – Return Loss ........................................................................ 12 Differential Application – NEXT Configurations ......................................................... 13 Differential Application – FEXT Configurations .......................................................... 13 Appendix B – Time Domain Response Graphs ............................................................. 14 Single-Ended Application – Input Pulse ..................................................................... 14 Single-Ended Application – Impedance ..................................................................... 14 Single-Ended Application – Propagation Delay ......................................................... 15 Single-Ended Application – NEXT, Worst Case Configuration, QRM8_35_QRM8_37 ................................................................................................ 15 Single-Ended Application – FEXT, Worst Case Configuration, QRM8_35_QRF8_37 ................................................................................................. 16 Single-Ended Application – NEXT, Best Case Configuration, QRM8_37_QRM8_41 ................................................................................................ 16 Single-Ended Application – FEXT, Best Case Configuration, QRM8_37_QRF8_41 ................................................................................................. 17 Single-Ended Application – NEXT, Across Row Configuration, QRM8_37_QRM8_38 ................................................................................................ 17 Single-Ended Application – FEXT, Across Row Configuration, QRM8_37_QRF8_38 ................................................................................................. 18 Differential Application – Input Pulse ......................................................................... 18 Differential Application – Impedance ......................................................................... 19 Differential Application – Propagation Delay .............................................................. 19 Differential Application – NEXT, Worst Case Configuration, QRM8_33,35_QRM8_37,39 ...................................................................................... 20 Differential Application – FEXT, Worst Case Configuration, QRM8_33,35_QRF8_37,39 ....................................................................................... 20 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – NEXT, Best Case Configuration, QRM8_35,37_QRM8_41,43 ...................................................................................... 21 Differential Application – FEXT, Best Case Configuration, QRM8_35,37_QRF8_41,43 ....................................................................................... 21 Differential Application – NEXT, Across Row Case Configuration, QRM8_35,37_QRM8_36,38 ...................................................................................... 22 Differential Application – FEXT, Across Row Case Configuration, QRM8_35,37_QRF8_36,38 ....................................................................................... 22 Appendix C – Product and Test System Descriptions ................................................... 23 Product Description ................................................................................................... 23 Test System Description ............................................................................................ 23 PCB-104078-SIG-XX Test Fixtures ........................................................................... 23 PCB-104078-SIG-XX PCB Layout Panel................................................................... 24 PCB Fixtures ............................................................................................................. 24 Appendix D – Test and Measurement Setup................................................................. 28 N5230C Measurement Setup .................................................................................... 28 Test Instruments ........................................................................................................ 28 Test Cables & Adapters ............................................................................................. 28 DSA8300 Measurement Setup .................................................................................. 29 Test Instruments ........................................................................................................ 29 Test Cables & Adapters ............................................................................................. 29 Appendix E - Frequency and Time Domain Measurements .......................................... 30 Frequency (S-Parameter) Domain Procedures ......................................................... 30 Time Domain Procedures .......................................................................................... 30 Propagation Delay (TDT) ....................................................................................... 30 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 31 Impedance (TDR)................................................................................................... 31 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Connector Overview Samtec’s QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector is designed for high-speed board-to-board applications where signal integrity is essential. The connectors have surface mount contacts as well as a surface mount ground plane between the two rows of signals for improved electrical performance. QRM8/QRF8 is a double row contacts system available with up to 156 I/Os in stack heights from 7mm (.276”) through 14mm (0.551”). The data in this report is applicable only to a 7mm stack height. Connector System Speed Rating QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector, Board-to-Board,0.8mm (.0315”) Pitch, 7mm (0.276”) Stack Height Signaling Speed Rating Single-Ended: 11 GHz/ 22Gbps Differential: 10.5 GHz/ 21Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded-up to the nearest half-GHz level. The up rounding corrects for a portion of the test board’s trace loss, since a short length of trace loss included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/ 15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Frequency Domain Data Summary Table 1 - Single-Ended Connector System Performance Test Parameter Configuration Driver Receiver Insertion Loss GSG QRM8_37 QRF8_37 3dB @ 10.7 GHz Return Loss GSG QRM8_37 QRM8_37 >10dB to 7.6 GHz GAQG QRM8_35 QRM8_37 < -20dB to 0.9 GHz GAGQG QRM8_37 QRM8_41 < -20dB to 14.9 GHz Xrow, GAG to GQG QRM8_37 QRM8_38 < -20dB to 15.3 GHz GAQG QRM8_35 QRF8_37 < -20dB to 10.2 GHz GAGQG QRM8_37 QRF8_41 < -20dB to 10.2 GHz Xrow, GAG to GQG QRM8_37 QRF8_38 < -20dB to 19.5 GHz Near-End Crosstalk Far-End Crosstalk Table 2 - Differential Connector System Performance Test Parame- Configuration Driver Receiver ter Insertion Loss GSSG QRM8_35,37 QRF8_35,37 3dB @ 10.5 GHz Return Loss GSSG QRM8_35,37 QRM8_35,37 >10dB to 7.8 GHz GAAQQG QRM8_33,35 QRM8_37,39 < -20dB to 13.1 GHz GAAGQQG QRM8_35,37 QRM8_41,43 < -20dB to 10.3 GHz Xrow, GAAG to GQQG QRM8 35,37 QRM8 36,38 < -20dB to 13.2 GHz GAAQQG QRM8_33,35 QRF8_37,39 < -20dB to 13.4 GHz GAAGQQG QRM8_35,37 QRF8_41,43 < -20dB to 10.3 GHz Xrow, GAAG to GQQG QRM8_35,37 QRF8_36,38 < -20dB to 20.0 GHz Near-End Crosstalk Far-End Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Bandwidth Chart – Single-Ended & Differential Insertion Loss QRM8/QRF8 Connector Series Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Time Domain Data Summary Table 3 - Single-Ended Impedance () Signal Risetime Maximum Impedance Minimum Impedance 30ps 50ps 100ps 250ps 500ps 57.7 55.6 52.6 50.9 50.5 46.8 47.7 49.1 50.1 50.2 Table 4 - Differential Impedance () Signal Risetime Maximum Impedance Minimum Impedance Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 30ps 50ps 100ps 250ps 500ps 101.5 101.4 101.4 99.0 98.5 78.0 80.9 83.6 90.6 95.1 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Table 5 - Single-Ended Crosstalk (%) Input(tr) NEXT FEXT Driver QRM8_35 QRM8_37 QRM8_37 QRM8_35 QRM8_37 QRM8_37 GAQG GAGQG Xrow GAQG GAGQG Xrow Receiver QRM8_37 QRM8_41 QRM8_38 QRF8_37 QRF8_41 QRF8_38 30ps 18.07 3.23 1.17 4.28 3.45 0.96 50ps 17.20 2.30 0.59 3.30 2.21 0.57 100ps 14.21 1.58 0.36 2.23 1.13 0.38 250ps 7.10 0.80 0.16 0.93 0.46 0.16 500ps 3.81 0.42 <0.1 0.53 0.21 <0.1 Table 6 - Differential Crosstalk (%) Input(tr) NEXT FEXT GAAQQG GAAGQQG Xrow GAAQQG GAAGQQG Xrow Driver QRM8_33,35 QRM8_35,37 QRM8_35,37 QRM8_33,35 QRM8_35,37 QRM8_35,37 Receiver QRM8_37,39 QRM8_41,43 QRM8_36,38 QRF8_37,39 QRF8_41,43 QRF8_36,38 30ps 5.90 1.85 1.90 5.18 1.90 1.45 50ps 5.13 1.43 1.34 4.57 1.29 1.00 100ps 4.36 1.06 0.86 3.84 0.88 0.74 250ps 2.42 0.57 0.43 2.09 0.48 0.43 500ps 1.45 0.33 0.27 1.12 0.26 0.23 Table 7 - Propagation Delay (Mated Connector) Single-Ended 52 ps Differential 54 ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connector’s true performance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differentially and single-ended driven scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications and can be implemented using various signal and ground pin assignments. In high speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. However, dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch For this connector, the following configurations were evaluated: Single-Ended Impedance: • GSG (Ground-Signal-Ground) Single-Ended Crosstalk: • Electrical “worst case”: GAQG (Ground-Active-Quiet-Ground) • Electrical “best case”: GAGQG (Ground-Active-Ground-Quiet-Ground) • Across row: “xrow case”: GAG to GQG (from one row of terminals to the other row) Differential Impedance: • GSSG (Ground-positive Signal-negative Signal-Ground) Differential Crosstalk: • Electrical “worst case”: GAAQQG (Ground-Active-Active-Quiet-Quiet-Ground) • Electrical “best case”: GAAGQQG (Ground-Active-Active-Ground-Quiet-QuietGround) • Across row: “xrow case”: GAAG to GQQG (from one row of terminals to the other row) Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. However, in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate worstcase performance. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30ps and 500ps. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network analyzer measurements. Time Domain Data Time Domain parameters indicate Impedance mismatch versus length, signal propagation time and crosstalk in a pulsed signal environment. Impedance mismatch versus length is measured by DSA8300 Digital Serial Analyzer. Board related effects, such as pad-to-ground capacitance and trace loss, are included in the data presented in this report. The impedance data is provided in Appendix E of this report. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response for signal propagation time and crosstalk. The Time Domain procedure is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the connector and connector footprint. It includes 10 mils of PCB trace on the both QRM8 and QRF8 connector side. Delay is measured at 30 picoseconds signal risetime. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. However, modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Single-Ended Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Single-Ended Application – NEXT Configurations Single-Ended Application – FEXT Configurations Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – Insertion Loss Differential Application – Return Loss Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – NEXT Configurations Differential Application – FEXT Configurations Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Single-Ended Application- Input Pulse Amplitude (millivolts) 300 250 30ps 200 50ps 150 100ps 100 250ps 50 500ps 0 4.25E-09 4.30E-09 4.35E-09 Time (nSec) 4.40E-09 Single-Ended Application – Impedance Single-Ended Application - Impedance Impedance (ohms) 70 65 30ps 60 50ps 55 100ps 50 250ps 45 500ps 40 4.76E-09 4.79E-09 4.82E-09 4.85E-09 Time (nSec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Single-Ended Application – Propagation Delay Single-Ended Application – NEXT, Worst Case Configuration,QRM8_35_QRM8_37 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Single-Ended Application – FEXT, Worst Case Configuration, QRM8_35_QRF8_37 Single-Ended Application – NEXT, Best Case Configuration, QRM8_37_QRM8_41 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Single-Ended Application – FEXT, Best Case Configuration, QRM8_37_QRF8_41 Single-Ended Application – NEXT, Across Row Configuration, QRM8_37_QRM8_38 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Single-Ended Application – FEXT, Across Row Configuration, QRM8_37_QRF8_38 Differential Application – Input Pulse Differential Application- Input Pulse Amplitude (millivolts) 300 200 30ps 100 50ps 0 100ps -100 250ps 500ps -200 -300 4.25E-09 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 4.30E-09 4.35E-09 Time (nSec) WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 4.40E-09 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – Impedance Differential Application - Impedance 110 Impedance (ohms) 105 100 30ps 95 50ps 90 100ps 85 250ps 80 500ps 75 4.8E-09 4.8E-09 4.8E-09 4.8E-09 4.9E-09 Time (nSec) Differential Application – Propagation Delay Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – NEXT, Worst Case Configuration, QRM8_33,35_QRM8_37,39 Differential Application – FEXT, Worst Case Configuration, QRM8_33,35_QRF8_37,39 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – NEXT, Best Case Configuration, QRM8_35,37_QRM8_41,43 Differential Application – FEXT, Best Case Configuration, QRM8_35,37_QRF8_41,43 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Differential Application – NEXT, Across Row Case Configuration, QRM8_35,37_QRM8_36,38 Differential Application – FEXT, Across Row Case Configuration, QRM8_35,37_QRF8_36,38 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Appendix C – Product and Test System Descriptions Product Description Product test samples are QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector. The part number is QRM8-052-02.0-S-D-A and it mates to QRF8-052-05.0-S-D-A. The connector has two rows of 26 contacts evenly spaced on a 0.8 mm (0.0315”) pitch. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the test cables to test fixtures. Optimization of the SMA launch was performed using full wave simulation tools to minimize reflections. Six test fixtures are specific to the QRM8/QRF8 series connector set and identified by part numbers PCB-104078-TST-01 through PCB104078-TST-06. Calibration standards specific to the QRM8/QRF8 series are located on the calibration boards PCB-104078-TST-99. To keep trace lengths short, three different test board sets were required to access the necessary signal pins. PCB-104078-SIG-XX Test Fixtures Shown below is a photograph of the one of the three test board sets. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch PCB-104078-SIG-XX PCB Layout Panel Artwork of the PCB design is shown below. PCB Fixtures The test fixtures used are as follows: PCB-104078-TST-01 – QRM8 Vertical, Single Ended Best Case and Across-row PCB-104078-TST-02 – QRF8 Vertical, Single Ended Best Case and Across-row PCB-104078-TST-03 – QRM8 Vertical, Differential Worst Case PCB-104078-TST-04 – QRF8 Vertical, Differential Worst Case PCB-104078-TST-05 – QRM8 Vertical, Single Ended Worst Case, Differential Best Case and Across-row PCB-104078-TST-06 – QRF8 Vertical, Single Ended Worst Case, Differential Best Case and Across-row PCB-104078-TST-99 – Calibration Board Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Calibration Board Test fixture losses and test point reflections were removed from the data by use of TRL calibration. The calibration board is shown below. Prior to making any measurements, the calibration board is characterized to obtain parameters required to define the calibration kit. Once a cal kit is defined, calibration using the standards on the calibration board can be performed. Finally, the device can be measured and the test board effects are automatically removed. Thru line – 2548.54 mils Open Reflect – 1274.27 mils Line 1 – 5833.66 mils Line 2 – 3205.56 mils Line 3 – 2679.94 mils Match – 1274.27 mils Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch All traces on the test boards are length matched to 1284.27 mils measured from the edge of the pad to the SMA. The TRL calibration effectively removes 1274.27 mils of test board trace effects. This means that 10 mils of test board trace length effects are included in the both sides of test boards in the measurement. The S-Parameter measurement includes: A- The QRM8/QRF8 Series connector set B- Test board vias, pads (footprint effects) C- 10 mils of 16 mil wide microstrip trace The figure below shows the location of the reference plane. Reference plane C B Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Appendix D – Test and Measurement Setup For frequency domain measurements, the test instrument is the Agilent N5230C PNA-L network analyzer. Frequency domain data and graphs are obtained directly from the instrument. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network analyzer is configured as follows: Start Frequency – 300 KHz Stop Frequency – 20 GHz Number of points -1601 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5230C Measurement Setup Test Instruments QTY Description 1 Agilent N5230C PNA-L Network Analyzer (300 KHz to 20 GHz) 1 Agilent N4433A ecal module (300 KHz to 20 GHz) Test Cables & Adapters QTY Description 4 Huber Suhner SF104PE11PC3511PC35, 457MM (18.0”), DC - 26.5 GHz Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch For impedance measurements, the test instrument is the Tektronix DSA8300 Digital Serial Analyzer mainframe and 80E04 sampling module. The impedance data and profiles are obtained directly from the instrument. The Digital Analyzer is configured as follows: Single-Ended Signal Vertical Scale: 5 ohm / Div Offset: Default / Scroll Horizontal Scale: 200ps/ Div Record Length: 4000 Averages: ≥ 16 DSA8300 Measurement Setup Test Instruments QTY Description 1 Tektronix DSA8300 Digital Serial Analyzer 2 Tektronix 80E04 Dual Channel 20 GHz TDR Sampling Module Test Cables & Adapters QTY Description 4 MegaPhase CM26-3131-12-M Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the through calibration standards, the SI test boards, and the selection of the PCB vendor. The measurement process begins with a measurement of the LRM calibration standards. A coaxial SOLT calibration is performed using an N4433A ecal module. This measurement is required in order to obtain precise values of the line standard offset delay and frequency bandwidths. Measurements of the reflect and 2x through line standard can be used to determine the maximum frequency for which the calibration standards are valid. For the QRM8/QRF8 Series test boards, this is greater than 20 GHz. From the LRM calibration standard measurements, a user defined calibration kit is developed and stored in the network analyzer. Calibration is then performed on all 4 ports following the calibration wizard within the Agilent N5230C. This calibration is saved and can be recalled at any time. Calibration takes roughly 30 minutes to perform. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain response. Perfect transformation requires Frequency Domain data from DC to infinity Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer. The Time Domain responses were generated using Agilent ADS 2009 update 1. This tool has a transient convolution simulator, which can generate a Time Domain response directly from measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation. http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf Propagation Delay (TDT) The Propagation Delay is a measure of the Time Domain delay through the connector and footprint. A step pulse is applied to the touchstone model of the connector and the transmitted voltage is monitored. The same pulse is also applied to a reference channel with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported as a percentage of the input pulse. Impedance (TDR) Measurements involving digital pulses are performed using either Time Domain Reflectometer (TDR) or Time Domain Transmission (TDT) methods. The TDR method is used for the impedance measurements in this report. The signal line(s) of the SUT’s is energized with a TDR pulse and the far-end of the energized signal line is terminated in the test systems characteristic impedance (e.g.; 50Ω or 100Ω terminations). By terminating the adjacent signal lines in the test systems characteristic impedance, the effects on the resultant impedance shape of the waveform is limited. The “best case” signal mapping was tested and is presented in this report. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved High Speed Characterization Report Series: QRM8/QRF8 Q Rate® Slim Body Ground Plane Connector Description: Board-to-Board, 7mm (.276”) Stack Height, 0.8mm (.0315”) Pitch Appendix F – Glossary of Terms ADS – Advanced Design Systems BC – Best Case crosstalk configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms FD – Frequency domain FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration HDV – High Density Vertical NEXT – Near-End Crosstalk OV – Optimal Vertical OH – Optimal Horizontal PCB – Printed Circuit Board PPO – Pin Population Option SE – Single-Ended SI – Signal Integrity SUT – System Under Test S – Static (independent of PCB ground) SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards TD – Time Domain TDA – Time Domain Analysis TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 9/2/2014 All Rights Reserved