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Wire-wound Type Power Inductor
SCWL252012 Series
Features
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High saturation current realized by material properties
and structure design
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Low DC resistance to achieve high conversion efficiency
and low temperature rising
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Low profile: 2.5mm×2.0mm×1.2mm
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Magnetically
shielded structure to accomplish high
resolution in EMC protection
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Halogen free, Lead free, RoHS compliance
Applications
SCWL series is generic applied in portable DC to DC converter
line.
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Smart Phone, PAD
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DC/DC converter
u
Thin-type power supply module
General Technical Data
Operating Temperature Range
-40 ~ +125ºC
Storage Temperature Range
-50 ~ +125ºC
Taping package
Storage condition
Storage Temperature
5 ~ 40ºC
Relative Humidity
< 65%
Storage Time
12 Months max
Part Numbering
SCWL
2520
12
R47
M
T
F
(1)
(2)
(3)
(4)
(5) (6) (7)
1
Series Name, wire-wound type power inductor
2
Size Code: the first two digitals : length(mm), the last two digitals : width(mm)
3
Thickness (mm)
4
Inductance (μH), eg. 2R2=2.2μH；R47=0.47μH
5
Inductance tolerance, M: ±20%
6
Packaging: T - Embossed plastic tape, 7" reel.
7
Soldering : Green Parts, F - Lead-Free for whole chip
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
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@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL252012 Series
Electrical Characteristics
DC Resistance
RDC (mΩ)
Initial Inductance
Li (μH) @1mA
Part Number
Saturation Current
Isat (A)
Heat Rating Current
Irms (A)
Typical
Maximum
Typical
Maximum
Typical
Maximum
SCWL252012R47MTF
0.47
22
28
6
5.5
4.5
4.0
SCWL252012R68MTF
0.68
30
38
5.5
5
4.3
3.9
SCWL2520121R0MTF
1.0
44
54
4.5
4
3.1
2.7
SCWL2520122R2MTF
2.2
85
102
3
2.7
2.3
2.0
Note:
1. All test data is referenced to 26 ºC ambient.
2. Inductance is measured by LCR meter, Test frequency at 1MHz
3. Inductance Tolerance: ±20%.
4. DC resistance is measured by micro-ohm meter.
5. Isat means that DC current will cause a 30% inductance reduction form initial value.
6. Irms means that DC current will cause coil temperature rising to 40 ºC whichever is smaller.
Current Characteristics
80
Inductance (μH)
0.2
Temp. Rising (ºC)
60
40
0.1
20
0
0
0
1
2
3
4
5
6
80
0.5
Temp. Rising (ºC)
20
0
0.5 1
1.5
2
DC Bias (A)
SCWL2520121R0MTF
60
40
0.3
20
Inductance (μH)
Inductance (μH)
Temp. Rising (ºC)
Temp. Rising (ºC)
Inductance (μH)
80
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
4 4.5
5
5.5
6 6.5
0
7
2.5
100
2.0
80
1.5
1.0
Inductance (μH)
60
Temp. Rising (ºC)
40
20
0.5
0
5
DC Bias (A)
0
0.5
1
1.5
2
2.5
3
3.5
0
4
DC Bias (A)
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
3.5
SCWL2520122R2MTF
100
0.9
0
2.5 3
DC Bias (A)
1.2
0.6
40
0.3
0.1
7
60
Inductance (μH)
Temp. Rising (ºC)
0.3
100
Temp. Rising (ºC)
0.4
SCWL252012R68MTF
0.7
Inductance (μH)
100
Temp. Rising (ºC)
Inductance (μH)
SCWL252012R47MTF
0.5
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@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL252012 Series
Soldering Parameters
Reflow Condition
TP
Ramp-up
Critical Zone
TL to TP
Pb free assembly
-Temperature Min (Ts(min))
+150°C
-Temperature Max (Ts(max))
+200°C
-Time (min to max) (TS)
60 -180 Seconds
TL
Pre Heat
Temperature
TS(max)
Ramp-down
TS(min)
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/Second Max
TS(max) to TL - Ramp-up Rate
3°C/Second Max
Preheat
25
Time to peak temperature
(t 25℃ to peak)
Time
- Temperature (TL) (Liquidus)
+217°C
- Time (min to max) (TL)
60 -150 Seconds
Reflow
Precaution for Soldering
Note that this product will be easily damaged by rapid heating,
rapid cooling or local heating.
Do not give heat shock over 100°C in the process of soldering.
We recommend to take preheating and gradual cooling
Soldering gun procedure
Note the follows, in case of using solder gun for replacement.
1) The tip temperature must be less than 280 for the period
within 3 seconds by using soldering gun under 30W
2) The soldering gun tip shall not touch this product directly.
Peak Temperature (TP)
260 +0/-5°C
Time within 5°C of actual peak
Temperature (TP)
20-40 Seconds
Ramp-down Rate
6°C/Second Max
Time 25°C to peak Temperature (TP)
8 minutes Max
Construction & Dimensions
Core Material: Iron
End termination: Ni / Sn
Soldering volume
Note that excess of soldering volume will easily get crack the
body of this product.
L
Precaution for Handling of Substrate
W
Do not exceed to bend the board after soldering this product
extremely. (reference examples)
T
l Mounting place must be as far as possible from the
position, which is close to the break line of board, or on the
line of large holes of board.
l Do not bend extremely the board, in mounting another
component. If necessary, use back-up pin (support pin) to
prevent from bending extremely.
l Do not break the board by hand. We recommend to use
the machine or the jig to break it.
E
E
Unit: mm
L
W
T
E
2.5±0.2
2.0±0.2
1.2 Max
0.6±0.2
Recommended Pad Layout
Unit: mm
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
A
B
C
1.2
2.8
2.0
www.socay.com
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@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL252012 Series
Tape Specifications
Direction of Feed
Symbol
252012
W
8.00±0.3
E
1.75±0.10
F
3.50±0.05
D
1.55±0.05
P
4.00±0.10
P0
4.00±0.10
P2
2.00±0.05
A0
2.50±0.10
B0
3.00±0.10
K0
1.60±0.10
t
0.25±0.05
Reel Specifications & Packaging
Unit: mm
Part Size
(EIA Size)
Packaging Option
Quantity
2520
(1008)
7″Reel
3,000
The Contents of a box：
252010(1008): 6 reels / inner box
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
www.socay.com
4/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL252012 Series
Reliability and Test Condition
Test Item
Test Condition
Criteria
1.
Resistance to Solder Heat
1.
2.
3.
Solder temperature : 260±5℃
Flux : Rosin
DIP time : 10±1 sec
1.
Reflow temperature : 245℃ It shall be
Soldered on the substrate applying
direction parallel to the substrate
Apply force(F) : 5 N
Test time : 10 sec
Adhesive Test
2.
3.
1.
Temperature Cycle
Dry Heat Test
Humidity Test
2.
3.
Temperature : -50 ~ +125℃ for 30
minutes each
Cycle : 500 cycles
Measurement : At ambient temperature
24 hours after test completion
1.
2.
3.
4.
Temperature : 85℃±5℃
Test time : 500 hours
Apply current : full rated current
Measurement : At ambient temperature
24 hours after test completion
1.
2.
3.
4.
5.
Temperature : 60℃±2℃
Humidity : 90 ~ 95 % RH
Apply current : full rated current
Test time : 500 hours
Measurement : At ambient temperature
24 hours after test completion
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
2.
3.
More than 95 % of terminal electrode
should be covered with new solder
No mechanical damage
Induction value should be within ±20 %
of the initial value
1.
2.
No mechanical damage
Soldering the products on PCB after the
pulling test force > 5 N
1.
2.
No mechanical damage
Induction value should be within
of the initial value
±20 %
1.
2.
No mechanical damage
Induction value should be within
of the initial value
±20 %
1.
2.
No mechanical damage
Induction value should be within
of the initial value
±20 %
www.socay.com
5/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.