Surface Mount Polymer ESD Suppressors ESD0201E002N05 Description This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low capacitance and fast turn on times makes it ideal for data and transmission lines with high data rates. According to the special property of device, we recommend not to use on such application as DC/AC power line. Features u u u u u u u Protection against ESD voltages and currents (IEC 61000-4-2 Level 4) Extremely quick response time (<1 ns) present ideal ESD protection Extremely low capacitance (0.2pF typical) Extremely low leakage current Bi-directional device Surface mount device Zero signal distortion Equivalent Circuits Product Model Applications u u u u ESD0201E002N05 is applied to high speed signal interface u Antenna circuit u USB2.0 / USB3.0 u IEEE-1394 u DVI u HDMI Digital Video Equipment Mobil Phone GPS Antenna Bluetooth Communication Equipment Electrical Characteristics Symbol Unit VDC V Leakage current IL μA 0.01 Trigger Voltage VT V 250 Rated Voltage Min Typical 5 Clamping Voltage VC V 30 Capacitance, @1MHz CP pF 0.2 Response time ns ESD Voltage Capability, Contact Discharge Mode KV 8 ESD Voltage Capability, Air Discharge Mode KV 15 Pulses 1000 ESD Pulse Withstand Max. 0.5 1 VT - Measurement by using Transmission Line Pulse (TLP) VC - Measurement by using Transmission Line Pulse (TLP) CP - Device Capacitance measured with 1Vrms SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 1/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Surface Mount Polymer ESD Suppressors ESD0201E002N05 Explanation of Part Number ESD (1) 0201 (2) E (3) 002 (4) (1) Series Type: ESD Guard TM N 00 (5) (6) Series (2) Chip Size (EIA): 0201 (3) Series Type: EMI / ESD Protection (4) Capacitance: Value - Exxx, E002=0.2pF (5) Capacitance Tolerance: N - ±30%, M - ±20% (6) Rated Voltage, VDC Construction & Dimensions Unit: mm Substrate Ceramic (Alumina) Encapsulate End termination Symbol Spec. Polymer L 0.63±0.05 Ag / Ni / Sn W 0.30±0.03 H 0.23±0.05 B 0.165±0.05 A 0.35±0.05 C 0.35±0.05 D 0.35±0.05 Recommended pad outline SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 2/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Surface Mount Polymer ESD Suppressors ESD0201E002N05 Temperature Specifications Parameter Value Unit Operating Temperature -55 to +125 °C Storage Temperature --55 to +125 °C 5 to 40 °C <65 %RH 12 Max Month Taping Package Storage Condition Storage Temperature Relative Humidity Storage Time Soldering Parameters Reflow Condition TP Critical Zone TL to TP Ramp-up Pb free assembly -Temperature Min (Ts(min)) +150°C -Temperature Max (Ts(max)) +200°C -Time (min to max) (TS) 60 -180 Seconds TL Temperature TS(max) Pre Heat Ramp-down TS(min) Average ramp up rate ( Liquidus Temp TL) to peak 3°C/Second Max TS(max) to TL - Ramp-up Rate 3°C/Second Max Preheat 25 Time to peak temperature (t 25℃ to peak) Time - Temperature (TL) (Liquidus) +217°C - Time (min to max) (TL) 60 -150 Seconds Reflow Precaution for soldering Precaution for soldering Note that this product will be easily damaged by rapid heating, Peak Temperature (TP) 260 +0/-5°C rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. Time within 5°C of actual peak Temperature (TP) 20-40 Seconds We recommend to take preheating and gradual cooling Ramp-down Rate 6°C/Second Max Time 25°C to peak Temperature (TP) 8 minutes Max Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 3/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Surface Mount Polymer ESD Suppressors ESD0201E002N05 Packaging Information Carrier Tape Dimensions Unit: mm Packaging method - Products shall be heat-sealed in the chip pocket, spacing Symbol Spec. A 8.00±0.30 B 3.50±0.05 C 1.75±0.10 D 2.00±0.05 E 4.00±0.10 F 1.50±0.10 L 0.71±0.02 W 0.39±0.03 T 0.42±0.03 pitch 2-mm of paper carrier tape with cover tape, and carrier tape shall be reeled to the reel. - Tape material to be paper. - Cover Tape adhesion to be 40±15 grams. Taping Reel Dimensions Unit: mm Taping Specifications There Shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. Quantity of products in the taping package Standard Quantity 15,000PCS / Reel Shipping quantity is a multiple of standard quantity SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 4/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information.