Multilayer Chip Inductor SCML Series Features u Multilayer monolithic construction yields high reliability u Excellent solderability and heat resistance for either wave or reflow soldering. Applications u RF and wireless communication u Information technology equipment which includes computer u Telecommunications u Radar detectors u Automotive etc. General Technical Data Operating temperature range -40 ~ +85ºC Storage Condition Less than 40ºC and 70% RH Storage Time 12 months Max. Soldering method Reflow or Wave Soldering Part Numbering SCML 2520 4R7 (1) (2) (3) M T F (4) (5) (6) 1 Series Name 2 Size Code: the first two digitals: length(mm), the last two digitals : width(mm) 3 Inductance (R=Decimal Point) 4 Tolerance: M = ±20% 5 Packaging: T - Embossed plastic tape, 7" reel. 6 Soldering : Green Parts, F - Lead-Free for whole chip Unit: μH SOCAY Electronics Co., Ltd. Revision February 12, 2014 www.socay.com 1/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Multilayer Chip Inductor SCML Series Electrical Characteristics (Continue) Inductance ±10% (μH) Test Freq. (MHz) S.R.F (MHz) Min DCR (Ω) Max Rated Current (mA) SCML2012 2R2MTF 2.2 1 70 0.17 900 SCML2012 4R7MTF 4.7 1 40 0.23 700 SCML2016 2R2MTF 2.2 1 40 0.12 1100 SCML2016 4R7MTF 4.7 1 20 0.16 900 SCML2520 1R0MTF 1.0 1 60 0.055 1600 SCML2520 1R5MTF 1.5 1 50 0.070 1500 SCML2520 2R2MTF 2.2 1 40 0.080 1300 SCML2520 3R3MTF 3.3 1 30 0.100 1200 SCML2520 4R7MTF 4.7 1 25 0.110 1100 Part Number 2012 Series 2016 Series 2520 Series TEST LEVEL：100 mV Test Instruments u HP4291B u HP4338A/B MILLIOHMMETER RF IMPEDANCE / MATERIAL ANALYZER @1MHz * For special part number which is not shown in above table, please refer to the appendix. SOCAY Electronics Co., Ltd. Revision February 12, 2014 www.socay.com 2/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Multilayer Chip Inductor SCML Series Recommended Soldering Conditions 20 Pre-heating Soldering 60~120 Second ≥30 Second Temperature (ºC) 260 217 200 150 25 Time (sec.) 60~150 Second For lead free solder Construction & Dimensions Unit: mm Dimension 2012 (EIA 0805) 2016 (EIA 0806) 2520 (EIA 1008) L 2.00±0.20 2.00±0.20 2.50±0.20 W 1.25±0.20 1.60±0.20 2.00±0.20 T 0.90±0.10 0.90±0.10 0.90±0.10 E 0.50±0.30 0.50±0.30 0.50±0.30 Size A B C 2012 1.0~1.2 3.0~4.0 0.8~1.1 2016 1.0~1.2 3.0~4.0 1.0~1.5 2520 1.2~1.5 3.5~4.0 1.5~2.0 L W T E E Recommended Pad Layout Unit: mm SOCAY Electronics Co., Ltd. Revision February 12, 2014 www.socay.com 3/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Multilayer Chip Inductor SCML Series Tape and Reel Specifications PLASTIC CARRIER Direction of Feed Unit: mm 2012 2016 2520 E E E W 8.00±0.10 8.00±0.10 8.00±0.10 P 4.00±0.10 4.00±0.10 4.00±0.10 E 1.75±0.10 1.75±0.10 1.75±0.10 F 3.50±0.05 3.50±0.10 3.50±0.05 D 1.55±0.05 1.55±0.05 1.55±0.05 D1 1.00±0.05 1.00±0.05 1.00±0.05 Symbol P 4.00±0.10 4.00±0.10 4.00±0.10 P010 40.00±0.20 40.00±0.20 40.00±0.20 P2 2.00±0.10 2.00±0.10 2.00±0.10 A0 1.40±0.10 1.80±0.10 2.25±0.10 B0 2.30±0.10 2.20±0.10 2.80±0.10 K0(T) 1.35±0.10 1.15±0.10 1.35±0.10 t 0.22±0.05 0.22±0.05 0.22±0.05 Reel Specifications & Packaging Unit: mm Part Size (EIA Size) Packaging Option Quantity 2012 (0805) 7″Reel 3,000 2016 (0806) 7″Reel 3,000 2520 (1008) 7″Reel 3,000 The Contents of a box： 2012 (0805): 6 reels / inner box 2016 (0806): 6 reels / inner box 2520 (1008): 6 reels / inner box SOCAY Electronics Co., Ltd. Revision February 12, 2014 www.socay.com 4/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Multilayer Chip Inductor SCML Series Reliability and Test Condition Test item Test condition Criteria 1. Resistance to Solder Heat More than 95 % of terminal electrode should be covered with new solder 1. Solder temperature : 260±5ºC 2. Flux : Rosin 2. No mechanical damage 3. DIP time : 10±1 sec 3. Induction value should be within 1. Reflow temperature : 245ºC It shall be ±10 % of the initial value Soldered Adhesive Test Steam Aging Test Temperature Cycle on the substrate applying direction parallel to the substrate 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. Temperature : 93ºC 2. Test time : 8 hours 3. Solder temperature : 235±5ºC 4. Flux : Rosin 5. DIP time : 5±1 sec 1. Temperature : -40 ~ +85ºC for 30 minutes 1. No mechanical damage 2. Soldering the products on PCB after the pulling test force > 5 N 1. More than 95 % of terminal electrode should be covered with new solder each 1. No mechanical damage 2. Cycle : 100 cycles 2. Induction value should be within 3. Measurement : At ambient temperature 1. Temperature : 85ºC±5ºC 2. Test time : 1000 hours 1. No mechanical damage 3. Apply current : full rated current 2. Induction value should be within 4. Measurement : At ambient temperature ±20 % of the initial value 24 hours after test completion Operational Life ±10 % of the initial value 24 hours after test completion Biased Humidity 1. Temperature : 40ºC±2ºC 2. Humidity : 90 ~ 95 % RH 3. Apply current : full rated current 4. Test time : 1000 hours 5. Measurement : At ambient temperature 1. No mechanical damage 2. Induction value should be within ±20 % of the initial value 24 hours after test completion At ambient temperature & humidity Rated Current Test time: 5 minutes surface temp: below room temperature plus 40ºC (under full rated current) SOCAY Electronics Co., Ltd. Revision February 12, 2014 MIP product www.socay.com 5/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information.