Transient Voltage Suppressors for ESD Protection ESD52DE150M05-C Description SOD-523 The ESD52DE150M05-C is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Feature Functional Diagram u Small body outline dimensions u Low body height u Peak power up to 150 Watts @ 8 x 20μsPulse u Low Leakage current u Response time is typically < 1 ns u ESD Rating of Class 3 (> 16 kV) per Human Body Model u IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) u IEC61000-4-4 (EFT) 40A (5/50ns) Applications u Cellular phones u Portable devices u Digital cameras u Power supplies Mechanical Characteristics u SOD-523 Package u Molding Compound Flammability Rating : UL 94V-0 u Weight 2 Milligrams (Approximate) u Quantity Per Reel : 3,000pcs u Reel Size : 7 inch u Lead Finish : Lead Free Mechanical Characteristics Symbol Parameter Value Units 150 W PPP Peak Pulse Power (tp=8/20μs waveform) TL Lead Soldering Temperature 260 (10sec) ºC TSTG Storage Temperature Range -55 to +150 ºC TOP Operating Temperature Range -40 to +125 ºC TJ Maximum Junction Temperature 150 ºC IEC61000-4-2 (ESD) Air Discharge ±15 Contact Discharge ±8 IEC61000-4-4 (EFT) ESD Voltage Per Human Body Model SOCAY Electronics Co., Ltd. Revision March 7, 2014 KV 40 A 16 KV www.socay.com 1/3 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Transient Voltage Suppressors for ESD Protection ESD52DE150M05-C I-V Curve Characteristics Symbol Parameter Bi-directional IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage VRWM I IPP @ IPP Working Peak Reverse Voltage IR Maximum Reverse leakage Current IT Test Current VB Breakdown Voltage VC @ VRWM IT VB VRWM R V IR IR IT VRWM VB VC @ IT IPP Electrical Characteristics (Ratings at 25°C ambient temperature unless otherwise specified) Device Marking Part Number ESD52DE150M05-C VB @IT (V) VRWM (V) (Max.) C 5.0 Min. Max. 5.6 7.8 IT (mA) VC * @IPP=5A (V) (Typ.) VC * @Max IPP (V) (Max.) IPP (A) (Max.) PPK * (W) (Max.) IR (μA) (Max.) C (pF) (Typ.) 1.0 11.6 18.6 9.4 174 1.0 15 * *Surge current waveform per Fig1. 1. VB is measured with a pluse test current IT at an ambient temperature of 25℃． Characteristic Curves Fig1. 8/20μs Pulse Waveform Fig2. ESD Pulse Waveform (according to IEC 61000-4-2) tr 100 Peak Value IPP 80 100% TEST WAVEFORM PARAMETERS tr=8μs td=20μs Percent of Peak Pulse Current % IPP - Peak Pulse Current - % of IPP 120 60 40 td=t IPP/2 20 0 0 5 10 15 20 25 10% tr = 0.7~1ns Time (ns) 30ns 30 60ns t - Time (μs) SOCAY Electronics Co., Ltd. Revision March 7, 2014 90% www.socay.com 2/3 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Transient Voltage Suppressors for ESD Protection ESD52DE150M05-C Fig3. Power Derating % of Rated Power 220 200 Peak Pulse Power 8/20μs 180 160 140 120 100 80 60 40 20 0 Average Power 0 25 50 75 100 125 150 Lead Temperature – TL (ºC) Application Note Electrostatic discharge (ESD) is a major cause of failure in electronic systems. Transient Voltage Suppressors (TVS) are an ideal choice for ESD protection. They are capable of clamping the incoming transient to a low enough level such that damage to the protected semiconductor is prevented. Surface mount TVS offers the best choice for minimal lead inductance. They serve as parallel protection elements, connected between the signal lines to ground. As the transient rises above the operating voltage of the device, the TVS becomes a low impedance path diverting the transient current to ground. The ESD52DE150M05-C is the ideal board evel protection of ESD sensitive semiconductor components. The tiny SOD-523 package allows design flexibility in the design of high density boards where the space saving is at a premium. This enables to shorten the routing and contributes to hardening against ESD. SOD-523 Package Outline & Dimensions Millimeters Symbol Soldering Footprint Min. Nom. Max. Min. Nom. Max. A 1.10 1.20 1.30 0.043 0.047 0.051 B 0.70 0.80 0.90 0.028 0.032 0.035 C 0.50 0.60 0.70 0.020 0.024 0.028 D 0.25 0.30 0.35 0.010 0.012 0.014 J 0.07 0.14 0.20 0.0028 0.0055 0.0079 K 0.15 0.20 0.25 0.006 0.008 0.010 L 1.50 1.60 1.70 0.059 0.063 0.067 Symbol Millimeters Inches E 1.40 0.0547 F 0.40 0.0157 G 0.40 0.0157 SOCAY Electronics Co., Ltd. Revision March 7, 2014 Inches www.socay.com 3/3 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information.