MASW2040
GaAs DPDT Switch
DC - 2.0 GHz
Rev. V3
Features
Cascadable
Low Insertion Loss
Low DC Power Consumption
Low Distortion Operation (Quiet Mode)
Useful as a Building Block for
-Digital Attenuators
-Digital Delay Lines
-Digital Phase Shifters
-Digital Switched Filter Elements
Pad Layout
RFA1
RFA2
RFB1
RFB2
Description
M/A-COM’s MASW2040 is a GaAs MMIC DPDT
switch die. The MASW2040 is ideally suited for use
where low power consumption is required.
Typical applications include transmit/receive
switching, switch matrices, and switched filter banks
in systems such as radio and cellular equipment,
PCM, GPS, fiber optic modules, and other battery
powered radio equipment.
Die Size—Inches (mm)
Ordering Information
Bond Pad Dimensions
0.043 x 0.037 x 0.010 (1.10 x 0.94 x 0.25)
Part Number
Package
Bond Pad
Dimensions - Inches (mm)
MASW2040
DIE
RF1, RF2
0.004 x 0.007 (0.102 x0.182)
RFA1, RFB1
0.005 x 0.004 (0.133 x 0.100)
RFA2, RFB2
0.005 x 0.004 (0.133 x 0.100)
A, B, Ac, Bc
0.004 x 0.004 (0.100 x 0.100)
Absolute Maximum Rating 1,2
Parameter
Absolute Maximum
Control Value (A or B)
-8.5 Vdc
Max Input RF Power
+34 dBm
Storage Temperature
-65°C to +175°C
Max Operating Temperature
+175°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM does not recommend sustained operation near
these survivability limits.
Schematic
RFA1
A
RFA2
RF1
RF2
RFB1
B
RFB2
1
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Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW2040
GaAs DPDT Switch
DC - 2.0 GHz
Rev. V3
Electrical Specifications: 0 / -5 Vdc, -55°C to +85°C
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Insertion Loss
DC - 0.5 GHz
DC - 1.0 GHz
DC - 2.0 GHz
dB
dB
dB
—
—
—
—
—
—
0.4
0.4
0.6
Isolation
DC - 0.5 GHz
DC - 1.0 GHz
DC - 2.0 GHz
dB
dB
dB
25
20
15
—
—
—
—
—
—
VSWR
DC - 0.5 GHz
DC - 1.0 GHz
DC - 2.0 GHz
Ratio
Ratio
Ratio
—
—
—
—
—
—
1.1:1
1.2:1
1.2:1
Input P-1dB
0.05 GHz (0 / -5 V, 0 / -8V)
0.5 - 2.0 GHz (0 / -5 V, 0 / -8V)
dBm
dBm
—
—
+24, +25
+30, +33
—
—
IP2
Two Tone Input Power up to +5 dBm
0.05 GHz
0.5 - 2.0 GHz
dBm
dBm
—
—
+62
+68
—
—
IP3
Two Tone Input Power up to +5 dBm
0.05 GHz
0.5 - 2.0 GHz
dBm
dBm
—
—
+39
+46
—
—
Control Current
VIN Low (0 to -0.2 V)
VIN High (-5 V @ 25 µA Typ to -8 V)
µA
µA
—
—
—
—
9
75
T-rise, T-fall
10% to 90% RF and 90% to 10% RF
ns
—
3
—
TON, TOFF
50% control to 90% RF, and 50% control to 90% RF
ns
—
6
—
Transients
In Band
mV
—
20
—
Truth Table 3
Control
Inputs
Handling Procedures
Please observe the following precautions to avoid
damage:
Condition of Switch
A
B
RF1RFA1
RF1RFB1
RF2RFA2
RF2RFB2
1
0
Off
On
Off
On
0
1
On
Off
On
Off
3. 0 = 0 to –0.2 V, 1 = -5 V.
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW2040
GaAs DPDT Switch
DC - 2.0 GHz
Rev. V3
Typical Performance @ 25°C
VSWR vs. Frequency
Insertion Loss vs. Frequency
1.0
1.5
1.4
0.75
1.3
0.50
1.2
0.25
1.1
0.0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
1.0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
Isolation vs. Frequency
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW2040
GaAs DPDT Switch
DC - 2.0 GHz
Rev. V3
Handling Precautions
Wire Bonding
Permanent damage to the MASW2040 may occur
if the following precautions are not adhered to:
A. Cleanliness - The MASW2040 should be
handled in a clean environment. DO NOT
attempt to clean unit after the MASW2040 is
installed.
B. Static Sensitivity - All chip handling equipment
and personnel should be DC grounded.
C. Transient - Avoid instrument and power supply
transients while bias is applied to the
MASW2040. Use shielded signal and bias
cables to minimize inductive pick-up.
D. Bias - Apply Voltage to either control port A or
B only when the other is grounded. Neither
port should be allowed to ―float.‖
E. General Handling - It is recommended that the
MASW2040 chip be handled along the long
side of the die with a sharp pair of bent
tweezers. DO NOT touch the surface of the
chip with fingers or tweezers.
A. Ball or wedge with 1.0 mil diameter pure gold
wire. Thermosonic wirebonding with a nominal
stage temperature of 150°C and a ball bonding
force of 40 to 50 grams or wedge bonding force
o1 18 to 22 grams is recommended. Ultrasonic
energy and time should be adjusted to the
minimum levels achieve reliable wirebonds.
B. Wirebonds should be started on the chip and
terminated on the package.
GND bonds
should be as short as possible; at least three
and no more than four bond wires from ground
pads to package are recommended.
Mounting
The MASW2040 is back-metallized with Pd/Ni/Au
(100/1,000/10,000Å) metallization. It can be diemounted with AuSn eutectic performs or with
thermally conductive epoxy. The package surface
should be clean and flat before attachment.
Eutectic Die Attach:
A. A 80/20 gold/tin preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
not 90/10 nitrogen/hydrogen gas is applied,
tool tip temperature should be approximately
290°C.
B. DO NOT expose the MASW2040 to a
temperature greater than 320°C for more than
20 seconds. No more than 3 seconds for
scrubbing should be required for attachment.
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place
the MASW2040 into position. A thin epoxy fillet
should be visible around the perimeter of the
chip.
B. Cure epoxy per manufacturer’s recommended
schedule.
C. Electrically conductive epoxy may be used by
is not required.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW2040
GaAs DPDT Switch
DC - 2.0 GHz
Rev. V3
M/A-COM Technology Solutions Inc. All rights reserved.
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specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
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5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support