MAAM2800
Wide Band GaAs MMIC Amplifier
2.0 - 8.0 GHz
Features
Rev. V6
Die
18 dB Typical Gain
± 0.5 dB Typical Broadband Gain Flatness
Single Bias Supply: +10 V
DC Decoupled RF Input and Output
Description
The MAAM28000 is a wide band, MMIC
amplifier. It includes two distributed gain stages to
obtain flat gain and a good, 50-ohm input and output
impedance match over a very wide bandwidth. The
MAAM28000 operates from a single +10 V supply.
The MAAM28000 performs well as a generic IF,
driver or buffer amplifier where high gain, excellent
linearity and low power consumption are important.
Because of its wide bandwidth, the MAAM28000 can
be used in numerous commercial and government
system applications, such as satellite
communications, RLL, EW and radar.
The MAAM28000 is manufactured in-house
using a reliable, 0.5-micron, GaAs MESFET
process. This product is 100% RF tested to ensure
compliance to performance specifications.
Schematic
S1a
S1b
VDD
Ordering Information
Part Number
Package
MAAM28000
Die
RF IN
RF OUT
Absolute Maximum Ratings 1
Parameter
Absolute Maximum
Voltage
+14 V
Input Power
+20 dBm
Operating Temperature
-55°C to +125°C
Storage Temperature
-65°C to +150°C
S2a
S2b
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
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MAAM2800
Wide Band GaAs MMIC Amplifier
2.0 - 8.0 GHz
Rev. V6
Electrical Specifications:
TA = 25°C, Z0 = 50 Ω VDD = +10 VDC, IDD = 60 mA Typ., 100 mA Max.
Parameter
Test Conditions
Units
Min.
Typ.
Max.
—
dB
16.0
18.0
—
Gain Flatness
—
dB
Noise Figure 2
2.0 - 4.0 GHz
4.0 - 6.0 GHz
6.0 - 8.0 GHz
dB
dB
dB
—
—
—
6.0
4.5
4.0
7.5
6.0
5.5
Input VSWR
Output VSWR
—
Ratio
Ratio
—
—
1.7:1
1.3:1
—
—
Output Power at 1 dB Gain Compression
—
dBm
—
14
—
Third Order Intercept
—
dBm
—
24
—
Reverse Isolation
—
dB
—
40
—
Impedance
—
Ω
—
50
—
Gain
2
± 0.5
2. 100% on-wafer tested.
Typical Performance Curves
Gain
Noise Figure
20
8
+25ºC
-55ºC
+85ºC
7
18
6
16
5
14
+25ºC
-55ºC
+85ºC
4
12
3
10
2
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
VSWR
3.0
2.5
2.0
S11
S22
1.5
1.0
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM2800
Wide Band GaAs MMIC Amplifier
2.0 - 8.0 GHz
Typical Bias Configuration 3,4
Rev. V6
Outline Drawing
3. Nominal bias is obtained with on-chip resistors by grounding
pads S1a and S2a.
4. Optional biasing can be obtained with off-chip resistors bonded
from pads S1b and S2b to ground. Adjusting the bias can
customize the performance to suit special requirements.
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM2800
Wide Band GaAs MMIC Amplifier
2.0 - 8.0 GHz
Rev. V6
Handling Procedures
Bonding
Permanent damage to the MAAM28000 may occur
if the following precautions are not adhered to:
A. Ball or wedge bond with 1.0 mil diameter gold
wire of 3.0 mil x 0.5 mil ribbon. Thermosonic
bonding with a nominal stage temperature of
150°C and a ball bonding force of 40 to 50
grams or wedge bonding force of 18 to 22
grams is recommended. Ultrasonic energy and
time should be adjusted to the minimum levels
necessary to achieve reliable bonds.
B. Bonds should be started on the die and terminated on the package.
C. Bonding pads are 4.0 x 4.0 mils minimum.
A. Cleanliness - The MAAM28000 should be handled in a clean environment. DO NOT attempt
to clean assembly after the MAAM28000 is
installed.
B. Static Sensitivity - All die handling equipment
and personnel should comply with DOD-STD1686 Class I.
C. Transients - Avoid instrument and power supply transients while bias is connected to the
MAAM28000. Use shielded signal and bias
cables to minimize inductive pick-up.
D. General Handling - DO NOT touch the surface
of the die.
It is recommended that the
MAAM28000 die be handled along the long
side with a sharp pair of tweezers.
Mounting
The MAAM28000 is back-metalized with Pd/Ni/Au
(100/1, 000/30,000Å) metallization. It can be diemounted using Au/Sn eutectic preforms or a thermally and electrically conductive epoxy. The attachment surface should be clean and flat.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with
a work surface temperature of approximately
255°C and a tool temperature of 265°C. When
hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290°
C.
B. DO NOT expose the MAAM28000 to a temperature greater than 320°C for more than 20
seconds. No more than 3 seconds of scrubbing should be required for attachment.
Epoxy Die Attach:
A. Electrically conductive epoxy is required.
B. Apply a minimum amount of epoxy and place
the MAAM28000 into position. A thin epoxy
fillet should be visible around the perimeter of
the die.
C. Cure epoxy per manufacturer’s recommended
schedule.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MAAM2800
Wide Band GaAs MMIC Amplifier
2.0 - 8.0 GHz
Rev. V6
M/A-COM Technology Solutions Inc. All rights reserved.
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5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support