EPD-470-0-1.4 TECHNICAL DATA Selective Photodiode, TO-18 package GaP EPD-470-0-1.4 is a GaP based photodiode, mounted into a TO-18 housing. This device is featuring a narrow bandwidth and reduced spectral sensitivity at 400 – 500 nm. Specifications • • • Spectral Responsivity (Peak): Active Area: Package: 470 nm 1.76 mm² TO-18 (Unit: mm) Parameters (TA=25°C) Item Active Area Temperature Coefficient of IPh Temperature Coefficient of ID Operating Temperature Storage Temperature 1 Soldering Temperature * Symbol A TC(IPh) TC(ID) Topr Tstg Tsol Value 1.76 0.15 1.05 -40 … +125 -40 … +125 240 Unit mm² %/K 1/K °C °C °C 1 * must be completed within 3 seconds at 240°C Electro-Optical Characteristics Item 1 Reverse Voltage * Dark Current (Ee=0W/m²) Central Sensitivity Wavelength Responsivity at λC Spectral Range at 0.5 max. 1 Sensitivity Range at 1% * Spectral Bandwidth at 50% Symbol Condition VR IR=10µA ID VR=5V λC VR=0V Sλ VR=0V λ0.5 VR=0V λmin, λmax VR=0V ∆λ0.5 VR=0V Min. 5 460 425 380 - Typ. 5 470 0.18 100 Max. 30 480 525 570 - Unit V pA nm A/W nm nm nm 1 * information only Note: The above specifications are for reference purpose only and subjected to change without prior notice. 25.11.2014 EPD-470-0-1.4 1 of 2 Typical Performance Curves Typical Optical Responsivity (A/W) Precaution for Use 1. Lead Forming • Lead forming should be done before soldering. • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the lead frame as a fulcrum during lead forming! • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the PD’s characteristics or it may break the PDs. • When mounted the PDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of PDs. If the PDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the PDs. 2. Soldering Conditions • Solder the PDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • After soldering the PDs, the lead should be protected from mechanical shock or vibration until the PDs return to room temperature. • The PDs must not be reposition after soldering. • When it is necessary to clamp the PDs to prevent soldering failure, it is important to minimize the mechanical stress on the PDs. • Cut the PD leads at room temperature. Cutting the leads at high temperature may cause the failure of the PDs. Soldering Conditions 3. Static Electricity • The PDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an antielectrostatic glove be used when handling the PDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the PDs. 25.11.2014 EPD-470-0-1.4 2 of 2