SMAL850 TECHNICAL DATA High Power LED Array, 60 chips, SMD ALGaAs SMAL850 is a wide viewing and extremely high output power illuminator assembled with a total of 60 high efficiency AlGaAs diode chips, mounted on an AIN ceramics and covered with clear silicone resin. These devices are designed for high current operation with proper heat sinking to improver thermal conductive efficiency. Specifications • • • • • Structure: AlGaAs, 60 LED chips Peak Wavelength: typ. 850 nm Optical Output Power: typ. 1.1 W Package: PCB, AIN ceramics Lens: clear epoxy or silicone resin Absolute Maximum Ratings (Ta=25°C) Item Power Dissipation Forward Current 1 Pulse Forward Current* Junction Temperature 2 Thermal Resistance * Reverse Voltage Operating Temperature Storage Temperature 3 Soldering Temperature * Symbol PD IF IFP TJ RTH VR Topr Tstg Tsol Value 10 1.2 5 100 6.3 50 -20 … +80 -30 … +100 250 Unit W A A °C K/W V °C °C °C (Unit: mm) *1 duty = 1%, pulse width = 1 µs *2 junction – package, mounted on heat sink *3 must be completed within 3 seconds Electro-Optical Characteristics Item Forward Voltage Reverse Voltage Symbol VF VR Total Radiated Power * PO Radiation Intensity Peak Wavelength Half Width Viewing Half Angle Rise Time Fall Time IE λP Δλ Θ1/2 tR tF Condition IF = 800 mA IR = 10 µA IF = 800 mA IFP = 4 A IF = 800 mA IF = 800 mA IF = 800 mA IF = 800 mA IF = 100 mA IF = 100 mA Min. 30 840 - Typ. 7.8 1.1 5.5 180 850 40 ±72 15 10 Max. 860 - Unit V V W mW/sr nm nm deg. ns ns * Total Radiated Power is measured by S3584-08 The above specifications are for reference purpose only and subjected to change without prior notice. 15.02.2012 SMAL850 1 of 3 Soldering Conditions • • • • • The LEDs can be soldered in place using the reflow soldering method. We cannot guarantee on the LEDs after they have been assembled using the dip soldering method. DO NOT apply any stress to the LED particularly when heat. After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return to room temperature. Repairing should not be done after the LEDs have been soldered. Reflow soldering should not be done more than two times. Temperature Profile PCB Footprint Layout (Unit: mm) Note • The LEDs emit very strong radiation. Do not view directly into the emitting area of the LED during operation! • The powered LEDs generate heat. Heat dissipation should be considered in the application design to avoid the environmental conditions for operation in excess of the absolute maximum ratings. This high power LED must be cooled! 15.02.2012 SMAL850 2 of 3 Static Electricity • LEDs are very sensitive to Static Electricity and surge voltage. It is recommended to always wear a wrist band or an anti-electrostatic glove when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 15.02.2012 SMAL850 3 of 3