APG2C1-1030 IR High Power single chip LED APG2C1-1030 is a GaAlAs based, high power 1030 nm single chip LED in standard emitter package for general application. Specifications • • • • • Structure: GaAlAs Peak Wavelength: 1030 nm Optical Output Power: typ. 60 mW Life Time: > 10.000 hours Housing: standard emitter package Absolute Maximum Ratings (Ta=25°C) Parameter Power Dissipation, DC Forward Current, DC Pulsed Current (1% duty cycle, 1kHz) Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (max. 1,5 s) Symbol PD IF IFP UR Topr Tstg Tsol Value 1000 500 1000 -5 -30 … +70 -30 … +85 330 Unit mW mA mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Parameter Forward Current Viewing Angle CW Output Power Peak Wavelength Forward Voltage Half Width (FWHM) Symbol IF φ PO λP UF Δλ Condition Min. - IF = 350 mA IF = 350 mA IF = 350 mA IF = 350 mA IF = 350 mA - Typ. 350 ± 75 60 1030 1.2 40 Max. - - Unit mA deg. mW nm V nm Wavelength measurements tolerance is +/- 2% Output power measurement tolerance is +/- 10% Voltage measurement tolerance is +/- 2% Device Materials Item Foundation Lens Electrodes Heat Sink 13.08.2012 Material Plastic Acryl AgCu AgCu APG2C1-1030 1/3 Typical Performance Characteristics Normalized Output Power vs. Wavelength: Outline Dimensions Emitter: Radiation Pattern (lambertian lens without optics) Relative Intensity vs. Angular Displacement 13.08.2012 APG2C1-1030 2/3 Soldering Conditions Reflow Soldering: APG2C1 LEDs have a maximum storage temperature of 115°. Therefor it is not possible to use a reflow soldering process for array assembly! Hot Bar Soldering: A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. In order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: • • • Amount of flux Pressing force of solder tip Hot bar temperature For the standard assembly process, following parameters should be maintained: • • • Hot Bar temperature: 330 °C Force of Hot Bar. 40 N Soldering time: 1.5 s It is recommended to use a copper nickel-plated hot bar mounted to standard temperature controlled soldering equipment. Manual Hand Soldering: For prototype build or small series production runs, it is possible to place and solder the emitters by hand. It is therefore recommended to maintain the following parameters: • • • Solder Tip Temperature 330 °C Soldering time. < 1.5 s Junction temperature must be kept below 115 °C A visual inspection may be used to check the quality of the solder joint General Soldering Precautions: • • • 13.08.2012 Mechanical stress, shock and vibration must be avoided during soldering Only use non corrosive flux. Do not apply current to the device until it has cooled down to room temperature after soldering. APG2C1-1030 3/3