APG2C1-720

APG2C1-720
IR High Power single chip LED
APG2C1-720 is an GaAlAs based, high power 720 nm single chip LED in standard emitter package for
general application.
Specifications
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Structure: GaAlAs
Peak Wavelength: 720 nm
Optical Output Power: typ. 100 mW
Life Time: > 10.000 hours
Housing: standard emitter package
Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Dissipation, DC
Forward Current, DC
Pulsed Current (1% duty cycle, 1kHz)
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (max. 1,5 s)
Symbol
PD
IF
IFP
UR
Topr
Tstg
Tsol
Value
1000
500
1000
-5
-30 … +70
-30 … +85
330
Unit
mW
mA
mA
V
°C
°C
°C
Electro-Optical Characteristics (Ta=25°C)
Parameter
Forward Current
Viewing Angle
CW Output Power
Peak Wavelength
Forward Voltage
Half Width (FWHM)
Switching time
Symbol
IF
φ
PO
λP
UF
Δλ
TR, tF
Condition
IF = 350 mA
IF = 350 mA
IF = 350 mA
IF = 350 mA
IF = 350 mA
IF = 350 mA
Min.
-
705
-
Typ.
350
± 75
100
715
1.9
25
40
Max.
-
725
-
Unit
mA
deg.
mW
nm
V
nm
ns
Wavelength measurements tolerance is +/- 2%
Output power measurement tolerance is +/- 10%
Voltage measurement tolerance is +/- 2%
Device Materials
Item
Foundation
Lens
Electrodes
Heat Sink
13.08.2012
Material
Plastic
Acryl
AgCu
AgCu
APG2C1-720
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Typical Performance Characteristics
Normalized Output Power vs. Wavelength:
Outline Dimensions
Emitter:
Radiation Pattern (lambertian lens without optics)
Relative Intensity vs. Angular Displacement
13.08.2012
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Soldering Conditions
Reflow Soldering:
APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use
a reflow soldering process for array assembly!
Hot Bar Soldering:
A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process
will only transfer heat to the leads and avoids overheating the emitter which will damage the
device. In order to transfer sufficient heat from the hot bar to the device, following parameters
must be carefully considered:
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Amount of flux
Pressing force of solder tip
Hot bar temperature
For the standard assembly process, following parameters should be maintained:
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Hot Bar temperature: 330 °C
Force of Hot Bar. 40 N
Soldering time: 1.5 s
It is recommended to use a copper nickel-plated hot bar mounted to standard temperature
controlled soldering equipment.
Manual Hand Soldering:
For prototype build or small series production runs, it is possible to place and solder the
emitters by hand. It is therefore recommended to maintain the following parameters:
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Solder Tip Temperature 330 °C
Soldering time. < 1.5 s
Junction temperature must be kept below 70 °C
A visual inspection may be used to check the quality of the solder joint
General Soldering Precautions:
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13.08.2012
Mechanical stress, shock and vibration must be avoided during soldering
Only use non corrosive flux.
Do not apply current to the device until it has cooled down to room temperature after
soldering.
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