W54L5111P

W54L5111P
TECHNICAL DATA
White LED 5 mm, InGaN
Features
Applications
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High Luminous LEDs
5mm Round Standard Directivity
Long Lifetime Operation
Superior Weather-resistance
UV Resistant Epoxy
Water Clear Type
Automotive Dashboard Lighting
Small Area Illuminations
Back Lighting
Other Lighting
Diretivity:
Outline Dimension:
PIN
1
2
Absolute Maximum Ratings (Ta=25°C)
Item
Power Dissipation
Forward Current
Pulse Forward Current *
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (5 sec.)
Symbol
PD
IF
IFP
VR
Topr
Tstg
Tsol
Value
190
50
120
5
-30 … +85
-40 … +100
260
Unit
mW
mA
mA
V
°C
°C
°C
Function
LED Anode
LED Cathode
Unit: mm
Tolerance: ±0.3 mm
* pulse width max. 10 ms, duty ratio max. 1/10
Specifications (Ta=25°C)
Item
Optical Specifications
1
Luminous Intensity *
Chromatictiy
2
Coordinates *
Viewing Angle
Electrical Specifications
Forward Voltage
Reverse Voltage
Condition
Symbol
Min.
Typ.
Max.
Unit
IF = 50 mA
IF = 50 mA
IF = 50 mA
IF = 50 mA
IV
x
y
2Θ1/2
60
-
75
0.27
0.28
15
-
cd
deg
IF = 50 mA
UF = 5 V
UF
UR
3.0
-
3.3
-
3.8
10
V
µA
*1 Tolerance of chromaticity coordinates is ±10%
*2 Tolerance of luminous intensity is ±15%
13.04.2012
W54L5111P
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Precaution for Use
1. Cautions
• DO NOT look directly into the light or look through the optical system.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• Recommended soldering conditions:
Pre-Heat
Pre-Heat Time
Solder Bath Temperature
Dipping Time
Dipping Position
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Dip Soldering
120 °C Max.
60 Seconds Max.
260 °C Max.
5 Seconds Max.
No lower than 3 mm from the base of the epoxy bulb
DO NOT apply any stress to the lead particularly when heat.
The LEDs must not be reposition after soldering.
After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
5. Heat Generation
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The powered LEDs generate heat. Heat dissipation should be considered in the application
design to avoid the environmental conditions for operation in excess of the absolute
maximum ratings.
13.04.2012
W54L5111P
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