RU7550S

RU7550S
N-Channel Advanced Power MOSFET
MOSFET
Features
Pin Description
• 75V/55A,
RDS (ON) =11mΩ(Typ.)@VGS=10V
• Super High Dense Cell Design
• 100% avalanche tested
• Lead Free and Green Devices Available
(RoHS Compliant)
TO-263
Applications
•
•
•
•
DC-DC Converters and Off-line UPS
Automotive Load Control
Electronic Power Steering System
Electronic Valve Train System
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
75
VGSS
Gate-Source Voltage
±25
Maximum Junction Temperature
175
°C
-55 to 175
°C
TC=25°C
50
A
TC=25°C
200
TC=25°C
A
TC=100°C
55
46
TC=25°C
111
W
TC=100°C
56
W
1.35
°C/W
430
mJ
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
V
Mounted on Large Heat Sink
IDP
300μs Pulse Drain Current Tested
ID
Continuous Drain Current(VGS=10V)
PD
RθJC
Maximum Power Dissipation
Thermal Resistance-Junction to Case
①
A
②
Drain-Source Avalanche Ratings
EAS
③
Avalanche Energy, Single Pulsed
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
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RU7550S
Electrical Characteristics
Symbol
(TA=25°C Unless Otherwise Noted)
Parameter
Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS
VGS(th)
IGSS
RDS(ON)
④
Zero Gate Voltage Drain Current
Test Condition
VGS=0V, IDS=250µA
RU7550S
Min.
Typ.
1
TJ=85°C
VDS=VGS, IDS=250µA
Gate Leakage Current
VGS=±25V, VDS=0V
Drain-Source On-state Resistance
VGS= 10V, IDS=30A
Unit
V
75
VDS= 75V, VGS=0V
Gate Threshold Voltage
Max.
10
µA
4
V
±100
nA
11
13
mΩ
0.8
1.2
V
2
3
Diode Characteristics
VSD
④
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=30A, VGS=0V
ISD=30A, dlSD/dt=100A/µs
33
ns
30
nC
1.8
Ω
⑤
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
VGS=0V,
VDS= 35V,
Frequency=1.0MHz
1870
280
pF
93
10
VDD=40V, RL=30Ω,
IDS=30A, VGEN= 10V,
RG=4.7Ω
Turn-off Fall Time
55
31
ns
21
⑤
Gate Charge Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
35
VDS=60V, VGS= 10V,
IDS=30A
11
nC
8
Pulse width limited by safe operating area.
Calculated continuous current based on maximum allowable junction temperature.
Limited by TJmax, IAS =25A, VDD = 48V, RG = 50Ω , Starting TJ = 25°C.
Pulse test ; Pulse width≤300µs, duty cycle≤2%.
Guaranteed by design, not subject to production testing.
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
2
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RU7550S
Typical Characteristics
Drain Current
Ptot - Power (W)
ID - Drain Current (A)
Power Dissipation
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
ID - Drain Current (A)
Normalized Effective Transient
Thermal Transient Impedance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
Square Wave Pulse Duration (sec)
3
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RU7550S
Typical Characteristics
Drain-Source On Resistance
ID - Drain Current (A)
RDS(ON) - On Resistance (mΩ)
Output Characteristics
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Gate Threshold Voltage
RDS(ON) - On - Resistance (m)
Normalized Threshold Voltage
Drain-Source On Resistance
VGS - Gate-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
Tj - Junction Temperature (°C)
4
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RU7550S
Typical Characteristics
Source-Drain Diode Forward
IS - Source Current (A)
Normalized On Resistance
Drain-Source On Resistance
Tj - Junction Temperature (°C)
VSD - Source-Drain Voltage (V)
Gate Charge
C - Capacitance (pF)
VGS - Gate-Source Voltage (V)
Capacitance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
QG - Gate Charge (nC)
5
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RU7550S
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
6
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RU7550S
Ordering and Marking Information
Device
Marking
Package
Packaging
Quantity
Reel Size
Tape width
RU7550S
RU7550S
TO-263
Tube
50
-
-
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
7
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RU7550S
Package Information
TO-263-2L
SYMBOL
MM
INCH
MM
MIN
NOM
MAX
MIN
NOM
MAX
4.40
4.57
4.70
0.173
0.180
0.185
A1
0
0.10
0.25
0
0.004
A2
2.59
2.69
2.79
0.102
0.106
b
0.77
-
0.90
0.030
b1
1.23
-
1.36
c
0.34
-
0.47
C1
1.22
-
A
SYMBOL
INCH
MIN
NOM
MAX
MIN
NOM
MAX
L
2.00
2.30
2.60
0.079
0.090
0.102
0.010
L3
1.17
1.27
1.40
0.046
0.050
0.055
0.110
L1
-
-
1.70
-
-
0.067
-
0.035
L4
0.048
-
0.052
L2
0.013
-
0.019
θ
0°
-
8°
0°
-
8°
1.32
0.048
-
0.052
θ1
5°
7°
9°
5°
7°
9°
0.25BSC
0.01BSC
2.50REF.
0.098REF.
D
8.60
8.70
8.80
0.338
0.343
0.346
θ2
1°
3°
5°
1°
3°
5°
E
10.00
10.16
10.26
0.394
0.4
0.404
DEP
0.05
0.10
0.20
0.002
0.004
0.008
Øp1
1.40
1.50
1.60
0.055
0.059
0.063
e
H
2.54BSC
14.70
15.10
0.1BSC
15.50
0.579
0.594
0.610
ALL DIMENSIONS REFER TO JEDEC STANDARD
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
8
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RU7550S
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Investor Relations Contacts:
[email protected]
Marcom Contact:
[email protected]
Editorial Contact:
[email protected]
HR Contact:
[email protected]
Legal Contact:
[email protected]
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: [email protected]
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– FEB., 2011
9
www.ruichips.com