LOT ASSURANCE INSPECTION LOT ASSURANCE INSPECTION is executed to verify the quality every wafer process fabrication lot. It is the key to the assured delivery initial reliability. <For Power management ICs> No. TEST ITEMS TEST CONDITION SAMPLE LTPD 1 High Temperature Operating Test Ta=125℃, 40h 22 10% 2 Heat Treatment Heating Profile (Following figure.) 3times 22 10% Unbiased HAST < Test Period > The test period will be change to the periodical monitoring when it is confirmed the good quality level. Ta=125℃, RH=85%、16h Temperature (℃) IR Reflow (SMD Package) 260℃ max. 255±5℃ 220℃ 190℃ 150℃ 10±1s 120s max. Heating condition of infrared-ray reflow. 90s max. Time (s) QUALITY ASSURANCE TEST INSPECTION QUALITY ASSURANCE TEST is done for quality assurance of shipped products by using sampling inspection. <For Power management ICs> No. DIVISION TEST ITEMS CRITERIA Heavy Defect 1 2 Electrical QAT Specification AQL ** 0.065% * Light Defect 0.15% Heavy Defect 0.25% Appearance Visual Inspection Criteria Light Defect * ) Catastrophic Failures (short, open or functionally inoperative) AQL 0.065% **) AQL : ANSI/ASQC Z1.4-1993 Sampling Plans : Table Ⅱ-C-Single sampling plans for reduced inspection 0.65% Handling and design guideline –Soldering(1)1. The surface temperature and exposure time should be kept as below. Max. temperature Max. time Applicable parts 260℃ 10s Lead 350℃ 380℃ 5s 3s Lead (when hand-soldering is necessary) 2. solder flux Don’t use halogenous solder flux. 3. Heat-resistance profiles Dip soldering Temperature (℃) Temperature (℃) Reflow profile 260℃ max. 255±5℃ 220℃ 190℃ 150℃ 260℃ max. Dipping 2 to 5s Cooling Pre-heating 1 to 3min 80 to 150℃ Solder melting point 10±1s 120s max. Heating condition of infrared-ray reflow. Board surface temp. 90s max. Time (s) Time (s) Handling and design guideline –Soldering(2)4. MSL (Moisture Sensitivity Level) Though heating process may be carried out 3 times, in reflow method, be sure to minimize the temperature and the exposure time. Level Storage time Humidification Conditions JEDEC JEITA 85℃,85%,168h 1 A Unlimited 85℃,65%,168h 2 B 1year(*) 30℃,70%,672h 2a C 4weeks(*) 30℃,70%,336h - D 2weeks(*) 30℃,70%,168h 3 E 168hours(*) 30℃,70%, 96h - F 96hours(*) - 30℃,70%, 72h 4 G 72hours(*) - 30℃,70%, 48h 5 H 48hours(*) - 30℃,70%, 24h 5a I 24hours(*) - Specified individually 6 S Time on label(*) - (*) Baking: 125℃, 10h Mainly Package SOT-23, SOT-89, SON/HSON, SC82/SC88, DFN, WLCSP, HSOP, TO-252 SON-22,SOP-14(For RTC module) FBGA, QFP Handling and design guideline –Soldering(3)5. The board cleaning conditions. z We recommend alternative CFCs substitute for solvent. Ex. ST-100s (Arakawa) z Don’t use trichloroethylene, trichloroethane, etc. z Cleaning time should be less than 180s. (including in solvent, in vapor and in ultrasonic bath). z Ultrasonic cleaning is usable. Frequency 28 to 40 kHz (resonant damage should be avoided) Power 15W/liter (MAX.) Time 60s (MAX.) Handling and design guideline –Storage and ESDStorage z Please be sure to store devices in proper conditions to maintain device quality. Ambient temperature 5 to 35℃ Humidity 45 to 75% (Note) If humidifiers are being used, provide pure water or boiled water. When the device are stored in the long term, maintain the air purified and the temperature stabilized. ESD handling precaution z The devices should be handled in the condition of greater than 40% relative humidity.