HSON-6

PACKAGE INFORMATION
•
PE-HSON-6-101018
HSON-6
Unit: mm
PACKAGE DIMENSIONS
2.9±0.2
0.5Typ.
(0.15)
0.3±0.1
(0.65)
(1.6)
3.0±0.2
∗
1
3
(0.2)
2.8±0.2
∗
Bottom View
0.9Max.
0.15±0.05
∗
) Atttention:Tab suspension leads in the circle
parts have VDD or GND level.
(They are connected to the back side of this IC.)
Refer to PIN DISCRIPTION.
Do not connect to other wires or land patterns.
0.1
0.95
6
4
3
1
(0.2)
(1.5)
4
6
0.1 M
4.0±0.1
+0.1
∅1.5 0
8.0±0.3
3.5±0.05
2.0±0.05
3.2
0.2±0.1
1.75±0.1
TAPING SPECIFICATION
3.3
4.0±0.1
2.0Max.
∅1.1±0.1
TR
User Direction of Feed
TAPING REEL DIMENSIONS
REUSE REEL (EIAJ-RRM-08Bc)
(1reel=3000pcs)
2±0.5
21±0.8
+1
60 0
0
180 −1.5
13±0.2
11.4±1.0
9.0±0.3
PACKAGE INFORMATION
PE-HSON-6-101018
POWER DISSIPATION (HSON-6)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm × 40mm × 1.6mm
Copper Ratio
Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ0.5mm × 44pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
Free Air
900mW
400mW
θja=(125−25°C)/0.9W=111°C/W
250°C/W
Power Dissipation
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
θjc=43.5°C/W
On Board
40
Free Air
40
Power Dissipation PD(mW)
Thermal Resistance
0
25
50
75 85 100
Ambient Temperature (°C)
125
150
Power Dissipation
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
1.7
1.6
0.65
0.95
1.15
0.35
(Unit: mm)