QFN0404-20

PACKAGE INFORMATION
•
PE-QFN0404-20-080623
QFN0404-20
Unit: mm
PACKAGE DIMENSIONS
4.00
2.2Typ.
B
15
16
6
20
2.2Typ.
10
0.50
4.00
11
0.50±0.10
A
INDEX
5
1
0.50±0.10
0.23±0.05
0.08 S
S
0.10 S AB
Bottom View
0.85Max.
0.2Typ.
0.50
) Tab in the
parts have VDD or GND level.
(They are connected to the back side of the IC.)
Do not connect to other wires or land patterns.
12.0±0.3
4.35±0.05
2.0±0.05
5.5±0.05
4.0±0.1
1.5 +0.1
0
0.3±0.05
1.75±0.1
TAPING SPECIFICATION
1.0±0.1
4.35±0.05
1.3±0.05
8.0±0.1
E2
TAPING REEL DIMENSIONS
REUSE REEL (EIAJ-RRM-12Cc)
19.5Max.
(1reel=2,000pcs)
∅13±0.2
∅ 254±2
21±0.8
∅ 100 +2.0
0
13.5±0.2
2±0.5
A reel for QFN0404-20
User Direction of Feed
PACKAGE INFORMATION
PE-QFN0404-20-080623
POWER DISSIPATION (QFN0404-20)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Land Pattern A
Land Pattern B
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plastic (4 layers)
Board Dimensions
35mm × 90mm × 0.8mm
40mm × 40mm × 0.8mm
Copper Ratio
Each layer: 15%
1st:50%, 2nd:15%, 3rd:15%, 4th:50%
φ0.3mm×16pcs,
Through-hole
φ0.5mm×20pcs
φ0.3mm×16pcs,
Measurement Result
φ0.5mm×20pcs
(Topt=25°C, Tjmax=125°C)
Land Pattern B
Power Dissipation
1800mW
1900mW
Thermal Resistance
θja=(125−25°C)/1.8W=55.6°C/W
θja=(125−25°C)/1.9W=52.6°C/W
2000
1900
1800
40
On Board : B
1600
1400
40
Power Dissipation PD (mW)
Land Pattern A
1200
On Board : A
1000
800
600
0
25
50
75 85 100
125
Ambient Temperature (°C)
150
Measurement Board Pattem B
Power Dissipation
4.4
0.23
2.0
0.5
RECOMMENDED LAND PATTERN
0.7
2.0
4.4
(Unit: mm)
(Unit: mm)