PACKAGE INFORMATION • PE-DFN1616-6-090622 DFN1616-6 Unit: mm 0.20±0.05 1.60 A B 0.05 M AB 0.5 0.05 PACKAGE DIMENSIONS 6 4 0.70±0.05 (3×0.15) 1.60 0.05 0.20±0.05 ̪ ×4 INDEX 0.4Max. 3 S 1 1.30±0.05 Bottom View ) Tab in the parts have VDD or GND level. (They are connected to the back side of the IC.) Do not connect to other wires or land patterns. 0.05 S 1.5 +0.1 0 4.0±0.1 1.9 3.5±0.05 2.0±0.05 8.0±0.3 0.2±0.1 1.75±0.1 TAPING SPECIFICATION 0.6±0.1 1.9 1.0Max. 4.0±0.1 TR TAPING REEL DIMENSIONS User Direction of Feed REUSE REEL (EIAJ-RRM-08Bc) 11.4±1.0 (1reel=5,000pcs) 21±0.8 ∅13±0.2 2±0.5 ∅ 60 +1 0 0 ∅ 180 −1.5 9.0±0.3 PACKAGE INFORMATION PE-DFN1616-6-090622 POWER DISSIPATION (DFN1616-6) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-holes φ0.5mm × 32pcs Measurement Results (Topt=25°C, Tjmax=125°C) 640mW Thermal Resistance θja=(125−25°C)/0.64W=156°C/W Thermal Resistance θjc=23°C/W 40 700 640 600 On Board 500 400 40 Power Dissipation PD (mW) Standard Land Pattern Power Dissipation 300 200 100 0 0 25 50 75 85 100 125 150 Ambient Temperature (°C) Measurement Board Pattern Power Dissipation IC Mount Area RECOMMENDED LAND PATTERN 1.80 0.35 1.30 0.70 0.20 0.50 (Unit: mm) (Unit: mm)