PACKAGE INFORMATION • PE-DFN(PLP)1616-6D-130516 DFN(PLP)1616-6D Unit: mm PACKAGE DIMENSIONS 1.60 A 1.30±0.05 B 6 4 0.70±0.05 C0.1 INDEX 3 0.6Max. 0.05Min. 0.25±0.05 ∗ 0.05 1.60 ×4 1 0.5 0.20±0.05 0.05 M AB Bottom View S ∗) Tab in the part is GND or VDD level. (It is connected of the reverse side of the IC.) The tab is better to be connected to the GND or VDD, but leaving it open is also acceptable. 0.05 S 4.0±0.1 1.9 3.5±0.05 2.0±0.05 8.0±0.3 1.5 +0.1 0 0.2±0.1 1.75±0.1 TAPING SPECIFICATION 0.6±0.1 1.9 1.2Max. 4.0±0.1 TR TAPING REEL DIMENSIONS User Direction of Feed REUSE REEL (EIAJ-RRM-08Bc) (1reel=5,000pcs) 11.4±1.0 2±0.5 21±0.8 ∅60 +1 0 0 ∅180 −1.5 ∅13±0.2 9.0±0.3 PACKAGE INFORMATION PE-DFN(PLP)1616-6D-130516 POWER DISSIPATION (PLP(DFN)1616-6D) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-holes φ0.54mm × 26pcs Measurement Results (Topt=25°C, Tjmax=125°C) Standard Land Pattern 640mW Thermal Resistance θja=(125−25°C)/0.64W=156°C/W Thermal Resistance θjc=23°C/W 700 640 600 40 On Board 500 400 300 40 Power Dissipation PD (mW) Power Dissipation 200 100 0 0 25 50 75 85 100 125 150 Measurement Board Pattern Ambient Temperature (°C) Power Dissipation IC Mount Area RECOMMENDED LAND PATTERN 2.0 0.7 0.4 0.50 0.4 1.30 0.25 (Unit: mm) (Unit: mm)