Data Sheets - Skyworks Solutions, Inc.

PRELIMINARY DATA SHEET
SMP1334-084LF: 100 W High-Power Silicon PIN Diode
Applications
 Low-loss, high-power switches
 Low-distortion attenuators
Features
 High RF power handling: 100 W
 Low thermal resistance: 10 °C/W
 Low series resistance: 0.45 Ω typical @ 100 mA
 Low total capacitance: 0.45 pF maximum @ 30 V
 Small QFN (2 x 2 mm) package (MSL1, 260 °C per JEDEC JSTD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Description
The SMP1334-084LF is a surface-mountable, low-capacitance
silicon PIN diode designed as a series-connected PIN diode for
high-power, high-volume switch and attenuator applications from
10 MHz to beyond 6 GHz.
Typical resistance at 100 mA is 0.45 Ω and maximum
capacitance at 30 V is 0.45 pF. The combination of low
capacitance, low parasitic inductance, and nominal 50 μm
I-region width, makes the SMP1334-084LF useful in large signal
switches and attenuator applications.
The device has a 1 W dissipation power rating, which makes it
capable of handling up to 100 W @ 25 °C Continuous Wave (CW)
in a series-connected transmit/receive (T/R) switch.
Design information for high power switches may be found in the
Skyworks Application Note, Design With PIN Diodes (document
number 200312).
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
Table 1. SMP1334-084LF Absolute Maximum Ratings
Parameter
Symbol
Maximum
Units
IF
200
mA
Reverse voltage
VR
200
V
Dissipated power @ 85 °C
PD
1
W
Forward current
Minimum
Peak pulse power dissipation @ 85 °C (10% duty cycle)
10
W
Operating temperature
TA
–55
+85
C
Storage temperature
TSTG
–55
+200
C
Junction temperature
TJ
–55
+175
C
Electrostatic discharge:
Charged-Device Model (CDM), Class 4
Human Body Model (HBM), Class 3A
Machine Model (MM), Class C
ESD
1100
5000
400
V
V
V
Note:
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. SMP1334-084LF Electrical Specifications (Note 1)
(TA = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Forward voltage
VF
IF = 10 mA
Reverse leakage current
IR
VR = 200 V
Series resistance
RS1
IF = 1 mA, f = 100 MHz
Min
Typical
Max
0.75
V
10
μA
16.5
20
Ω
2.5
Ω
RS10
IF = 10 mA, f = 100 MHz
2.0
RS100
IF = 100 mA, f = 100 MHz
0.45
Total capacitance
CT30
VR = 30 V, f = 1 MHz
Series inductance
LS
Minority carrier lifetime
TL
0.40
Ω
0.45
pF
0.37
nH
IF = 10 mA
700
ns
I region width
W
50
μm
Thermal resistance (Note 2)
ΘJC
Junction-to-case
10
°C/W
Peak thermal resistance
ΘP
Single, 1 μs pulse width,
junction-to-case (10%
duty cycle)
1
°C/W
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Assume a thermal resistance of 90 °C/W for the junction-to-bottom of the circuit board.
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Units
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PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
Electrical and Mechanical Specifications
Package dimensions for the SMP1334-084LF are provided in
Figure 12, and tape and reel dimensions are provided in
Figure 13.
The absolute maximum ratings of the SMP1334-084LF are
provided in Table 1. Electrical specifications are provided in
Table 2. Typical DC performance characteristics of the
SMP1334-084LF are illustrated in Figures 1, 2, and 3.
Package and Handling Information
Instructions on the shipping container label regarding exposure
to moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1334-084LF Evaluation Board is used to test the
performance of the SMP1334-084LF PIN Diode. Figure 4 shows
a bias schematic, and Table 3 lists the Evaluation Board Bill of
Materials. Typical RF performance of the SMP1334-084LF using
the schematic shown in Figure 4 is summarized in Table 4 and
illustrated in Figures 5, 6, and 7.
The SMP1334-084LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application
Note, Solder Reflow Information, document number 200164.
An assembly drawing for the Evaluation Board is shown in
Figure 8. The layer detail physical characteristics are provided
in Figure 9.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package Dimensions
The PCB layout footprint for the SMP1334-084LF is provided in
Figure 10. Typical case markings are shown in Figure 11.
Typical DC Performance Characteristics
(TA = 25 °C, Unless Otherwise Noted)
Series Resistance (Ω)
100
0.600
0.500
0.400
0.300
0
5
10
15
20
25
Reverse Voltage (V)
10
1
30
1
10
Forward Current (mA)
Y0159
Figure 1. Capacitance vs Reverse Voltage @ 1 MHz
100
Y0160
Figure 2. Series Resistance vs Forward Current @ 100 MHz
0.900
0.800
Forward Voltage (V)
Capacitance (pF)
0.700
0.700
0.600
0.500
0.400
0.300
0
10
20
30
40
Forward Current (mA)
50
Y0161
Figure 3. Forward Voltage vs Forward Current
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
+5 V
R
82 Ω
C
100 pF
L
22 nH
C
100 pF
C
100 pF
SMP1334-084LF
50 Ω
Term
50 Ω
Term
L
22 nH
C
100 pF
Y0162
Figure 4. SMP1334-084LF Bias Schematic
Table 3. Evaluation Board Bill of Materials for EN33-D515-01_V3 (Tuned Circuit)
Value
Size
QTY
Manufacturer
Mfg. Part Number
Characteristics
C
Component
100 pF
0402
4
Murata
GRM1555C1H101JZ01
5% C0G 50 V
L
22 nH
0402
2
Murata
HK100522NJ-T
5%
R
82 
0402
1
Panasonic
ERJ2GEJ820X
5%, 0.1 W
Table 4. Typical RF Performance @ 25 °C, f = 2.6 GHz
Parameter
Typical
Units
0.22
dB
15
dB
–6.4
dB
Insertion loss
0.5
dB
Return loss
11.7
dB
Isolation
–8.2
dB
Max power
+50
dBm
Un-tuned
Insertion loss
Return loss
Isolation
With 22 nH Bias Circuit
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
Typical RF Performance Characteristics
0
0
–10
–10
|S-Parameters| (dB)
|S-Parameters| (dB)
(TOP = +25 °C, Characteristic Impedance [ZO] = 50 Ω, EVB Optimized with Bias Circuit, Unless Otherwise Noted)
–20
–30
–40
S11
S21
–50
–20
–30
–40
–60
–60
0
1
2
3
4
5
6
7
0
8
Frequency (GHz)
S11
S21
–50
1
2
3
4
5
6
Frequency (GHz)
Y0165
7
8
Y0164
Figure 6. S-Parameter Magnitude vs
Frequency VREV = –30 V
Figure 5. S-Parameter Magnitude vs Frequency If = 50 mA
0
If=50 mA
If=100 mA
Insertion Loss (dB)
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
0
10
20
30
40
50
CW Input Power (dBm)
60
Y0166
Figure 7. Insertion Loss vs CW Input Power f=2.6 GHz
Figure 8. SMP1334-084LF Evaluation Board
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
Cross Section
Name
Thickness (in)
Material
Top Soldermask
L1
(0.0028)
Cu foil
0.012 ± 0.0006
Rogers RO4003C Core
L2
(0.0014)
Cu foil
Laminate
(Note 1)
FR4 Prepreg
L3
(0.0014)
Cu foil
0.010 ± 0.0006
FR4 Core
(0.0028)
Cu foil
Laminate
Laminate
L4
Bottom Soldermask
Note 1: Adjust this thickness to meet total thickness goal of 0.062 ± 0.005 inches.
S2531
Figure 9. Board Layer Detail Physical Characteristics
0.25
Part Outline
0.55
Exposed Soldering
Area, Typical
2X 0.80
Pin 1
Pin 2
0.80
0.35
Y0041
Figure 10. SMP1334-084LF PCB Layout Footprint
(Top View)
Pin 1
Indicator
MG
Skyworks Part
Marking
1
1
2
2
Y0163
Figure 11. Typical Case Markings
(Top View)
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November 5, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202999B
PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
2
1
C
Pin 1
Indicator
Exposed Pad
Seating Plane
A
2
B
1.15 + 0.1/–0.15
0.0 – 0.05
Detail A
2
1.6 + 0.1/–0.15
2
1
0.05 C
2X
0.90 ± 0.1
2X
2X
0.10 C
0.05 C
Top View
0.20 Min.
3
0.20
0.08 C
Side View
Bottom View
0.4 ± 0.1
0.30 ± 0.05
5
0.10 M C A B
Detail A
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Coplanarity applies to the exposed heat sink slug as well as the terminals..
Dimension applies to metalized terminal and is measured between 0.10 mm and 0.30 mm from terminal tip.
S1989
Figure 12. SMP1334-084LF Package Dimensions
∅1.50+ 0.10/–0.00
0.30 ± 0.05 (T)
Pin #1
4.00 ± 0.10
2.00 ± 0.05
4.00 (see Note 4)
1.75 ± 0.10
2.30 (Bo)
A
B
1.00 (Ko)
2.30 (Ao)
8.00 +0.30/–0.10
A
3.50 ± 0.05
B
∅1.00 Min.
R0.30 Typ.
B
Notes:
1. Carrier tape: black conductive polystyrene.
2. Cover tape material: transparent conductive HSA.
3. Cover tape size: 5.40 mm width.
4. Ten sprocket hole pitch cumulative tolerance = ±0.20 mm.
5. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC
tape and reel specification.
6. Ao and Bo measurement point to be 0.30 mm from bottom pocket.
7. All measurements are in millimeters.
A
S1601
Figure 13. SMP1334-084LF Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE
Ordering Information
Model Name
SMP1334-084LF: 100 W High-Power Silicon PIN Diode
Manufacturing Part Number
SMP1334-084LF
Evaluation Board Part Number
SMP1334-084LF EVB
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