Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
CLA Series: Silicon Limiter Diode Bondable Chips
Applications
 LNA receiver protection
 Commercial and defense radar
Features
 Established Skyworks limiter diode process
 High-power, mid-range, and cleanup designs
 Low insertion loss: 0.1 dB @ 2.6 GHz
 Peak power handling to +74 dBm
 Ultra-low spike leakage power
 Tight control of I layer base width
 Mesa and planar chip designs
Description
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
The Skyworks CLA series of silicon limiter diodes provides
passive receiver protection over a wide range of frequencies from
100 MHz to over 30 GHz. These devices use the well-established
Skyworks silicon technology resulting in high resistivity and tightly
controlled base width PIN limiter diodes. Limiter circuits using
these devices perform with strong limiting action and low loss.
The CLA series consists of eleven individual chip designs of
different intrinsic region base widths and capacitances designed
to accommodate multi-stage limiter applications. The mesaconstructed, thin base width, low capacitance CLA4601-000,
CLA4602-000, CLA4604-000, CLA4605-000, and CLA4611-000
are designed for low-level and cleanup applications. The
CLA4603-000, CLA4606-000 through CLA4608-000, and
CLA4610-000 are planar designs designated for high-power and
mid-range applications.
The CLA4609-000 thick base width mesa diode is designed for
coarse limiter-stage applications.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CLA SERIES DIODES
Electrical and Mechanical Specifications
Table 3 and Figures 1 through 4. Table 4 identifies the die part
numbers with their corresponding top contact diameters and die
outline drawings.
The absolute maximum ratings of the CLA diode series are
specified in Table 1. Electrical specifications are provided in
Table 2. Typical performance characteristics are provided in
Table 1. CLA Series Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Typical
Maximum
Units
Power dissipation
PDIS
Maximum TJ  Case Temp
Thermal Re sis tan ce junctiontocase
W
Reverse voltage
VR
Minimum rated breakdown voltage
V
Forward current
IF
200
mA
Junction temperature
TJ
–65
+175
C
Storage temperature
TSTG
–65
+200
C
1000
1000
150
V
V
V
Electrostatic discharge:
Charged Device Model (CDM), Class 4
Human Body Model (HBM), Class 1C
Machine Model (MM), Class A
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
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DATA SHEET • CLA SERIES DIODES
Table 2. CLA Series Electrical Specifications (Notes 1 and 2)
Junction
Junction
Series
Capacitance (CJ) Capacitance (CJ) Resistance
@0V
@6V
(RS) @ 10 mA
(pF)
(pF)
(Ω)
Minority
Carrier
Lifetime (TL)
@ 10 mA
(ns)
Thermal Resistance (θ) (Note 3)
Average
(C/W)
1 μs Pulse
0.01% Duty
Cycle
(C/W)
PDISS
(W)
Breakdown
Voltage (V)
I Region
(μm)
Part Number
Min to Max
Nominal
Typical
Maximum
Maximum
Typical
Maximum
Typical
Typical
CLA4601-000
15 to 30
1
0.12
0.10
2.5
5
185
0.89
0.49
CLA4602-000
15 to 30
1
0.20
0.15
2.0
5
177
0.42
0.51
CLA4603-000
20 to 45
1.5
0.20
0.15
2.0
5
135
0.39
0.66
CLA4604-000
30 to 60
2.0
0.12
0.10
2.5
7
139
0.40
0.65
CLA4605-000
30 to 60
2.0
0.20
0.15
2.0
7
139
0.51
0.65
CLA4606-000
45 to 75
2.5
0.20
0.15
2.0
10
139
0.43
0.65
CLA4607-000
120 to 180
7.0
0.20
0.15 @ 38 V
2.0
50
191
0.26
0.47
CLA4608-000
120 to 180
7.0
0.60
0.50 @ 38 V
1.2
100
106
0.14
0.85
CLA4609-000
250 (Min.)
20
0.26
0.14
1.5
1175
84
0.44
1.07
CLA4610-000
80 to 120
4.5
0.13
0.12
2.2
20
145
0.46
0.62
CLA4611-000
120 to 180
12
0.23
0.20 @ 38 V
1.2
300
103
0.37
0.87
Note 1: Performance is guaranteed only under the conditions listed in this table and is not guaranteed over the full operating or storage temperature ranges. Operation at
elevated temperatures may reduce reliability of the device.
Note 2: TOP = +25 C, CJ measured at 1 MHz, RS measured at 500 MHz, CW thermal resistance for infinite heat sink, unless otherwise noted.
Note 3: Thermal resistance is calculated from the measured power dissipation and junction temperature @ f = 2.6 GHz, TJ max = 175 °C and TCASE = 85 °C. Die were
connected in single stage limiter configuration with a 22 nH inductor providing the DC ground return. The diode cathode was attached to the RF ground of a 10 mil thick
Rogers 4003 microstrip test board using 2 mil thick conductive epoxy. The anode contact was connected to the test board input and output RF lines using 0.8 mil Au
bond wire for each connection. The test board included 22 mil coplanar, gold-plated, RF lines and two 50  SMA connectors.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CLA SERIES DIODES
Table 3. Typical Performance @ 25 °C @ 2.6 GHz, Z0 = 50 Ω (Note 1)
Part Number
Insertion Loss
@ –10 dBm (dB)
CW Input Power
for 1 dB
Insertion Loss
(dBm)
Maximum CW
Input Power
(dBm)
Maximum
Pulsed Input
Power
(dBm) (Note 2)
Output @
Maximum
Pulsed Input
(dBm) (Note 2)
Recovery Time
(ns) (Note 3)
Spike Leakage
(ergs) (Note 4)
CLA4601-000
0.1
12
36
65
21
5
Note 5
CLA4602-000
0.1
12
36
65
24
5
Note 5
CLA4603-000
0.1
10
38
67
22
5
Note 5
CLA4604-000
0.1
12
40
70
24
5
Note 5
CLA4605-000
0.1
11
40
70
27
5
0.08
CLA4606-000
0.1
11
41
71
27
5
0.03
CLA4607-000
0.1
26
43
73
39
5
0.21
CLA4608-000
0.2
23
43
73
44
5
0.15
CLA4609-000
0.3
37
44
74
50
5
25.77
CLA4610-000
0.1
22
40
57
32
5
Note 5
CLA4611-000
0.3
25
40
60
42
450
0.6
Note 1: Diode chip is mounted on a 0.5 oz Cu PC board using 1 to 2 mils of conductive epoxy. Bond wire connections are made with 0.8 mil Au wire. Limiter configured with shunt connected
diode and 22 nH ground return and 100 pF DC blocking capacitors.
Note 2: Pulsed power measurements taken at 1 μs pulse width, pulse frequency = 10 kHz, and 0.1% duty cycle.
Note 3: Recovery time represents the transition time from the high-loss state to the low-loss state following the removal of a high-power input. It is defined as the time from the end of the
high-power pulse to the time when insertion loss has returned to within 3 dB of the quiescent (low-power) state.
Note 4: Spike Leakage (ergs) = ts x Ps x 107 where ts is the spike width at the half-power point (in seconds) and PS is the maximum spike amplitude in watts.
Note 5: Not detectable under current test conditions described in Note 2.
Table 4. CLA Series Parts – Die Packages
Part Number
Typical Top Contact Diameter (mils/mm)
Die Drawing
CLA4601-000
1.05/0.027
150–806
CLA4602-000
1.15/0.029
150–806
CLA4603-000
2.00/0.051
149–815
CLA4604-000
1.65/0.042
150–806
CLA4605-000
2.00/0.051
150–813
CLA4606-000
2.25/0.057
149–815
CLA4607-000
3.50/0.089
149–815
CLA4608-000
6.50/0.165
149–815
CLA4609-000
4.00/0.102
150–813
CLA4610-000
2.75/0.070
149–815
CLA4611-000
4.1/0.104
150-801
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CLA SERIES DIODES
Typical Performance Characteristics
(Tested at 25 °C, 2.6 GHz, Z0 = 50 Ω)
40
CLA4601
CLA4602
CLA4603
CLA4604
CLA4605
CLA4606
10
5
0
5
10
15
20
25
30
35
40
25
20
CLA4607
CLA4608
CLA4609
CLA4610
CLA4611
15
10
5
0
45
0
5
10
–5
–5
–25
Insertion Loss (dB)
0
CLA4601
CLA4602
CLA4603
CLA4604
CLA4605
CLA4606
0
5
10
Y0385
Insertion Loss (dB)
0
–20
15
20
25
30
25
30
35
40
45
Figure 2. CLA4607 to CLA4611 CW Output vs Input Power
Figure 1. CLA4601 to CLA4606 CW Output vs Input Power
–15
20
Input Power (dBm)
Input Power (dBm)
–10
15
35
40
45
Power In (dBm)
Figure 3. CLA4601 to CLA4606 Insertion Loss vs CW Input Power
–10
CLA4607
CLA4608
CLA4609
CLA4610
CLA4611
–15
–20
–25
–10
–5
0
+5
Y1829
0
30
Y1828
Output Power (dBm)
35
15
Y0383
Output Power (dBm)
20
+10 +15 +20 +25 +30 +35 +40 +45
Power In (dBm)
Figure 4. CLA4607 to CLA4611 Insertion Loss vs CW Input Power
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CLA SERIES DIODES
Technical Description
The CLA4603-000, CLA4606-000 through CLA4608-000, and
CLA4610-000 limiter diodes are constructed in a passivated
flat-chip configuration and are available in a basic chip form.
Limiter diodes with lower capacitance values to 0.08 pF and
constructed with a passivated mesa configuration are available in
the CLA4601-000, CLA4602-000, CLA4604-000, CLA4605-000
and CLA4611-000 series. The mesa devices offer low
capacitance and, therefore, broader bandwidth, lower loss, and
faster response at reduced power. These diodes are also available
in chip form and represent the ultimate in limiter performance not
approached by other manufacturers.
The highest power CLA4609 diodes use a mesa construction.
Additional bonding and handling methods are contained in these
Skyworks Application Notes:
 Waffle Pack Chip Carrier Handling/Opening Procedure
(document #200146)
 Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods
and Packaging (document #200532).
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CLA SERIES DIODES
Package Outline Drawings
Package outline die drawings for the CLA diode series are shown
in Figures 5, 6, and 7.
Schematic
1
Anode
Top Contact, Gold
0.002 (0.051 mm)
Dia. Min.
2
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.004 (0.10 mm)
0.006 (0.15 mm) Nom.
1
Cathode Metallized Back
Contact, Gold
2
S1565
Figure 5. 149-815 Package
Schematic
1
Anode
Metallized
Gold Dot
0.010 (0.254 mm) Min.
0.014 (0.356 mm) Max. Sq.
2
150-801:
0.002 (0.051 mm) Min.
150-806:
0.0011 (0.028 mm) Nom.
0.004 (0.100 mm) Min.
0.006 (0.152 mm) Max.
1
Silicon
2
Cathode Metallized Back
Contact: Gold
S1567
Figure 6. 150 Series Package
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • CLA SERIES DIODES
Schematic
1
Metallized Gold Dot
0.002 (0.01 mm) Min. Dia.
2
0.014 ± 0.001
(0.356 ± 0.025 mm)
0.014 ± 0.001
(0.356 ± 0.025 mm)
Silicon
Metallized Back
Contact Gold
1
0.005
(0.13 mm) Nom.
2
Dimensions are in inches (millimeters shown in parentheses)
S1566
Figure 7. 150-813 Package
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DATA SHEET • CLA SERIES DIODES
Copyright © 2002-2009, 2012-2015 Skyworks Solutions, Inc. All Rights Reserved.
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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