Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
Silicon Beamless Schottky Diodes: Pairs and Quads
Applications
 Microwave MIC assembly and automated high volume
manufacturing lines
 Mixers
Die Attach Methods
Features
 Three barrier heights for optimized mixer performance
All leadless chips are compatible with both eutectic and
conductive epoxy die attach methods. Eutectic processes use
Sn/Au or Sn/Pb solder. Nonconductive die attach is
recommended.
 Wide product range: series pair, ring, bridge, and eight-diode
rings
Packing Methods
 Use in ring or crossover designs in double balanced mixers
1. Gel pak
 Virtually any LO requirement can be met with choice of barrier
height
2. Wafer on film frame (rejects are marked with ink):
 Mechanically rugged design
 100% DC tested on water
 Available on film frame or waffle pack
– Diced, ready for pick and place
– Unsawn, whole wafer, 7-mil thick, maximum
Wire Bonding
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Two methods can be used to connect wire, ribbon, or wire mesh
to the chips:
 Thermocompression
 Ballbonding
Skyworks recommends use of pure gold wire.
Description
Skyworks beamless diode family is designed for a high degree of
device reliability in both commercial and industrial uses. The
diodes are designed to offer the utmost in performance as well as
achieving price sensitive cost targets for commercial systems.
Electrical and Physical Specifications
Absolute maximum ratings for the beamless Schottky diodes are
provided in Table 1. Electrical specifications are noted in Table 2.
SPICE model parameters are defined in Table 3.
A typical bonding configuration is illustrated in Figure 1.
Assembly and Handling Procedure
The process flow for assembly is:
 Die attach using nonconductive epoxy
 Wire bond
 Encapsulation (nonconductive epoxy)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 15, 2014
1
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Table 1. Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
–
Peak inverse voltage
PIV
VB
Supply current
IMAX
50
mA/V
Power dissipation (CW)
PDISS
75
mW/junction
Storage temperature
TSTG
–65
+175
C
Operating temperature
TOP
–65
+150
C
Electrostatic discharge:
ESD
< 250
V
Human Body Model (HBM), Class 0
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. Electrical Specifications (Per Junction) (1 of 2) (Note 1)
Part Number
Band
Barrier
VF
IF = 1.0 mA
(mV)
ΔVF
IF = 1.0 mA
(mV)
CJ (Note 2)
VR = 0 V,
f = 1 MHz
(pF)
RS
IF = 5 mA
(Ω)
VB
@ 10 μA
(V)
Min
Max
Max
Min
Max
Max
Min
Outline
Drawing
Number
Ring Quad (Note 3)
DMF3926-000
S
Low
200
260
10
0.30
0.50
5
–
551-002
DME3927-000
S
Medium
300
400
10
0.30
0.50
5
–
551-002
DMJ3928-000
S
High
500
600
10
0.30
0.50
5
–
551-002
DMF3942-000
X
Low
250
310
10
0.15
0.30
8
–
551-002
DME3943-000
X
Medium
325
425
10
0.15
0.30
8
–
551-002
DMJ3944-000
X
High
550
650
10
0.15
0.30
8
–
551-002
DMF3929-000
S
Low
200
260
10
0.30
0.50
5
2
551-004
DME3930-000
S
Medium
300
400
10
0.30
0.50
5
3
551-004
DMJ3931-000
S
High
500
600
10
0.30
0.50
5
4
551-004
DMF4102-000
X
Low
250
310
10
0.15
0.3
14
2
551-004
DME4101-000
X
Medium
325
425
10
0.15
0.3
14
3
551-004
DMJ4103-000
X
High
550
650
10
0.15
0.3
14
4
551-004
Bridge Quad (Note 3)
Series Pair (Note 3)
DMF3932-000
S
Low
200
260
10
0.30
0.50
5
2
551-012
DME3933-000
S
Medium
300
400
10
0.30
0.50
5
3
551-012
DMJ3934-000
S
High
500
600
10
0.30
0.50
5
4
551-012
Back-to-Back Ring Series Pair (Note 3)
DMF3935-000
S
Low
200
260
10
0.30
0.50
5
–
551-056
DME3936-000
S
Medium
300
400
10
0.30
0.50
5
–
551-056
DMJ3937-000
S
High
500
600
10
0.30
0.50
5
–
551-056
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Table 2. Electrical Specifications (Per Junction) (2 of 2) (Note 1)
Part Number
Band
Barrier
CJ (Note 2)
VR = 0 V,
f = 1 MHz
(pF)
ΔVF
IF = 1.0 mA
(mV)
VF
IF = 1.0 mA
(mV)
RS
IF = 5 mA
(Ω)
VS
@ 10 μA
(V)
Outline
Drawing
Number
Min
Max
Max
Min
Max
Max
Min
400
520
15
0.15
0.30
16
–
556-020
Octoquad Ring (Note 4)
DMF3938-000
S-X
Low
DME3939-000
S-X
Medium
600
800
15
0.15
0.30
16
–
556-020
DMJ3940-000
S-X
High
1000
1200
15
0.15
0.30
16
–
556-020
Back-to-Back Crossover Quad, to 6 GHz
DMF3945-000
S
Low
200
260
15
0.30
0.50
5
–
588-065
DME3946-000
S
Medium
300
400
15
0.30
0.50
5
–
588-065
DMJ3947-000
S
High
525
625
15
0.30
0.50
5
–
588-065
Note 1. Performance is guaranteed only under the conditions listed in this table.
Note 2: Cj represents total capacitance. Maximum Cj unbalance @ 0 V, 1 MHz = 0.25 pF.
Note 3: Matching criteria Vf @ 1 mA ≤ 15 mV available for matched sets.
Note 4: Matching criteria Vf @ 1 mA ≤ 20 mV available for matched sets.
Table 3. SPICE Model Parameters (Per Junction)
Part
Number
Prefix
IS
(A)
RS
(Ω)
N
TT
(s)
CJO
(pF)
M
EG
(eV)
VJ
(V)
XTI
FC
BV
(V)
IBV
(A)
DMF3926
2.5 x 10–7
4
1.04
1 x 10–11
0.42
0.32
0.69
0.51
2
0.5
2
1 x 10–5
DME3927
1.3 x 10–9
4
1.04
1 x 10–11
0.39
0.34
0.69
0.65
2
0.5
3
1 x 10–5
4
1.04
1 x 10
–11
0.39
0.42
0.69
0.84
2
0.5
3
1 x 10–5
–13
DMJ3926
9.0 x 10
DMF4102
1.1 x 10–7
6
1.04
1 x 10–11
0.22
0.32
0.69
0.495
2
0.5
2
1 x 10–5
DME4101
2.4 x 10–9
6
1.04
1 x 10–11
0.20
0.37
0.69
0.595
2
0.5
3
1 x 10–5
1.04
–11
0.20
0.42
0.69
0.800
2
0.5
4
1 x 10–5
DMJ4103
8.5 x 10
–13
6
1 x 10
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014
3
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
1
3
Ring Quad
2
1
4
Bond Pad
3
Crossover Quad
2
4
Bond Pad
S3542
Figure 1. Typical Bonding Configuration
Package Information
Skyworks silicon beamless Schottky diodes are provided in Gel
paks and on film frame. Package dimensions are provided in
Figures 2 through 7.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Schematic
2
1
Schematic
3
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
4
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
2
2
2
1
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
1
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
3
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
3 Plcs.
4
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
1
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3544
S3543
Figure 3. 551-012 Package Dimensions
Figure 2. 551-002 Package Dimensions
Schematic
2
1
1
2 4
3
0.020 in (0.500 mm)
± 0.001 in (0.025 mm)
Schematic
3
4
2
1
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
4
1
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
017-1
0.020 in (0.500 mm)
± 0.001 in (0.025 mm)
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
3
0.004 x 0.004 in
(0.10 x 0.10 mm)
4 Plcs.
2
4
0.020 in (0.500 mm)
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
0.006 in (0.180 mm)
± 0.001 in (0.025 mm)
S3546
Figure 4. 551-056 Package Dimensions
S3545
Figure 5. 556-020 Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014
5
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
2
Schematic
2
1
3
1
3
6
4
Schematic
1
6
4
5
5
4
2
0.025 in (0.62 mm)
Au-plated bond pad
0.003 in (0.08 mm) Sq. 6 Plcs.
0.003 in (0.08 mm)
0.008 in (0.20 mm)
0.016 in (0.40 mm)
3
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
4
0.013 in (0.31 mm)
0.004 in (0.09 mm)
3
0.003 in (0.09 mm)
0.008 in (0.20 mm)
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
0.017 in (0.42 mm)
2
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
1
0.022 in (0.54 mm)
0.007 in (0.17 mm)
Measurement tolerance = ± 0.001 in (± 0.025 mm)
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3548
S3547
Figure 6. 588-065 Package Dimensions
Figure 7. 551-004 Package Dimensions
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
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August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D