DATA SHEET Silicon Beamless Schottky Diodes: Pairs and Quads Applications Microwave MIC assembly and automated high volume manufacturing lines Mixers Die Attach Methods Features Three barrier heights for optimized mixer performance All leadless chips are compatible with both eutectic and conductive epoxy die attach methods. Eutectic processes use Sn/Au or Sn/Pb solder. Nonconductive die attach is recommended. Wide product range: series pair, ring, bridge, and eight-diode rings Packing Methods Use in ring or crossover designs in double balanced mixers 1. Gel pak Virtually any LO requirement can be met with choice of barrier height 2. Wafer on film frame (rejects are marked with ink): Mechanically rugged design 100% DC tested on water Available on film frame or waffle pack – Diced, ready for pick and place – Unsawn, whole wafer, 7-mil thick, maximum Wire Bonding Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Two methods can be used to connect wire, ribbon, or wire mesh to the chips: Thermocompression Ballbonding Skyworks recommends use of pure gold wire. Description Skyworks beamless diode family is designed for a high degree of device reliability in both commercial and industrial uses. The diodes are designed to offer the utmost in performance as well as achieving price sensitive cost targets for commercial systems. Electrical and Physical Specifications Absolute maximum ratings for the beamless Schottky diodes are provided in Table 1. Electrical specifications are noted in Table 2. SPICE model parameters are defined in Table 3. A typical bonding configuration is illustrated in Figure 1. Assembly and Handling Procedure The process flow for assembly is: Die attach using nonconductive epoxy Wire bond Encapsulation (nonconductive epoxy) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200793D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 15, 2014 1 DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES Table 1. Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units – Peak inverse voltage PIV VB Supply current IMAX 50 mA/V Power dissipation (CW) PDISS 75 mW/junction Storage temperature TSTG –65 +175 C Operating temperature TOP –65 +150 C Electrostatic discharge: ESD < 250 V Human Body Model (HBM), Class 0 Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. Electrical Specifications (Per Junction) (1 of 2) (Note 1) Part Number Band Barrier VF IF = 1.0 mA (mV) ΔVF IF = 1.0 mA (mV) CJ (Note 2) VR = 0 V, f = 1 MHz (pF) RS IF = 5 mA (Ω) VB @ 10 μA (V) Min Max Max Min Max Max Min Outline Drawing Number Ring Quad (Note 3) DMF3926-000 S Low 200 260 10 0.30 0.50 5 – 551-002 DME3927-000 S Medium 300 400 10 0.30 0.50 5 – 551-002 DMJ3928-000 S High 500 600 10 0.30 0.50 5 – 551-002 DMF3942-000 X Low 250 310 10 0.15 0.30 8 – 551-002 DME3943-000 X Medium 325 425 10 0.15 0.30 8 – 551-002 DMJ3944-000 X High 550 650 10 0.15 0.30 8 – 551-002 DMF3929-000 S Low 200 260 10 0.30 0.50 5 2 551-004 DME3930-000 S Medium 300 400 10 0.30 0.50 5 3 551-004 DMJ3931-000 S High 500 600 10 0.30 0.50 5 4 551-004 DMF4102-000 X Low 250 310 10 0.15 0.3 14 2 551-004 DME4101-000 X Medium 325 425 10 0.15 0.3 14 3 551-004 DMJ4103-000 X High 550 650 10 0.15 0.3 14 4 551-004 Bridge Quad (Note 3) Series Pair (Note 3) DMF3932-000 S Low 200 260 10 0.30 0.50 5 2 551-012 DME3933-000 S Medium 300 400 10 0.30 0.50 5 3 551-012 DMJ3934-000 S High 500 600 10 0.30 0.50 5 4 551-012 Back-to-Back Ring Series Pair (Note 3) DMF3935-000 S Low 200 260 10 0.30 0.50 5 – 551-056 DME3936-000 S Medium 300 400 10 0.30 0.50 5 – 551-056 DMJ3937-000 S High 500 600 10 0.30 0.50 5 – 551-056 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES Table 2. Electrical Specifications (Per Junction) (2 of 2) (Note 1) Part Number Band Barrier CJ (Note 2) VR = 0 V, f = 1 MHz (pF) ΔVF IF = 1.0 mA (mV) VF IF = 1.0 mA (mV) RS IF = 5 mA (Ω) VS @ 10 μA (V) Outline Drawing Number Min Max Max Min Max Max Min 400 520 15 0.15 0.30 16 – 556-020 Octoquad Ring (Note 4) DMF3938-000 S-X Low DME3939-000 S-X Medium 600 800 15 0.15 0.30 16 – 556-020 DMJ3940-000 S-X High 1000 1200 15 0.15 0.30 16 – 556-020 Back-to-Back Crossover Quad, to 6 GHz DMF3945-000 S Low 200 260 15 0.30 0.50 5 – 588-065 DME3946-000 S Medium 300 400 15 0.30 0.50 5 – 588-065 DMJ3947-000 S High 525 625 15 0.30 0.50 5 – 588-065 Note 1. Performance is guaranteed only under the conditions listed in this table. Note 2: Cj represents total capacitance. Maximum Cj unbalance @ 0 V, 1 MHz = 0.25 pF. Note 3: Matching criteria Vf @ 1 mA ≤ 15 mV available for matched sets. Note 4: Matching criteria Vf @ 1 mA ≤ 20 mV available for matched sets. Table 3. SPICE Model Parameters (Per Junction) Part Number Prefix IS (A) RS (Ω) N TT (s) CJO (pF) M EG (eV) VJ (V) XTI FC BV (V) IBV (A) DMF3926 2.5 x 10–7 4 1.04 1 x 10–11 0.42 0.32 0.69 0.51 2 0.5 2 1 x 10–5 DME3927 1.3 x 10–9 4 1.04 1 x 10–11 0.39 0.34 0.69 0.65 2 0.5 3 1 x 10–5 4 1.04 1 x 10 –11 0.39 0.42 0.69 0.84 2 0.5 3 1 x 10–5 –13 DMJ3926 9.0 x 10 DMF4102 1.1 x 10–7 6 1.04 1 x 10–11 0.22 0.32 0.69 0.495 2 0.5 2 1 x 10–5 DME4101 2.4 x 10–9 6 1.04 1 x 10–11 0.20 0.37 0.69 0.595 2 0.5 3 1 x 10–5 1.04 –11 0.20 0.42 0.69 0.800 2 0.5 4 1 x 10–5 DMJ4103 8.5 x 10 –13 6 1 x 10 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014 3 DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES 1 3 Ring Quad 2 1 4 Bond Pad 3 Crossover Quad 2 4 Bond Pad S3542 Figure 1. Typical Bonding Configuration Package Information Skyworks silicon beamless Schottky diodes are provided in Gel paks and on film frame. Package dimensions are provided in Figures 2 through 7. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES Schematic 2 1 Schematic 3 3 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 4 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 2 2 2 1 0.0035 in (0.089 mm) ± 0.0035 in (0.089 mm) 4 Plcs. 1 3 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 3 0.0035 in (0.089 mm) ± 0.0035 in (0.089 mm) 3 Plcs. 4 0.006 in (0.18 mm) ± 0.001 in (0.025 mm) 1 0.006 in (0.18 mm) ± 0.001 in (0.025 mm) S3544 S3543 Figure 3. 551-012 Package Dimensions Figure 2. 551-002 Package Dimensions Schematic 2 1 1 2 4 3 0.020 in (0.500 mm) ± 0.001 in (0.025 mm) Schematic 3 4 2 1 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 4 1 0.0035 in (0.089 mm) ± 0.0035 in (0.089 mm) 4 Plcs. 017-1 0.020 in (0.500 mm) ± 0.001 in (0.025 mm) 3 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 3 0.004 x 0.004 in (0.10 x 0.10 mm) 4 Plcs. 2 4 0.020 in (0.500 mm) 0.006 in (0.18 mm) ± 0.001 in (0.025 mm) 0.006 in (0.180 mm) ± 0.001 in (0.025 mm) S3546 Figure 4. 551-056 Package Dimensions S3545 Figure 5. 556-020 Package Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014 5 DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES 2 Schematic 2 1 3 1 3 6 4 Schematic 1 6 4 5 5 4 2 0.025 in (0.62 mm) Au-plated bond pad 0.003 in (0.08 mm) Sq. 6 Plcs. 0.003 in (0.08 mm) 0.008 in (0.20 mm) 0.016 in (0.40 mm) 3 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 4 0.013 in (0.31 mm) 0.004 in (0.09 mm) 3 0.003 in (0.09 mm) 0.008 in (0.20 mm) 0.0035 in (0.089 mm) ± 0.0035 in (0.089 mm) 4 Plcs. 0.017 in (0.42 mm) 2 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 1 0.022 in (0.54 mm) 0.007 in (0.17 mm) Measurement tolerance = ± 0.001 in (± 0.025 mm) 0.006 in (0.18 mm) ± 0.001 in (0.025 mm) S3548 S3547 Figure 6. 588-065 Package Dimensions Figure 7. 551-004 Package Dimensions Copyright © 2002-2009, 2011, 2012-2014 Skyworks Solutions, Inc. 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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D