Data Sheets - Skyworks Solutions, Inc.

PRELIMINARY DATA SHEET
SE2605L: High Power (+26 dBm) 802.11n WLAN Power
Amplifier with Integrated Power Detector
Applications
Description
 IEEE 802.11n WLAN enabled:
 Access points
 Media gateways
 Set top boxes
 LCD TVs
The SE2605L is a 2 GHz Microwave Monolithic Integrated Circuit
(MMIC) Power Amplifier (PA) with superior output power, linearity,
and efficiency. These features make the SE2605L ideal for
Wireless Local Area Network (WLAN IEEE 802.11n) applications.
Features
The device is fabricated using SiGe BiCMOS technology. The
device is internally matched and mounted in a 20-pin, 4 x 4 mm
Quad Flat No-Lead (QFN) Surface-Mounted Technology (SMT)
package, which allows for a highly manufacturable low cost
solution.
Linear output power for IEEE 802.11n, 64-QAM,
EVM ≤ 3% = +26 dBm @ 5.0 V
The device package and pinout for the 16-pin QFN are shown in
Figure 1. A block diagram of the SE2605L is shown in Figure 2.
 Other broadband triple-play multimedia applications
 High gain: 32 dB
VCC2
14
13
12 GND
EN
2
11 RF_OUT
GND
3
10 RF_OUT
VCC0
4
5
6
7
8
N/C
9 GND
DET
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
15
1
GND
 Small footprint QFN (16-pin, 3 x 3 mm) SMT package (MSL1,
260 C per JEDEC J-STD-020)
16
RF_IN
GND
 Load insensitive power detector
N/C
 Fully matched at RF input/output ports
VCC1
 Superior gain flatness
GND
 Power shutdown mode
Y0251
Figure 1. SE2605L Pinout – 16-Pin QFN
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Bias
Input
Match
RF_IN
Inter-Stage
Match
Inter-Stage
Match
RF_OUT
Y0252
PA_EN
Detector
VCC1
VCC2
VDET
VCC3
Figure 2. SE2605L Block Diagram
Technical Description
Electrical and Mechanical Specifications
The SE2605L PA contains all of the needed RF matching and DC
biasing circuits. The device also provides an output power
detector voltage.
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SE2605L are provided in Table 2. Recommended operating
conditions are specified in Table 3. Electrical specifications are
provided in Tables 4, 5, and 6.
The SE2605L is a three-stage, SiGe BiCMOS device optimized for
high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WiFi systems or WLANs).
Typical performance characteristics of the SE2605L are illustrated
in Figures 3 through 8.
The device has been characterized with the highest specified data
rates for IEEE 802.11n (64 QAM). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
Table 1. SE2605L Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
RF IN
RF Input
9
GND
Ground
2
EN
Power amplifier enable
10
RF OUT
RF output
3
GND
Ground
11
RF OUT
RF output
4
VCC0
Power supply for bias circuit
12
GND
Ground
5
GND
Ground
13
VCC2
Power supply for second stage
6
GND
Ground
14
N/C
Not connected. Can be left floating or grounded.
7
DET
Power detector output
15
VCC1
Power Supply driver stages
8
N/C
Not connected. Can be left floating or grounded.
16
GND
Ground
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Table 2. SE2605L Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
V
Supply voltage
VCC1, VCC2, VCC3
–0.3
+5.5
Enable voltage
PA_EN
–0.3
+3.6
V
RF input power
PIN
+12
dBm
Operating temperature
TOP
–40
+85
C
Storage temperature
TST
–40
+150
C
Junction temperature
TJ
+160
C
Thermal resistance
ΘJC
13
C/W
Electrostatic discharge:
ESD
1000
V
Human Body Model (HBM), Class 1C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2605L Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
3.0
5.00
5.25
V
3.6
V
+25
+85
C
Supply voltage
VCC1, VCC2, VCC3
Enable voltage
PA_EN
1.8
Case operating temperature
TOP
–40
Table 4. SE2605L Electrical Specifications: DC Characteristics (Note 1)
(VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C as Measured on the Evaluation Board, Unless Otherwise Noted)
Parameter
Supply current
Symbol
ICC
Quiescent Current
ICQ
Enable voltage:
High
Low
PAEN_H
PAEN_L
Enable current
IEN
Enable pin input impedance
ZEN
Test Condition
Min
Typical
Max
Units
POUT = +26 dBm,
MCS7, 54 Mbps, 64 QAM
400
500
560
mA
POUT = +29 dBm, 11Mbps,
CCK signal, BT = 0.45
600
650
690
PA_EN = 0 V, No RF
10
100
No RF
220
802.11n:
μA
3.6
0.5
1.8
0
Passive pull down
mA
V
V
300
μA
10
kΩ
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Table 5. SE2605L Electrical Specifications: General (Note 1)
(VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Frequency range
f
Output power
POUT
1 dB output compression point
OP1dB
Small signal gain
|S21|
Test Condition
Min
Typical
2.4
Max
Units
2.5
GHz
54 Mbps OFDM signal, 64 QAM,
3% EVM
+24
+26
11 Mbps CCK signal,
BT = 0.045 , mask
+27
+29
dBm
PIN = CW
+29
+32
dBm
30
33
10
dBm
36
dB
Input return loss
|S11|
15
dB
Gain variation
 S21
Over 40 MHz channel
Over entire band
0.5
1.0
dB
dB
2nd and 3rd harmonics
2fo, 3fo
POUT = +29 dBm
–50
Rise and fall time
tR, tF
50% of VEN edge to 10%/90%
of final power level
Stability
POUT = +29 dBm,
VSWR = 4:1, all phases
Ruggedness
Ru
–45
dBm/MHz
μs
0.5
All non-harmonically related outputs
< –42 dBm/MHz
PIN = +12dBm, 50% duty cycle,
VSWR = 6:1, all phases
No damage
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 6. SE2605L Electrical Specifications: Power Detector Characteristics (Note 1)
(VCC = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, f = 2.45 GHz, Unless Otherwise Noted)
Parameter
Symbol
Output power detector range
PDR
Detector voltage
VDET
Test Condition
Min
Typical
0
Max
Units
OP1dB
dBm
POUT = +30 dBm
0.90
1.00
1.15
V
POUT = +26 dBm
0.65
0.73
0.82
V
POUT = 5 dB
0.30
0.33
0.36
V
VSWR = 3:1
–1.5 to +1.5 dB
–1.5
Detector accuracy
ERRDET
Output impedance
PDZOUT
2.3
kΩ
DC load impedance
PDZLOAD
26.5
kΩ
+1.5
Note 1: Performance is guaranteed only under the conditions listed in this table.
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dB
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Evaluation Board Description
The SE2605L Evaluation Board is used to test the performance of
the SE2605L WLAN PA. A schematic diagram of the SE2605L
Evaluation Board is shown in Figure 3. A photograph of the
Evaluation Board is shown in Figure 4. Component values for the
SE2605L Evaluation Board are listed in Table 7.
 The RF lines should be well separated from each other with
solid ground in between traces to maximize input-to-output
isolation.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Evaluation Board Setup Procedure
Step 1: Connect system ground to pin 1 of connector J5.
 Paths to ground should be made as short as possible.
Step 2: Apply 5.0 V to pins 3 and 4 of connector J5.
 The ground pad of the SE2605L has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device.
Step 3: By applying 3.3 V on PA_EN (pin 1 of the J4 header), the
PA is enabled. By placing a ground on PA_EN, the PA is
disabled and placed in a shutdown state, drawing
minimal current.
 Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required. For further information,
refer to the Skyworks Application Note PCB Design Guidelines
for High Power Dissipation Packages, document number
201211.
Step 4: The 2 GHz amplifier performance can be monitored by
applying an RF signal to connector J1 (RF_IN). Monitor
the output power on the RF_OUT port connector, J1.
Step 5: Detector performance can be monitored on pin 4 of
connector J4.
Do not overdrive the amplifier by applying too much RF on the
device input. A suitable starting input power setting is –20 dBm.
 Bypass capacitors should be used on the DC supply lines. Refer
to the schematic drawing in Figure 3 for further details.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Package Dimensions
when the part is subjected to high temperature during solder
assembly.
The PCB layout footprint for the SE2605L is provided in Figure 5.
Typical case markings are shown in Figure 6. Package
dimensions for the 16-pin QFN are shown in Figure 7, and tape
and reel dimensions are provided in Figure 8.
The SE2605L is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
J5
1
VCC
VCC
R2
91 Ω
C5
10 pF
C3
1 μF
C4
DNI
VCC0 / N/C
2
VCC
3
VCC
4
C6
1 nF
5
Header 5
VCC
RF Input
J1
SMA
1
C2
DNI
2
VEN
C7
DNI
17
16
15
PAD
GND
VCC1
14
N/C
EN
SE2605L
VCC0
GND
GND
5
C20
100 nF
GND
6
DET
7
N/C
8
C10
DNI
C12
2.2 pF
C11
4.7 μF
12
R3
0Ω
11
10
C18
3.3 pF
T1
C15
L3
T5
T3
9
C14
2.4 pF
50 Ω
1.5 nH
T2
15 pF
T4
C16
2.4 pF
C17
1.2 pF
U1
VDET
Header 4
4
RF_OUT
RF_OUT
GND
VCC0 / N/C
C9
DNI
GND
RF_IN
3
4
13
VCC2
VDET
R1
26.1K
C19
DNI
3
2
1
VEN
J4
Y0254
Figure 3. SE2605L Evaluation Board Schematic
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J2
SMA
PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Y0262
Figure 4. SE2605L Evaluation Board
Table 7. SE2605L Evaluation Board Bill of Materials
Component
C2,C4,C7,C9,C10,C19
Quantity
6
Value
Vendor
Part Number
DNI
C3
1
1 μF
Murata
GRM155R60J105KE19
C5
1
10 Pf
Murata
GRM1555C1H100JZ01
C6
1
1 nF
Murata
GRM155R71H102KA01
C11
1
4.7 μF
Murata
GRM188R60J475KE19
C12
1
2.2 pF
Murata
GRM1555C1H2R2CZ01
C14 and C16
2
2.4 pF
Murata
GRM1555C1H2R4CZ01
C15
1
1.2 pF
Murata
GRM1555C1H150JZ01
C17
1
3.3 pF
Murata
GRM1555C1H1R2CZ01
C18
1
27 Ω
Murata
GRM1555C1H3R3CZ01
C20
1
100 nF
Murata
GRM155R61A104KA01
J1 and J2
2
SMA
Johnson
142-0701-851
J4
1
Header 4
Samtec
TSW-104-07-G-S
J5
1
Header 5
Samtec
TSW-105-07-G-S
L3
1
1.5 nH
Murata
LQG15HN1N5S02D
PCB1
1
Z264-B
Skyworks
Z264-B
R1
1
26.7 K
Panasonic
ERJ2RKF2672
R2
1
91 Ω
Panasonic
ERJ2GEJ910
R3
1
0Ω
Panasonic
ERJ3GEJ0R0
SE2605L
Skyworks
SE2605L
U1
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
3 x 3 QFN
Package Outline
3.20
0.25 Typ
0.50 Typ
16
15
14
3.20
3.30
0.35 Typ
16
13
15
14
0.25 Typ
0.50 Typ
13
16
15
14
13
0.60 Typ
1
12
2
11
1
12
1
12
2
11
2
11
3
10
4
9
3.30
3.20
1.80
3
10
4
9
0.58
Typ
0.500
Typ
1.70
3
10
4
9
0.500
Typ
3.20
0.10
0.675 Typ
0.500
Typ
5
6
7
8
5
5X Ø0.254
0.58 Typ
6
7
5
8
6
7
8
0.675 Typ
0.10
1.70
1.80
Board Metal and Via Pattern
(Note 4)
Stencil Pattern
(Note 5)
Solder Mask Pattern
(Note 6)
NOTES:
63% Solder Coverage on Center Pad
1.
2.
3.
4.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Unless specified, dimensions are symmetrical about center lines.
Via hole recommendations:
Size (Ø): 0.150 to 0.300 mm
Pitch: 0.500
Cu via wall plating: 30-35 μm
Should be tented with solder mask on PCB backside and filled with solder.
5. Stencil recommendations: 0.127 mm stencil thickness.
6. Solder mask recommendations: Aperture array to tarret approximately 50 to 80% coverage
of solder mask openings, except as noted.
Y0264
Figure 5. PCB Layout Footprint for the SE2605L
Pin 1
Indicator
Pin 1
Indicator
SiGe
2605L
XXXXX
Part Number
Lot Code
SKY
2605L
XXXXX
Part Number
Lot Code
Y0189
Figure 6. Typical Case Markings
(Top View)
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
2X
A
3.000 ±0.050
0.15 C
1.700 ±0.050
0.10 M C A B
0.850 ±0.050
See Note 3
B
16
15
14
0.300 X 45°
0.203 Ref.
13
1
12
2
11
13
1.700 ±0.050
3.000 ±0.050
3
10
4
9
14
15
16
12
1
11
2
10
3
0.500
R0.075 Typ.
9
4
0.10 M C A B
0.15 C
5
6
7
8
0 – 0.05
Seating
Plane
8
16X 0.250 ±0.050
7
0.10 M C A B
0.05 M C
C
Top View
6
5
16X 0.350 ±0.050
Bottom View
NOTES:
1. All measurements are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance: Angular Tolerance:
X.X (1 place) ± 0.1 mm
±1°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Terminal #1 identification mark located within marked area.
4. Coplanarity applies to the exposed heat sink ground pad as well as the terminals.
5. Unless specified, dimensions are symmetrical about center lines.
Y0265
Figure 7. SE2605L 16-Pin QFN Package Dimensions
1.13 ± 0.10 (Ko)
4.00 ± 0.10
∅1.50
2.00 ± 0.05
± 0.10
1.75 ± 0.10
B
A
5.50 ± 0.05
8.00 ± 0.10
Reference Pin
Indicator
A
4.25 ± 0.10
10o Max
B
∅1.50
12.00 +0.30/–0.10
2X
± 0.25
0.229 ± 0.02 (T)
B
10o Max
Notes:
1. Carrier tape material: black conductive polycarbonate
or polysterene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC
tape and reel specification.
5. Tolerance: .XX = ±0.10
6. All measurements are in millimeters
4.25 ± 0.10 (Ao)
A
S2585
Figure 8. SE2605L 16-Pin QFN Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA
Ordering Information
Model Name
SE2605L High Power WLAN Power Amplifier
Manufacturing Part Number
SE2605L
Evaluation Board Part Number
SE2605L-EK1
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