DATA SHEET SE2623L: 2.4 GHz High Power Wireless LAN Power Amplifier Applications DSSS 2.4 GHz WLAN (IEEE 802.11b) EN OFDM 2.4 GHz WLANs: IEEE 802.11b/g/n 256 QAM IEEE 802.11ac VCC0 VCC2 Bias and Control Access points RF_IN PCMCIA cards RF_OUT 50 Ω DET PC cards DET Features Single 5 V supply operation: +23 dBm, EVM = 1.8 %, MCS8 +26 dBm, EVM = 3 %, 802.11g, OFDM 54 Mbps +26 dBm, ACPR < –32 dBc, 802.11b K109 Notes: • RF_IN is DC-shorted to Ground within the package. Skyworks recommends an external blocking capacitor. • RF_OUT is DC-shorted to VCC within the package. The output match should include the blocking capacitor. Figure 1. SE2623L Block Diagram +33 dB gain Integrated temperature-compensated power detector Description Digital power amplifier enable pin (VEN) The SE2623L is a 2.4 GHz Power Amplifier (PA) designed for use in the 2.4 GHz Industrial, Scientific, Medical (ISM) band for wireless Local Area Network (LAN) applications. The SE2623L device incorporates a power detector for closed loop monitoring of the output power. Small QFN (16-pin, 3.0 x 3.0 x 0.9 mm) package (MSL3, 260 °C per JEDEC J-STD-020) GND VCC1 NC VCC2 Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. 16 15 14 13 2 11 RF_OUT GND 3 10 RF_OUT VCC0 4 9 GND 7 8 NC EN DET GND GND 12 GND 1 6 The SE2623L temperature-compensated power detector is highly immune to mismatch at its output, with less than +1.5 dB of variation with a 2:1 mismatch. A block diagram of the SE2623L is shown in Figure 1. The device package and pinout for the 16-pin QFN are shown in Figure 2. RF_IN 5 The SE2623L includes a digital enable control for device on/off control. S3375 Figure 2. SE2623L Pinout—16-Pin QFN (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202397E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 27, 2014 1 DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Electrical and Mechanical Specifications The recommended operating conditions are specified in Table 3. The electrical specifications are provided in Tables 4 through 7. The typical performance characteristics of the SE2623L are illustrated in Figure 3. Signal pin assignments and functional pin descriptions are described in Table 1. The absolute maximum ratings of the SE2623L are provided in Table 2. Table 1. SE2623L Signal Descriptions Pin Name Description 1 RF_IN RF input 2 EN 3 GND 4 Pin Name Description 9 GND Ground PA enable 10 RF_OUT RF output Ground 11 RF_OUT RF output VCC0 Power supply for bias circuit 12 GND Ground 5 GND Ground 13 VCC2 Power supply for second stage 6 GND Ground 14 NC No Connect—may be left floating or grounded 7 DET Power detector output 15 VCC1 Power supply driver stages 8 NC No Connect—may be left floating or grounded 16 GND Ground Table 2. SE2623L Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units Supply voltage VCC0, VCC1, VCC2, RF_OUT –0.3 +5.5 V DC input on EN VIN –0.3 RF input power—RF out terminated in 50 Ω PIN Operating temperature range TA Junction temperature TJ Storage temperature range TSTG Electrostatic discharge: ESD –40 –40 Human Body Model (HBM), Class 1C (all pins) +3.6 V +12.0 dBm +85 °C +150 °C +150 °C 1000 V Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE2623L Recommended Operating Conditions Minimum Typical Maximum Units Ambient temperature Parameter TA Symbol –40 +25 +85 °C Supply voltage, relative to GND = 0 V VCC 4.5 5.0 5.5 V Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 February 27, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202397E DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Table 4. SE2623L Electrical Specifications: DC Characteristics (Note 1) (VCC = 5 V, EN = VENH, TA = 25 C as Measured on the Evaluation Board (De-embedded to the Device), All Unused Ports are Terminated with 50 Ω, Unless Otherwise Noted) Parameter Supply current—Sum of all VCCs Supply current Symbol Test Condition Typical Maximum Units ICC-802.11b POUT = +29 dBm, 11 Mbps CCK signal, BT = 0.45, VCC = 5.0 V Minimum 600 700 mA ICC-802.11g POUT = +26 dBm, 54 Mbps OFDM signal, 64 QAM, VCC = 5V 480 535 mA ICQ No RF 320 ICC VEN = 0 V, No RF mA 100 μA Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 5. SE2623L Electrical Specifications: AC Characteristics—802.11g/n/ac Transmit Characteristics (Note 1) (VCC = 5.0 V, EN = 3.3 V, TA = 25 C as Measured on the Evaluation Board (De-embedded to the Device), All Unused Ports are Terminated with 50 Ω, Unless Otherwise Noted) Parameter Frequency range Symbol Test Condition fL-U Minimum MCS8, HT40, 1.8% EVM +21 MCS8, HT40, 1.25% EVM Output power POUT +23 dBm dBm +26 dBm CCK signal, BT = 0.045, mask +28 +29 dBm MCS0, HT20, mask +28 +29 dBm MCS0, HT40, mask +27 +28 dBm No modulation +29 +31 dBm 10 15 dB 30 33 dB 1 dB |S11| Small signal gain |S21| PIN = –25 dBm Gain variation over band S21 PIN = –25 dBm, fIN = 2400 to 2500 MHz Rise and fall time MHz +18 Input return loss 2f Units 2500 +24 OP1dB 3f Maximum MCS7, HT20, 3% EVM +1 dB output compression point Harmonics Typical 2400 POUT = 29 dBm, 802.11b, 1 Mbps tR, tF Stability STAB CW, POUT = +29 dBm, 0.1 GHz to 20 GHz, Load VSWR = 4:1 Ruggedness RU CW, 50% duty cycle, PIN = +12 dBm, Load VSWR = 6:1 –50 –45 –50 –45 dBm/ MHz 0.50 0.75 μs All non-harmonically related outputs < –42 dBm/MHz No damage Note 1: Performance is guaranteed only under the conditions listed in this Table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202397E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 27, 2014 3 DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Table 6. SE2623L Electrical Specifications: Logic Characteristics (Note 1) (VCC = 5 V, EN = VENH, TA = 25 C as Measured on the Evaluation Board (De-embedded to the Device), All Unused Ports are Terminated with 50 Ω, Unless Otherwise Noted) Parameter Symbol Test Condition Minimum Typical Maximum Units 3.6 0.4 V 250 20 μA Logic voltage: High (module on) Low (module off) VENH VENL 1.8 0 Input current logic voltage: High Low Enable pin input impedance IENH IENL VEN = 0.4 V 1 ZEN Passive pull-down 20 kΩ Table 7. SE2623L Electrical Specifications: Power Detector Characteristics (Note 1) (VCC = 5 V, EN = VENH, TA = 25 C as Measured on the Evaluation Board, Unless Otherwise Noted) Parameter Symbol Frequency range Test Condition Minimum f Typical Maximum Units 2500 MHz +30 dBm 2400 Power detect range PDR DC source impedance on DET PDZSRC 2.0 kΩ DC load impedance PDZLOAD 26.5 kΩ Output voltage Power detect low-pass filter, –3 dB corner frequency CW, measured at RF_OUT PDVDC PDVP5 PDVP26 PDVP29 Measured into 26.5 kΩ: No RF POUT = +5 dBm CW POUT = +26 dBm CW POUT = +29 dBm CW LPF–3DB Measured into 26.5 kΩ +5 0.150 0.400 0.700 0.950 0.120 0.300 0.575 0.900 0.200 0.500 0.875 1.100 2 Note 1: Performance is guaranteed only under the conditions listed in this Table. Typical Performance Characteristics 1.1 1.0 0.9 DET (V) 0.8 0.7 0.6 0.5 0.4 2400 MHz, 5 V 2500 MHz, 5 V 0.3 0.2 0.1 +3 +5 +7 +9 +11 +13 +15 +17 +19 +21 +23 +25 +27 +29 Output Power (dBm) Figure 3. SE2623L Detector Characteristics Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 February 27, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202397E V MHz DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Evaluation Board Description Evaluation Board Test Procedure The SE2623L-EK1 Evaluation Board is used to test the performance of the SE2623L-R PA. A typical application schematic diagram is provided in Figure 4. Table 8 provides the Bill of Materials (BOM) list for Evaluation Board components. A photograph of the Evaluation Board is shown in Figure 5. 1. Connect GND to all ground pins. 2. Connect a power supply to the VCC1, VCC2, and the two RF_OUT pins. 3. If desired, connect a voltage meter to the VDET pin. 4. Connect a +3.3 V supply to EN pin. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: 5. Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of –30 dBm or less to the Evaluation Board. DO NOT enable the RF signal. Paths to ground should be made as short as possible. 6. Connect a spectrum analyzer to the RF signal output port. The ground pad of the SE2623L-R1 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note, PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. An RF inductor is required on the VCC supply line to block RF signals from the DC supply. Refer to the schematic drawing in Figure 4 for further details. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation. 7. Enable the power supply. 8. Enable the RF signal. 9. Take measurements. CAUTION: If the input signal exceeds the rated power, the Evaluation Board can be permanently damaged. NOTE: It is important to adjust the VCC voltage source so that the target supply voltage (+5) is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate. Package Dimensions Typical part markings for the SE2623L are shown in Figure 6. The PCB layout footprint for the SE2623L is provided in Figure 7. Package dimensions for the 16-pin QFN are shown in Figure 8, and tape and reel dimensions are provided in Figure 9. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2623L is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C, and can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information (Document Number 200164). Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202397E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 27, 2014 5 DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER J3 VCC0 R3 DNI R6 DNI R8 0Ω 4 5 6 7 VCC3 3 VCC1 VCC2 2 VCC0 1 R4 0Ω C4 4.7 μF R5 0Ω R9 36 Ω C10 DNI C14 100 nF R2 150 Ω C5 470 nF C7 100 nF C9 DNI C15 DNI 17 Pad 1 2 3 4 EN RF_IN EN GND VCC0 GND RF_OUT RF_OUT GND GND GND VDET GND C43 100 pF GND VCC1 GND VCC2 J1 SMA C8 DNI 16 15 14 13 VCC0 12 11 10 9 C1 3.3 pF R1 0Ω C2 2.4 pF C6 15 pF L1 1.0 nH C3 2.4 pF J2 SMA C13 1.5 pF 5 6 7 8 C12 100 nF R7 26.1K EN CLK DATA BP1 BP2 C11 DNI 1 2 3 4 5 6 7 J4 Y0742 Figure 4. SE2623L Evaluation Board Schematic Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 February 27, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202397E DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Table 8. SE2623L Evaluation Board Bill of Materials Quantity 1 Component R1 Value 0Ω Manufacturer Panasonic Mfr Part Number ERJ3GEJ0R0 Package 0603 Description Thick film chip resistor 1 L1 1.0 nH Murata LQG15HN1N0S02D 0402 1 C13 1.5 pF Murata GRM1555C1H1R5CZ01 0402 1 C1 3.3 pF Murata GRM1555C1H3R3CZ01 0402 Multilayer ceramic 1 C4 4.7 uF Murata GRM188R60J475KE19 0603 Multilayer ceramic 1 C6 15 pF Murata GRM1555C1H150JZ01 0402 Multilayer ceramic 1 R7 26.1K Panasonic ERJ2RKF2612 0402 Thick film chip resistor 1 R9 36 Ω Panasonic ERJ3GEYJ360 0603 Thick film chip resistor 1 C43 100 pF Murata GRM1555C1H101JZ01 0402 Multilayer ceramic Multilayer ceramic 1 R2 150 Ω Panasonic ERJ3GEYJ151 0603 Thick film chip resistor 1 C5 470 nF Murata GRM155R60J474KE19 0402 Multilayer ceramic QFN 300 X 300 1 U1 SE2623L Skyworks Solutions SE2623L 1 PCB1 Z464-B Skyworks Solutions Z464-B 2 C2, C3 2.4 pF Murata GRM1555C1H2R4CZ01 2 J3, J4 7X1 Samtec TSW-107-07-G-S 2 R3, R6 DNI 2 J1, J2 SMA Johnson Components 2 BP1, BP2 Value 3 R4, R5, R8 3 5 802.11g/n High Power PA PCB 0402 Multilayer ceramic 100 mil 100 mil header 0402 Do Not Install 142-0701-851 end launch SMA end launch straight jack receptacle - tab contact Skyworks Solutions printed element 0.25mm X 0.25mm Bonding pad 0Ω Panasonic ERJ2GEJ0R0 0402 Thick film chip resistor C7, C12, C14 100 nF Murata GRM155R61A104KA01 0402 Multilayer ceramic C8, C9, C10, C11, C15 DNI - - 0402 - Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202397E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 27, 2014 7 DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Y0743 Figure 5. SE2623L Evaluation Board Pin 1 Indicator SiGe 2623L XXXXX Part Number Lot Code SKY 2623L XXXXX Y0744 Figure 6. SE2623L Typical Part Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 February 27, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202397E 16 15 13 1.40 1.59 1.29 0.078 0.94 14 3X 0.64 3.40 0.95 0 3X 0.64 DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER 14 16 1.61 1.24 0.16 Typ. 1 12 2 11 11 0.483 3.40 6X 0.25 3 10 4 9 12 3X 0.64 0.500 Typ. 0 0 3 10 3X 0.64 9 1.35 8 6 14X ø0.25 Board Metal Via Pattern (Note 1) 3.40 3.50 0.65 Typ. 1.70 16 8 0 5 0.15 Typ. R0.15 Typ. 1.50 0.60 Typ. 7 6 1.27 5 1.35 15 14 Component Outline 13 15 0.20 Typ. 14 13 1 12 1 16 0.65 Typ. 2 11 2 3.40 0.20 Typ. 3.50 1.70 3 10 3 4 9 4 0.70 Typ. 0.500 Typ. 0.35 Typ. Solder Mask Pattern (Note 2) 0.60 Typ. 0.500 Typ. 0.25 Typ. 58% solder coverage on center pad Stencil Pattern (Note 3) Notes: 1. Via hole recommendations: 0.025 mm Cu via wall plating (minimum), via holes to be plated shut or plugged and capped, both sides. 2. Solder mask recommendations: Contact board fabricator for recommended solder mask offset and tolerance. 3. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures, trapezoidal walls and rounded corners offer better paste release. 4. Dimensions and tolerances according to ASME Y14.5M-1994. 5. Unless specified, dimensions are symmetrical about center lines. 6. All dimensions are in millimeters. S3376 Figure 7. SE2623L PCB Layout Footprint Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202397E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 27, 2014 9 DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER 1.700 ± 0.050 3.000 ± 0.050 0.10 C –B– –A– 0.850 ± 0.050 See Note 3 16 15 14 O.30 x 45° 0.203 Ref. 13 13 12 1 11 2 3.000 ± 0.050 3 10 4 9 14 15 16 1 12 1.700 ± 0.050 2X R0.075 Typ. 11 2 0.500 10 3 9 4 Seating Plane 2X 5 0.10 C 6 7 8 8 0.10 C 7 6 5 16X 0.230 ± 0.050 0.000 to 0.050 0.10 M C A B 0.05 M C –C– 16X 0.375 ± 0.050 Bottom Side Top Side Notes: 1. All measurements are in millimeters. 2. Dimensions and tolerances according to ASME Y14.5M-1994. Unless otherwise specified, the following values apply: Decimal Tolerance: Angular Tolerance: X.X (1 place) ± 0.1 mm ±1° X.XX (2 places) ± 0.05 mm X.XXX (3 places) ± 0.025 mm 3. Terminal #1 identification mark located within marked area. 4. Unless specified, dimensions are symmetrical about center lines. S3374 Figure 8. SE2623L 16-Pin QFN Package Dimensions ø1.00 Min. 0.30 ± 0.05 2.00 ± 0.05) (See Note 1) 4.00 ± 0.1 (See Note 2) ø1.55 ± 0.05 1.75 ± 0.1 C L A 1.10 ± 0.10 A R0.1 Typ. 8.00 ± 0.10 3.30 ± 0.05 Pin 1 Indicator Notes: 1. Measured from centerline of sprocket hole to centerline of pocket. 2. Cumulative tolerance of 10 sprocket holes: ±0.02 mm. 3. All measurements are in millimeters. S3377 Figure 9. SE2623L 16-Pin QFN Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 12.00 ± 0.10 3.30 ± 0.05 5.50 ± 0.10 (See Note 1) A February 27, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202397E DATA SHEET • SE2623L: 2.4 GHZ HIGH POWER WIRELESS LAN POWER AMPLIFIER Ordering Information Model Name SE2623L 2.4 GHz High Power Wireless LAN PA Manufacturing Part Number SE2623L Evaluation Board Part Number SE2623L-EK1 Copyright © 2012-2014 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202397E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 27, 2014 11