Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SE5003L1-R: High-Power (+19 dBm) 802.11ac WLAN Power
Amplifier with Integrated Power Detector
Applications
Description
 IEEE802.11ac WLAN enabled:
 Access points
 Media gateways
 Set-top boxes
 LCD TVs
Skyworks SE5003L1-R is a 5-GHz Microwave Monolithic
Integrated Circuit (MMIC) Power Amplifier (PA) with superior
output power, linearity, and efficiency. These features make the
SE5003L1-R ideal for Wireless Local Area Network (WLAN
IEEE 802.11ac) applications.
 Other broadband triple-play multimedia applications
The device is fabricated using Indium Gallium Phosphide (InGaP)
Heterojunction Bipolar Transistor (HBT) technology. The device is
internally matched and mounted in a 20-pin, 4 x 4 mm Quad Flat
No-Lead (QFN) Surface-Mounted Technology (SMT) package,
which allows for a highly manufacturable low-cost solution.
Features
 Linear output power of +19 dBm for IEEE 802.11ac 256-QAM,
EVM < 1.8% @ 5.0 V
 High gain of 32 dB @ 5.0 V
 3.3 to 5 V operation
The device package and pinout for the 20-pin QFN are shown in
Figure 1. A block diagram of the SE5003L1-R is shown in
Figure 2.
 Power shutdown mode
 Fully matched at RF input/output ports
VCC1
VCC2
VCC3
GND
GND
 Superior gain flatness
 Load insensitive power detector
20
19
18
17
16
GND
2
14
GND
RF_IN
3
13
RF_OUT
GND
4
12
GND
VREF
5
11
GND
6
7
8
9
10
DET
GND
N/U
15
N/U
1
SP2
N/U
SP1
 Small footprint QFN (20-pin, 4 x 4 mm) SMT package (MSL3,
260 C per JEDEC J-STD-020)
S2838
Figure 1. SE5003L1-R Pinout – 20-Pin QFN
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA
SP1
SP2
Bias
VREF
Input
Match
RF_IN
Inter-Stage
Match
Output
Match
Inter-Stage
Match
RF_OUT
Detector
VCC1
VCC2
VDET
VCC3
S2823
Figure 2. SE5003L1-R Block Diagram
Technical Description
Electrical and Mechanical Specifications
The SE5003L1-R PA contains all of the needed RF matching and
DC biasing circuits. The device also provides an output power
detector voltage.
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SE5003L1-R are provided in Table 2. Recommended operating
conditions are specified in Table 3. Electrical specifications are
provided in Tables 4 through 8.
The SE5003L1-R is a three-stage, HBT InGaP device optimized for
high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WiFi systems or WLANs).
Typical performance characteristics of the SE5003L1-R are
illustrated in Figures 3 through 8.
The device has been characterized with the highest specified data
rates for IEEE802.11ac (256 QAM). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
Table 1. SE5003L1-R Signal Descriptions
Pin #
Name
Description
Pin #
Name
Description
1
N/U
Not used; open circuit.
11
GND
Ground
2
GND
Ground
12
GND
Ground
3
RF_IN
RF input
13
RF_OUT
Power amplifier RF output
4
GND
Ground
14
GND
Ground
5
VREF
Reference voltage
15
GND
Ground
6
SP1
Port for optional capacitor to improve
dynamic EVM
16
GND
Ground
7
SP2
Port for optional capacitor to improve
dynamic EVM
17
GND
Ground
8
N/U
Not used; open circuit.
18
VCC3
Third stage supply voltage
9
N/U
Not used; open circuit.
19
VCC2
Second stage supply voltage
10
DET
Analog power detector output
20
VCC1
First stage supply voltage
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DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA
Table 2. SE5003L1-R Absolute Maximum Ratings (Note 1)
Parameter
Minimum
Maximum
Units
VCC1, VCC2
–0.3
VCC3
V
VCC3
–0.3
+6.0
V
Reference voltage
VREF
–0.3
+3.6
V
RF input power
PIN
+6
dBm
Operating temperature
TOP
–40
+85
C
Storage temperature
TST
–40
+150
C
Junction temperature
TJ
Thermal resistance
ΘJC
Electrostatic Discharge
Human Body Model (HBM), Class 1A
ESD
Supply voltage
Symbol
+160
C
43
C/W
250
V
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE5003L1-R Recommended Operating Conditions
Parameter
Supply voltage
Symbol
Minimum
Typical
Maximum
Units
VCC1, VCC2
3.0
VCC3
VCC3
V
VCC3
3.0
5.0
5.5
V
2.9
V
+25
+85
C
Reference voltage
VREF
2.8
Case operating temperature
TOP
–40
Table 4. SE5003L1-R Electrical Specifications: DC Characteristics (Note 1)
(VCC1 = VCC2 = VCC3 = 5.0 V, VREF = 2.85 V, TOP = +25 C as Measured on the Evaluation Board, Unless Otherwise Noted)
Parameter
Supply current
Symbol
ICC
Quiescent Current
ICQ
Reference voltage enabled
VREF_H
Reference voltage disabled
VREF_L
Reference voltage current
IREF
Test Condition
Min
Typical
Max
Units
POUT = +19 dBm,
5.0 V
205
240
mA
POUT = +23 dBm,
54 Mbps, 5.0 V
300
340
mA
POUT = +19 dBm, 3.3 V
200
230
mA
POUT = +21 dBm, 3.3 V
230
265
mA
VREF = 0 V, No RF
0.5
10
No RF
120
2.80
2.85
0
VREF voltage set to 2.85 V
μA
mA
2.90
0.5
10
V
V
mA
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA
Table 5. SE5003L1-R Electrical Specifications: General, 5.0 V Operation (Note 1)
(VCC1 = VCC2 = VCC3 = 5.0 V, VREF = 2.85 V, TOP = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Frequency range
f
Output power
POUT
Test Condition
Min
Typical
5.15
1 dB output compression point
OP1dB
Small signal gain
|S21|
Input return loss
|S11|
Gain variation over band
 S21
2nd and 3rd harmonics
2fo, 3fo
Rise and fall time
tR, tF
Stability
Ruggedness
Max
Units
5.90
GHz
802.11ac, MCS9,
1.8% DEVM, HT80
+17
+18
dBm
802.11ac, MCS9,
1.8% DEVM, HT40
+18
+19
dBm
802.11n, MCS7,
3% DEVM, HT40
+22
+23
dBm
802.11n, MCS0, HT40,
mask compliant
+24
PIN = CW
+28
+32
dBm
28
32
dBm
35
–11
POUT = +23 dBm
dB
dB
±1.5
dB
–45
dBm/MHz
0.5
μs
POUT = +23 dBm,
VCC = 5 V, 54 Mbps,
64 QAM, VSWR = 6:1, all
phases
All non-harmonically related outputs
< –50 dBc/100 kHz
PIN = –10 dBm, CW,
VSWR = 6:1, all phases
No damage
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 6. SE5003L1-R Electrical Specifications: General, 3.3 V Operation (1 of 2) (Note 1)
(VCC1 = VCC2 = VCC3 = 3.3 V, VREF = 2.85 V, TOP = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Frequency range
f
Output power
POUT
1 dB output compression point
OP1dB
Small signal gain
|S21|
Input return loss
|S11|
Gain variation over band
 S21
2nd and 3rd harmonics
2fo, 3fo
Rise and fall time
tR, tF
Test Condition
Min
Typical
5.15
Max
Units
5.90
GHz
802.11ac, MCS9,
1.8% DEVM, HT80
+17
+18
dBm
802.11ac, MCS9,
1.8% DEVM, HT40
+18
+19
dBm
802.11n, MCS7,
3% DEVM, HT40
+20
+21
dBm
802.11n, MCS0, HT40,
mask compliant
+22
PIN = CW
+24
+28
27
31
dBm
dBm
34
–11
±1.5
POUT = +23 dBm
–45
dB
dB
–42
0.5
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dB
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dBm/MHz
μs
DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA
Table 6. SE5003L1-R Electrical Specifications: General, 3.3 V Operation (2 of 2) (Note 1)
(VCC1 = VCC2 = VCC3 = 3.3 V, VREF = 2.85 V, TOP = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Stability
Ruggedness
Test Condition
Min
Typical
Max
POUT = +23 dBm,
VCC = 5 V, 54 Mbps,
64 QAM, VSWR = 6:1, all
phases
All non-harmonically related outputs
< –50 dBc/100 kHz
PIN = –10 dBm, CW,
VSWR = 6:1, all phases
No damage
Units
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 7. SE5003L1-R Electrical Specifications: Power Detector Characteristics for 5.0 V Operation (Note 1)
(VCC = 5.0 V, VREF = 2.85 V, TOP = +25 C, f = 5.4 GHz, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
0
Max
Units
OP1dB
dBm
Output power detector range
PDR
Detector voltage
VDET
POUT = +23 dBm
1.00
V
POUT = No RF
0.35
V
Detector accuracy
ERRDET
ΔPOUT @ constant VDET:
5.15 GHz to 5.70 GHz
–0.5
+0.5
dB
5.70 GHz to 5.85 GHz
–0.5
+0.5
dB
VSWR = 3:1
–1.5 to +1.5 dB
–1.5
+1.5
dB
Output impedance
PDZOUT
700
Ω
DC load impedance
PDZLOAD
26.5
kΩ
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Table 8. SE5003L1-R Electrical Specifications: Power Detector Characteristics for 3.3 V Operation (Note 1)
(VCC = 3.3 V, VREF = 2.85 V, TOP = +25 C, f = 5.4 GHz, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
0
Max
Units
OP1dB
dBm
Output power detector range
PDR
Detector voltage
VDET
POUT = +22 dBm
0.85
V
POUT = No RF
0.35
V
Detector accuracy
ERRDET
ΔPOUT @ constant VDET:
5.15 GHz to 5.70 GHz
–0.5
+0.5
dB
5.70 GHz to 5.85 GHz
–0.5
+0.5
dB
VSWR = 3:1
–1.5 to +1.5 dB
–1.5
+1.5
dB
Output impedance
PDZOUT
700
Ω
DC load impedance
PDZLOAD
26.5
kΩ
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = 5.0 V, TOP = +25 C, Unless Otherwise Noted)
5
5
4
3
EVM (%)
EVM (%)
4
2
5150 MHz
5500 MHz
5850 MHz
1
0
+10
+12
+14
+16
+18
+20
+22
3
2
5150 MHz
5500 MHz
5850 MHz
1
+24
0
+10
+26
+12
+14
+16
Output Power (dBm)
+18
+20
+22
+24
Figure 3. EVM vs Output Power
(802.11ac, MCS9, HT80)
Figure 4. EVM vs Output Power
(802.11ac, MCS9, HT40)
400
40
5150 MHz
5500 MHz
5850 MHz
38
300
Gain (dB)
Current (mA)
350
250
200
5150 MHz
5500 MHz
5850 MHz
150
100
+10
+12
+14
+16
+18
+20
+22
+24
36
34
32
30
+10
+26
+12
+14
Output Power (dBm)
+30
5150 MHz
5500 MHz
5850 MHz
+9
+11 +13 +15 +17 +19 +21 +23 +25 +27 +29
Output Power (dBm)
Figure 7. Detector Voltage vs Output Power
S-Parameters (dB)
Voltage (V)
+40
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
+3
+7
+18
+20
+22
+24
+26
+28
+30
+32
Figure 6. Gain vs Output Power
1.6
+5
+16
Output Power (dBm)
Figure 5. Operating Current vs Output Power
(OFDM, 256 QAM, HT40, 100% Duty Cycle)
S22
S21
S11
+20
+10
0
–10
–20
–30
3
4
5
6
7
Frequency (GHz)
Figure 8. Small Signal Parameters vs Frequency
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+26
Output Power (dBm)
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DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA
Evaluation Board Description
The SE5003L1-R Evaluation Board is used to test the
performance of the SE5003L1-R WLAN PA. A schematic diagram
of the SE5003L1-R Evaluation Board is shown in Figure 9. A
photograph of the Evaluation Board is shown in Figure 10.
Component values for the SE5003L1-R Evaluation Board are listed
in Table 9.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
 Paths to ground should be made as short as possible.
 The ground pad of the SE5003L1-R has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device. Therefore, design the connection to the ground pad to
dissipate the maximum wattage produced by the circuit board.
Multiple vias to the grounding layer are required. For further
information, refer to the Skyworks Application Note PCB Design
Guidelines for High Power Dissipation Packages, document
number 201211.
 Bypass capacitors should be used on the DC supply lines. Refer
to the schematic drawing in Figure 9 for further details.
 The RF lines should be well separated from each other with
solid ground in between traces to maximize input-to-output
isolation.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Evaluation Board Setup Procedure
Step 1: Connect system ground to pin 1 of connector J3.
Step 2: Apply 5.0 V to pins 4, 6, and 8 of connector J3.
Step 3: By applying 2.85 V on VREF (pin 2 of the J3 header), the
PA is enabled. By placing a ground on VREF, the PA is
disabled and placed in a shutdown state, drawing
minimal current.
Step 4: The 5 GHz amplifier performance can be monitored by
applying an RF signal to connector J2 (RF_IN). Monitor
the output power on the RF_OUT port connector, J1.
Step 5: Detector performance can be monitored on pin 10 of
connector J3.
Care should be taken not to overdrive the amplifier by applying
too much RF on the device input. A suitable starting input power
setting would be –20 dBm.
Package Dimensions
Typical case markings for the SE5003L1-R are shown in
Figure 11. The PCB layout footprint for the SE5003L1-R is
provided in Figure 12. Package dimensions for the 20-pin QFN are
shown in Figure 13, and tape and reel dimensions are provided in
Figure 14.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SE5003L1-R is rated to Moisture Sensitivity Level 3 (MSL3) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
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DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA
J3 Header
3
4
5
6
7
8
9
10
VDET
2
VREF
1
C20
10 μF
C14
100 nF
R5
3.3 Ω
C6
100 nF
C2
220 pF
RF Input
4
5
VREF
C11
47 nF
GND
GND
VCC3
GND
GND
GND
RF_OUT
RF_IN
GND
GND
VREF
GND
R6
(See Note)
6
7
8
9
× × ×
15
14
J1
13
12
11
RF Output
C18
10 pF
DET
3
16
N/U
N/U
C19
10 pF
17
N/U
2
18
SP2
J2
1
SP1
×
19
VCC2
VCC1
20
10
DET
R1
26.7 kΩ
Note: Some component labels may be different than the
corresponding component symbol shown here.
Component values, however, are accurate as of the
date of this Data Sheet.
Component R6 = 2.2 kΩ for 3.3 V operation,
510 Ω for 5.0 V operation.
Y0013
Figure 9. SE5003L1-R Evaluation Board Schematic
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DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA
Figure 10. SE5003L1-R Evaluation Board
Table 9. SE5003L1-R Evaluation Board Bill of Materials
Component
Size
Value
Vendor
Part #
Comments
C2
0402
220 pF
Murata
GRM1555C1H221JA01
Multilayer ceramic
C6, C14
0402
100 nF
Murata
GRM155R61A104KA01
Multilayer ceramic
C11
0402
47 nF
Murata
GRM155R71E473KA88
Multilayer ceramic
C18, C19
0402
10 pF
Murata
GRM1555C1H100JZ01
Multilayer ceramic
C20
0805
10 μF
Murata
GRM21BR61A106KE19
Ceramic
J1, J2
End launch
SMA
Johnson
Components
142-0701-851
SMA end launch straight jack
receptacle, tab contact
J3
100 mil
10X1
Samtec
TSW-110-07-G-S
100 mil header
R1
0402
26/7 k Ω
Panasonic
ERJ2RKF2672
Thick film chip resistor
R5
0402
3.3 Ω
Panasonic
ERJ2GEJ3R3
Thick film chip resistor
R6
0402
0402
2.2 kΩ (3.3 V operation)
510 Ω (5 V operation)
Panasonic
Panasonic
ERJ3GEYJ222
ERJ2GEJ621
Thick film chip resistor
Thick film chip resistor
Pin 1
Indicator
Skyworks Part #
Lot Code
Date Code:
YY = Calendar Year
WW = Work Week
CC = Country Code
Y0221
5003L1
XXXXX
YYWW CC
Figure 11. Typical Case Markings
(Top View)
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2X 1.78
5X 1.02
0
5X 0.51
2X 0.20
5X 0.51
2X 1.78
4.40
2.60
5X 1.02
DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA
Via Pattern
(Note 4)
2X 1.78
Board Metal
5X 1.02
5X 0.51
2.60
(0.25 Ref) Typ
R0.20 Typ
0
0
2X 0.20
4.40
5X 0.51
5X 1.02
2X 0.20
2X 1.78
0
0.70 Typ
2X 0.20
0.500 Typ
0.25 Typ
4X ø0.457
4.50
2.40
25X ø0.254
4.40
0.95 Typ
Solder Mask
Pattern
0.20 Typ
Stencil Pattern
(Note 5)
0.95 Typ
2.40
4.40
0.20 Typ
63% Solder Coverage
on Center Pad
4.50
0.80
Typ
0.70 Typ
0.35 Typ
0.500 Typ
4x4 QFN
Package
Outline
0.25 Typ
0.500 Typ
NOTES:
1.
2.
3.
4.
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless specified, dimensions are symmetrical about center lines.
Via hole recommendations: 0.025 mm Cu via wall plating (minimum),
via holes to be filled with conductive paste and plated over.
5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures
trapezoidal walls, and rounded corners offer better paste release.
Figure 12. PCB Layout Footprint for the SE5003L1-R
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Y0222
DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA
4.00 ± 0.05
A
0.85 ± 0.05
0.05 C
2.50 ± 0.05
0.203 Ref
B
0.30 x 45°
0 – 0.005
Pin 1
Indicator
Pin 1 Indicator
Exposed Pad
4.00 ± 0.05
2.50 ± 0.05
R0.075
Typ.
20X 0.15 Min
0.05 C
20X
2X
0.05 C
NOTES:
1. All measurements are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance: Angular Tolerance:
X.X (1 place) ± 0.1 mm
±0.5°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Coplanarity applies to the exposed center ground pad as well as the terminals.
4. Dimension applies to the metallized terminal. If the terminal has a
radius, the dimension should not be measured in that radius area.
5. Unless specified, dimensions are symmetrical about center lines.
See Detail A
0.500
3
C
Top View
0.08 C
Seating
Plane
2X
Bottom View
2X R0.075
0.50 ± 0.05
0.25 ± 0.05
0.10 M C A B
0.05 M C
4
Detail A
Scale 2X
(20 places)
Y0219
Figure 13. SE5003L1-R 20-Pin QFN Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013
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DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA
∅1.50
4.35 ± 0.10 (Bo)
1.75 ± 0.10
B
A
10o Max
2.00 ± 0.05
± 0.10
A
B
∅1.50
12.00 +0.30/–0.10
1.13 ± 0.10 (Ko)
4.00 ± 0.10
5.50 ± 0.05
8.00 ± 0.10
Reference Pin
Indicator
± 0.25
0.229 ± 0.02 (T)
Detail B
10o Max
Notes:
1. Carrier tape material: black conductive polycarbonate
or polysterene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC
tape and reel specification.
5. Tolerance: .XX = ±0.10
6. All measurements are in millimeters
4.35 ± 0.10 (Ao)
Detail A
Figure 14. SE5003L1-R 20-Pin QFN Tape and Reel Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J
S2585
DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA
Ordering Information
Model Name
SE5003L1-R High-Power WLAN Power Amplifier
Manufacturing Part Number
SE5003L1-R
Evaluation Board Part Number
SE5003L1-R-EK1
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