Selection Guide
Low Power Microcontrollers
ML610400 Series
Ver.1.1
Key Features
re
re
re
u
Feat
u
Feat
1
2
Low current consumption
prolongs battery life
0.5μA suspend (HALT) current
Low operating voltage
One command through
parallel processing
via pipeline architecture
Command
Clock
1.1V Operation
TIMER
ure
Feat
re
re
u
Feat
6
Software development with
code-efficient C compiler
High performance C compiler
86
LCD tool simplifies
LCD control program
development
Displays images
without the LCD panel
Built-in mapping RAM
LCD Image
LCD Image
Verification Tool Assignment Tool
Application
program
Software
CP
DA
C
AD
U
M
RO
M
C
ROM code
Displays
the LCD image
Maps the LCD
segments via
the microcontroller pin
On-chip Emulator
Hardware
Management tools
Emulator
Build tools
LCD development
Reference
Board
ROM code generation
Flash
programming
re
u
Feat
re
10
Multiple sample peripheral
drivers provided
for easy integration
Sample peripheral
driver provided
Programming
LAPIS Semiconductor
driver
RA
Simple, easy-to-use debugger
and on-chip emulator
Flexible writing process
Writing by customer
LAPIS Semiconductor
driver
Compile
ἴ
ἴ
5
9
Troublesome software
changes no longer required
when changing the LCD panel
re
Development Support System
u
Feat
u
Feat
7
u
Feat
Comprehensive
development environment
Debugging
CLOCK GENERATOR
###############*/
API
#*/
###############*/
****/
int main( void )
{
= Main initialize. ===*/
/*--- Variable. ---*/
gCntTimer = 0;
(unsigned _reqNotHalt = (;
--- Peripheral. ---*/
_initPeri();
/*--- Start. ---*/
###############*/
API
#*/
###############*/
****/
int main( void )
{
= Main initialize. ===*/
/*--- Variable. ---*/
gCntTimer = 0;
(unsigned _reqNotHalt = (;
--- Peripheral. ---*/
_initPeri();
/*--- Start. ---*/
re
4
High performance CPU core
reduces system power
requirements
Single 1.5V battery
ROM RAM
WDT
3
Low voltage operation
contributes to smaller
system size
Interrup
Interrupt
signal
CPU
u
Feat
u
Feat
Flexible
layout design
1
LAPIS Semiconductor
driver
Writing at LAPIS Semiconductor facility
uctor
emicond Package
LAPIS S
delivery
uctor
emicond
LAPIS S
Chip
delivery
www.lapis-semi.com/en
ML610400 Series Overview
This series is equipped with Flash memory for application code storage readable at only 1.1V and features industry-leading operating, halt, and sleep current
consumption. In addition, a high performance CPU core is included, capable of processing one instruction per clock cycle. The result is high performance and ultra-low
power consumption. Pin- and function-compatible Mask ROM models are also offered featuring identical characteristics. The products can be delivered in either
packaged or die format. Customers can also opt to have programming performed by LAPIS Semiconductor as part of the standard manufacturing process or at their site
using a multiwriter.
Standard
ROM
Capacity
(Bytes)
Standard
Low Power Microcontrollers
Low power microcontrollers
These low power microcontrollers are ideal for compact, battery-driven systems without an LCD.
Standard Type
64K
START
ML610(Q)482(P)
ML610Q489(P)
ML610Q488(P)
48K
Ranges
ML610Q487(P)
32K
• Program memory (32KByte to 64KByte), RAM (1KByte to 4KByte
• Low speed clock : 32.768kHz, High-speed clock : 500kHz to 4.096MHz
• 3 types of serial communication ports (I2C, SSIO, UART)
• 8bit / 16bit Timer,16bit PWM
• Available in bare die / TQFP48 package formats
Remote Controllers for Boilers
ML610Q486(P)
Electric Bicycles
330pin
0piin
48pin
48piin
Built-in Dot Matrix LCD Driver
64pin
64piin
Low power microcontrollers
Package
Pins
Built-in LCD Driver
Low Power Microcontrollers
ROM
96K
Capacity
(Bytes)
Performance Weather Stationss
S AT
S AT
Bicycle Meterss
64K
Pedometers
with Graph
p
ŝ
ŝ
ŝ ŝ ŝ
ŝ
ŝ ŝ ŝ
ŝ ŝ
ŝ ŝ ŝ ŝ ŝ ŝ
ŝ
ŝ ŝ ŝ ŝ ŝ ŝ ŝ
ŝ ŝ ŝ
48K
0
12
24
16K
Thermostats
8K
6K
'
ML610403(P)
M
L610403(P)
ML610402(P)
ML610401(P)
64pin
SET
Dot Matrix Type
kcal
ML610Q429(P)
(P)
ML610Q428(P)
(P)
TOTAL
ML610Q422(P)
ML610Q421(P)
CONFIG
ML610(Q)409(P)
ML610(Q)408(P)
ML610(Q)407(P)
Segment Type
Clocks
0
ML610406(P)
ML610405(P)
ML610404(P)
( )
Digital
Digi
itall
Thermometers
80pin
MIN.
• Supports 400 to 1536 dot LCDs (1/24 to 1/2 duty, 1/4 to 1/3 bias)
• 32-128KByte program memory, 2 to 7KByte RAM
• Low speed clock : 32.768kHz, High-speed clock : 500kHz to 4.096MHz
• 2 A/D converters (24bit RC oscillation, 12bit successive approximation)
• Integrated LCD display allocation RAM and LCD drive voltage step-up circuit
• Available in bare die / TQFP120 to LQFP144 package formats
ML610Q439(P)
ML
ML610Q438(P)
ML
ML610Q436
M
ML610Q435
M
ML610Q432
M
ML610Q431
M
Q
km
Pedometers
s
32K
These low power microcontrollers integrate a boost circuit for driving LCDs,
eliminating the need for an external LCD power supply.
ML610Q415
ML610Q412(P)
ML610Q411(P)
Built-in Segment LCD Driver
Electronic Sports
(Multifunction) Watches
Low power microcontrollers
These low power microcontrollers with segment LCD driver integrates a boost circuit for driving an LCD.
Electroniic
Electronic
Wristwatches
Start/
Stop
• Supports 55 to 185 segment LCDs (1/5 to 1/2 duty, 1/3 to 1/2 bias)
• 6 to 16KByte program memory, 192Byte to 1KByte RAM
• Low speed clock : 32.768kHz, High-speed clock : 500kHz to 2MHz
• 16bit or 24bit RC oscillation type A/D converter
for temperature / humidity measurement
• 12bit successive approximation type A/D converter
• Integrated LCD display allocation RAM and LCD drive voltage step-up circuit
• Available in bare die / TQFP64 to LQFP120 package formats
MAX.
Token
T
ok
ken
Machines
100pin
START
HALF
VHDD
COOL
JPZ
SAM
LAP/
Sptit
Temperature
T
emperature
Loggers
120pin
128pin
144pin
Package
Pins
2
www.lapis-semi.com/en
re
u
Feat
1
Low current consumption prolongs battery life
0.5μA suspend (HALT) current
Original design technology and low power processes ensure low current consumption in all modes. In addition, a dual-clock system
is utilized, enabling intermittent operation in low-power mode and selection of the optimum clock frequency, making operation
possible for 10 years on just a single battery.
Interrupt
signal
CPU
ROM RAM
WDT
TIMER
CLOCK GENERATOR
Company A
Industry's lowest
power consumption∗
2.8years
Company B
∗Based on an LAPIS Semiconductor comparison of flash
microcontrollers with built-in LCD driver
4.6
6years
Company C
Flash Memory Operation Comparison
Current
(μA)
Reduced
Current Leakage
6.1years
10
years
LAPIS
Semiconductor
5years
10
1
0years
Current consumption(μA)
100
0
Voltage
(V)
1.8
Unique process minimizes current leakage at high temperatures,
reducing power consumption over a wider range.
5.4years
Company E
LAPIS
Semiconductor
40%
1.0
6.4years
Company D
Conventional
80
60
Standard Processing
Leakage
current
minimized
at high
temperatures
40
20
0
–50
Low Power Processing
0
50
100
Temperature (°C)
LAPIS Semiconductor has achieved
Internal Flash memory capable of reading at only 1.1V,
enabling operation from a single 1.5V battery.
industry-leading low power consumption in all modes
Optimized clock reduces power consumption
Microcontroller with Built-In Flash Memory (ML610Q431)
CPU Operation (Built-in 4MHz PLL oscillator: 800μA)
CPU Operation (External 32kHz oscillator: 5μA)
CPU Operation (Built-in 500kHz RC oscillator: 70μA)
HALT Operation (32kHz crystal oscillator + RTC + WDT: 0.5μA)
STOP Operation (No oscillation: 0.15μA)
180μA at 1MHz
Only 5μA with crystal oscillation clock
Uses even less current at lower speeds
Timing at low current
Reduce current leakage
High-speed clock
Low-speed clock
Frequency division (1/2, 1/4, 1/8)
Optimum clock selected via control software.
3
www.lapis-semi.com/en
Low operating voltage
Single 1.5V battery
Only 1.1V is required, making operation possible using only a single 1.5V battery. This contributes to more compact, lightweight
devices while reducing costs.
The low minimum operation voltage, combined with 32.768kHz crystal oscillation clock and extremely low current consumption (in
low-power mode) results in longer battery life and enables the use of double layer capacitors for (a low-cost) backup.
Two
dry
batteries
3V
Flash
MCU
Lithium
battery
3V
LAPIS Semiconductor
Ultra Low Power Microcontroller
Lower costs
Smaller
and
lighter
or
Flash
MCU
1.1V Operation
Power
consumption
97% down
One
dry
battery
1.5V
LAPIS
Semiconductor
Flash
MCU
Dry Cell
Conventional
Low Power Microcontroller
Dry Cell
2
Low voltage operation contributes to
smaller system size
Dry Cell
re
u
Feat
or
Silver
oxide
battery
1.55V
LAPIS
Semiconductor
Flash
MCU
Typ.105μW@500kHz, 1.5V
Typ.4500μW@500kHz, 3V
Compared with
th standard
t d d
LAPIS Semiconductor products
4
www.lapis-semi.com/en
Fe
e
atur
3
One command through
parallel processing
via pipeline architecture
High performance CPU core reduces
system power requirements
These 8bit microcontrollers feature one instruction per clock cycle operation and deliver high performance - comparable to 16bit
microcontrollers. In addition, RISC-based processing utilizing a rich instruction set for efficient bit/multi-byte operation, combined with
intermittent firmware operation, enable high-performance operation even at slow clock cycles for reduced CPU processing time and
lower system power consumption.
Command
Clock
250ns@4MHz
Minimum instruction execution time : 30.5μ[email protected]
Efficient CPU capable of processing
one instruction per clock cycle
Command processing performed quickly
before entering into standby mode
Pipeline Process
CPU
operation
Clock
Execute
HALT
Time
Command Command
Fetch Command
A
B
C
Decode
Conventional
CISC Microcontroller
Current
Command Command Command
A
B
C
Current
Command Command Command
A
B
C
One instruction
per clock cycle
One instruction per clock cycle
Shortening of
CPU operation
time
CPU
operation
RISC Microcontroller
HALT
Time
5
www.lapis-semi.com/en
re
u
Feat
4
Development Support System
Comprehensive development environment
Support for all phases of software development is provided to the customer, from program builds, debugging, and Flash
programming, to compact, lightweight on-chip debug emulators and reference boards with microcontrollers.
Build tool setup (Compiler, Assembler, and Linker) and debug tool setup (DTU8 debugger/simulator) are initiated in the integrated
IDEU8 environment. The DTU8 debugger (running on a PC) is connected to the microcontroller through an on-chip debugger port
controlled by a μEASE debugger pod. The debugger controls and analyzes the execution of code on the microcontroller. The
FWμEASE Flash Writer and MWμEASE Flash Multi-Writer are software tools used to write application code to the Flash memory.
Multiple devices can be written to simultaneously. The LCD tools (part of the development suite), simulate LCD operation and
provides several options for controlling an LCD.
For debugging
(i.e. block erase,
address designation)
Simplifies writing
to multiple devices
during mass production
Allows project management of
multiple operations,
including header/source file
linking and C compiler/assembler/
linker option setting
Software
Management tools
Build tools
LCD development
ROM code generation
Debugging
Hardware
Emulator
Reference
Board
Flash
programming
Develop a display control program
without an actual LCD panel
LCD image tool provides
LCD simulation
Enables source-level debugging,
including breakpoint setting
and step execution
FWμEASE Flash Writer
with intuitive GUI
MWμEASE Flash Multi-Writer offers
simultaneous writing to
up to 32 targets
Integrated environment
IDEU8 incorporates development work
from program editing to build
Simple, user-friendly DTU8 debugger
On-chip Debug Emulator
μEASE
Interface cable
USB cable
Reference Board
with Built-In Microcontroller
PC
6
www.lapis-semi.com/en
re
u
Feat
5
On-chip Emulator
Simple, easy-to-use debugger
and on-chip emulator
The simple graphical user interface of the debugger is used to display multiple windows that contain a variety of information, such as
C/assembly language, register data, and status. In addition, a single-step/subroutine function is included to check the behavior of the
software one line (or subroutine) at a time. Enhanced break functions are also available that suspends software execution at a certain
point in the code or to access a register or data location. Break functions are critical to real-time debugging and maximize system
debugging performance.
DTU8 Debugger
Register window
Source window
Status window
Disassemble window
Code window
Key Features of DTU8 / μEASE
Hardware break point enables pass count setting
RAM data/address match break can detect data changes
within a program
Flash memory allows unlimited software break point settings
Refer/register C language variables using the memory watch window
SFR window
Trace window
Data window
Watch window
On-chip Debug Emulator μEASE
On-chip Debug Emulator μEASE Specifications
ML610400 series and other LSIs with on-chip debug functionality
USB2.0 (High speed, Full speed)
Program download to flash memory integrated in the target MCU (MCU with built-in flash memory)
Real-time emulation, Single step emulation
Hardware break points (program memory) : 3 points (2 points in source window, 1 point with address specification/counting function in another menu)
Break function
RAM address data match break/counting function : 1 point
Software break points : Entire program area (models with built-in flash memory only)
Memory / register control Display/change the contents of program memory, data memory, general-purpose register, and SFR
50.0(W) 90.0(D) 9.0(H)
Dimensions
50g
Weight
Supply from USB VBUS port
Power supply
Applicable devices
Host interface
Flash writing function
Emulation function
7
www.lapis-semi.com/en
re
u
Feat
6
Software development
with code-efficient C compiler
High performance C compiler
A high performance C compiler is utilized that minimizes ROM code and maximizes processing speed for optimum microcontroller
operation. The 8bit CPU features a code efficiency equivalent to 16bit CPUs, resulting in the ideal program memory size.
The CCU8 C compiler offers a variety of configurable options, such as optimization (minimizing program size and execution time of
subroutines), setting the program stack size, and selecting the characteristics of the output files - including documentation for error
checking. In addition, 'pragma' is available to handle interrupt processing routines and architecture-dependent functions for smooth
development of application programs. The CCU8 C compiler is ANSI C language compliant, making it easy to port projects from
other microcontrollers.
(Byte)
10000
C Compiler Output Code Size Benchmark Comparison
###############*/
API
#*/
###############*/
****/
int main( void )
{
= Main initialize. ===*/
/*--- Variable. ---*/
gCntTimer = 0;
(unsigned _reqNotHalt = (;
--- Peripheral. ---*/
_initPeri();
/*--- Start. ---*/
###############*/
API
#*/
###############*/
****/
int main( void )
{
= Main initialize. ===*/
/*--- Variable. ---*/
gCntTimer = 0;
(unsigned _reqNotHalt = (;
--- Peripheral. ---*/
_initPeri();
/*--- Start. ---*/
Compile
ἴ
ἴ
Application
program
CP
U
DA
C
RA
AD
M
RO
M
C
ROM code
Numerous compiler options
maximize microcontroller performance
8000
6000
4000
2000
0
ML610400
8bit Sample 1
(Company A)
8bit Sample 2
(Company A)
16bit Sample
(Company B)
Option settings for the CCU8 C compiler
Code-efficient 8bit MCU
comparable to 16bit MCU
8
www.lapis-semi.com/en
Displays images
without the LCD panel
LCD tool simplifies
LCD control program development
ure
Feat
7
LCD Image
LCD Image
Verification Tool Assignment Tool
The LCD image tool includes an LCD image assignment tool and LCD image check tool. The LCD image assignment tool uses a
bitmap file of the LCD and allows users to map the microcontroller COM and SEG pins to the LCD visually. It also automatically
creates a data table for the LCD allocation RAM and LCD control program. The settings of the COM/SEG pins related to the LCD can
be saved to or read from a CSV file to enhance work efficiency. The LCD image check tool can be used to check the operation of an
Displays
the LCD image
LCD even without an LCD present. It simulates an LCD image on a PC based on the output of the simulator or while debugging in real
Maps the LCD
segments via
the microcontroller pin
time under the control of the DTU8 and μEASE.
Reads LCD allocation RAM table data and
executes the LCD panel control program
Individual segments
can be assigned to
COM/SEG pins
/* Initialization Table for DSmCnA
/* Generated by LCD Assignment
/* 2008/07/28 20:37:36
/* You can use below data in you
Output
0x22, 0x06, 0x06, 0x06, 0x06, 0x
0x04, 0x04, 0x02, 0x02, 0x02, 0x
0x00, 0x00, 0x1B, 0x09, 0x09, 0x
0x0B, 0x0A, 0x0A, 0x0D, 0x0D, 0
0xFF, 0x21, 0x21, 0x1D, 0x0E, 0x
0x10, 0x10, 0x11, 0x11, 0x12, 0x
0x14, 0x14, 0x15, 0x15, 0xFF, 0x
0x17, 0x18, 0x18, 0x19, 0x19, 0x
Table data of
LCD allocation RAM
Input
Output
Input/
Output
Bitmap file
10
11
23
27
19
9
15
31
7
8
22
0A
0B
0C
0D
0E
0F
0G
0H
1A
1B
1C
1
0
0
0
1
2
1
0
3
2
2
4
4
3
1
1
3
3
0
4
4
1
CSV file
0
0
0
0
0
0
0
0
1
1
1
0
1
2
3
4
5
6
7
1
2
3
LCD image assignment tool enables
visual mapping of the microcontroller
pins and LCD panel segments
COM/SEG allocation data can be rearranged
for easy processing by the microcontroller
/* Copy function to Display Alloca
void Sample_TableCopyFunc(voi
{
volatile unsigned char __near *
int i;
/* TYPE3 */
DADM1 = 1;
/* DASN clears */
DASN = 0;
/* Copy to Display Allocation R
p = &DS0C0A;
for(i=0; i<DSxCnA_NUM; i++, p
{
*p DSxCnA[i];
DTU8 Debugger
Synchronized
Sample LCD panel
control program
The LCD image turns ON and OFF
based on program execution
The LCD image check tool
accurately simulates an LCD,
displaying and flashing images
9
www.lapis-semi.com/en
re
u
Feat
8
Troublesome software changes no longer
required when changing the LCD panel
Built-in mapping RAM
A display allocation RAM is integrated between the display RAM and COM/SEG pins that enables easy pin mapping. This feature is
important when changing the pinout assignments of the display. Remapping an LCD is complicated and time-consuming and can
take up to several days. However, this time can be shortened to only hours with display allocation RAM.
Data creation and operation verification can also be performed by the LCD tools, facilitating user development.
LCD design change
Flexible
layout design
Simply register the display RAM
bits and addresses
Display RAM
Driving Waveform Generation Block
Change of position on board
Display
Allocation
RAM
COM Driver
SEG Driver
COM pin
SEG pin
Requires only changes to the data settings in the display allocation RAM.
No complicated changes to display RAM control needed.
10
www.lapis-semi.com/en
Fe
e
atur
9
Multiple sample peripheral drivers provided
for easy integration
Sample drivers for configuring and operating peripheral circuits are provided to the the customer for application code development.
These drivers are presented as software modules that allow the customer to integrate only those modules necessary, shortening
development time considerably.
Sample peripheral
driver provided
Programming
LAPIS Semiconductor
driver
LAPIS Semiconductor
driver
LAPIS Semiconductor
driver
Application Layers
Software
RC-ADC
drivers
Timer
drivers
UART
drivers
LCD
drivers
Hardware
RC-ADC
Timer
UART
LCD
Function
Sense
Other
drivers
Sample Peripheral Drivers
Connect Communicate
Module Name
SA-ADC module
RC-ADC module
Temperature calculation module
Humidity calculation module
Celsius ↔ Fahrenheit conversion module
Air pressure calculation module
Sense
Real-time clock control module
Timer control module
Clock control module
Time-based counter control module
1kHz timer control module
Stopwatch module
UART module
UART baud rate timer correction module
Connect I2C module
SSIO module
EEPROM module
LCD display module
Key input module
Communicate Melody module
BLD control module
Functions
Initializes the successive approximation ADC module (i.e. conversion count, operating mode, secondary amp. settings), conversion start/stop, obtain conversion results, and measure the voltage
Performs A/D conversion by digitalizing the ratio of the oscillation frequency between the reference resistor (or capacitor) and resistive sensor like thermistor (or capacitive sensor)
Calculates the temperature from the RC-ADC conversion results based on the thermistor 103AT frequency ratio - temperature conversion table
Calculates the humidity from the RC-ADC conversion results and measured temperature based on the C10-M53R humidity sensor frequency ratio (humidity ratio) - humidity conversion table
Performs Celsius ⇔ Fahrenheit conversion
Calculates the barometric pressure by measuring the output of a bridge-type sensor (barometer) using the input of SA-ADC differential amplifier
Sets the counting function of the real-time clock
Controls the 8bit/16bit timer operation
Controls the clock (i.e. system clock settings)
Controls the high-speed time-based counter
Counts time (1/1000sec)
Utilizes the 1kHz Timer Control Module to initialize the stopwatch and perform ON/OFF operation and data reading
Controls the UART (asynchronous serial interface)
Measures the high-speed clock frequency in order to correct the UART baud rate timer value to maintain UART communication
Controls the I2C BUS interface (master)
Controls the 8bit/16bit synchronous serial port (SSIO). It can be used to control a device with SPI interface when using one of the GPIO pins for chip enable
Performs EEPROM writing/reading via I2C/SSIO
Performs initialization (i.e. bias, duty, frame frequency), contrast/display mode setting, and 7SEG/16SEG display
Utilizes a port with interrupt function to perform initialization (input mode), key capture start/stop, and key event acquisition
Controls the melody/buzzer output of the melody driver
Utilizes the battery level detection function to measure the MCU supply voltage
11
www.lapis-semi.com/en
re
u
Feat
10
Writing by customer
Flexible writing process
Users can opt for performing writing at their facility utilizing multi-writing software or at LAPIS Semiconductor's site, providing a
greater level of flexibility.
Advantages/Disadvantages
Mass Production Method
and Device Selection
Type
Type
Type
Type
Reduced Writing Costs at Flexible, Comprehensive Prompt Response to
Testing at
Software Problems
the Customer's Site
the Customer's Site
Customer
Responsibilities
Microcontroller Microcontroller
Unit Price
Delivery
LAPIS Semiconductor
Responsibilities
Writing to Flash ROM
microcontrollers at
LAPIS Semiconductor's facility
Deliver the Flash
Order ROM code
ROM products after
products and provide
the ROM code (software) writing the ROM code
Writing to blank Flash ROM
microcontrollers onboard and
testing it at the customer's site
Order blanks,
create a writing jig,
and write the ROM code
Writing to Flash ROM microcontrollers
at LAPIS Semiconductor's facility
then testing it onboard and performing
final writing at the customer's site
Order ROM code products,
Deliver the Flash
provide the ROM code
(software),
ROM products after
create a writing jig,
writing the ROM code
and write the ROM code
Manufacturing Mask ROM
microcontrollers at
LAPIS Semiconductor's facility
(ES shipment included)
Order ROM code
products and provide
the ROM code (software)
Writing at LAPIS Semiconductor facility
ductor
emicon Package
delivery
LAPIS S
ductor
emicon
LAPIS S
Chip
delivery
Deliver blank Flash
ROM products
Deliver Mask ROM
products after
masking the ROM
Provides flexible support the customer's mass production process
Writing
g at LAPIS Semiconductor's facility
y
Writing by the customer using MWμEASE software
Chip writing
g and shipment also available
MWμEASE screen
Writing at LAPIS Semiconductor facility
tor
iconduc Package
em
LAPIS S
delivery
tor
iconduc
em
LAPIS S
Chip
delivery
The MWμEASE Flash Multi-Writer
is capable of writing to up to
32 devices simultaneously
0110 0
1
ROM Code Entry Format
ML610400 Series
Code Entry Confirmation
ML610400 Series
Checklist
0
Mass Production
Certificate
CPU
A/D
ROM
R
O
Clock
C
Short TAT
μEASE connection using
the MWμEASE Flash Multi-Writer
12
www.lapis-semi.com/en
Standard Type
ML610Q482 / ML610Q482P
Package
Block diagram
CPU(nX-U8 /100)
EPSW1 to 3
TQFP48
PSW
Actual size shown
Timing
Controller
Features
ROM
64KByte (Flash) (includes 1KByte test area)
RAM
4KByte
Ports
(Includes
Secondary Function)
Input
Output
Input/Output
A/D Converter
Analog Comparator
8bit Timer
Common mode input : 0.2V to VDD-1.0V
Input offset : 50mV(typ.)
4
16bit PWM
1
Others
TBC(Time Base Counter)×1, WDT×1
External Interrupt
Other Functions
Operating
Frequency
24bit RC oscillation type×2ch
UART×1, SSIO(SPI ×1,
I2C(master)×1
Serial I/F
Timer
6
4
22
High Speed
Low Speed
Battery level detection, clock output, and more
4.096MHz (internal PLL or external crystal/ceramic oscillator)
500kHz (internal RC oscillation)
32.768kHz (crystal oscillation)
1.1V to 3.6V
Operating Temperature
ML610Q482 : –20°C to +70°C
ML610Q482P : –40°C to +85°C
(Typ.)
At Standby
STOP mode : 0.2μA, HALT mode : 0.5μA
During Operation
32kHz : 5μA (100% duty)
500kHz : 70μA (Internal RC oscillation)
4.096MHz : 830μA (Internal PLL)
Supply Form
Chip or TQFP48
ALU
RESET_N
TEST
XT0
XT1
OSC0*
OSC1*
Instruction
Decoder
IN0*
CS0*
RS0*
RT0*
CRT0*
RCM*
IN1*
CS1*
RS1*
RT1*
CMPP
CMPM
ECSR1 to 3
LR
DSR/CSR
EA
PC
Instruction
Register
Data-bus
Program
Memory
(Flash)
64KByte
BUS
Controller
INT
1
RAM
4096Byte
RESET &
TEST
Interrupt
Controller
INT
1
OSC
LSCLK*
OUTCLK*
VDDL
VDDX
ELR1 to 3
SP
VDD
VSS
5
Operating Voltage
Current
Consumption
On-Chip
ICE
GREG
0 to 15
INT
4
Power
INT
1
INT
4
WDT
UART
RXD0*
TXD0*
INT
1
SDA*
SCL*
INT
1
PWM
PWM0*
8bit Timer
×4
Buzzer
INT
9
INT
1
Analog
Comparator
SCK0*
SIN0*
SOUT0*
INT
1
BLD
RC-ADC
×2
SSIO
I2C
TBC
VPP
GPIO
BZ0*
NMI
P00 to P03
P10,P11
P20,P21,P22,P24
P30 to P35
P40 to P47
PA0 to PA7
* : Secondary function of port
13
www.lapis-semi.com/en
D Matrix Type
Dot
M
ML610Q439 / ML610Q439P
Package
Block diagram
CPU(nX-U8/100)
EPSW1rm3
PSW
Timing
Controller
LQFP144
Features
ROM
128KByte (Flash) (includes 1KByte test area)
RAM
7KByte (includes 1KByte LCD allocation register)
LCD Driver
Max.1024dot 64seg.×16com.
(Includes
Secondary Function)
Input
Output
Input/Output
A/D Converter
8bit Timer
16bit PWM
Timer
10
3
20
Others
24bit RC oscillation type×2, 12bit successive approximation type×2
4
16bit-PWM×3
TBC(Time Base Counter)×1,
WDT×1, 1kHz Timer×1, Capture×2
External Interrupt
9
Other Functions
Buzzer/melody, clock output,
battery level detection, and more
Operating
Frequency
High Speed
Low Speed
Operating Voltage
Operating Temperature
At Standby
Current
Consumption
(Typ.)
During Operation
Supply Form
4.096MHz (internal PLL or external crystal/ceramic oscillator),
2M/1M/500kHz (internal RC oscillation, option selection)
32.768kHz (external crystal oscillation)
1.1V to 3.6V
ML610Q439 : –20°C to
ML610Q439P : –40°C to
RESET_N
70°C
85°C
STOP mode : 0.15μA, HALT mode : 0.5μA
XT0
XT1
OSC0*
OSC1*
IN0*
CS0*
RS0*
RT0*
CRT0*
RCM*
IN1*
CS1*
RS1*
RT1*
AVDD
AVSS
VREF
AIN0,AIN1
32kHz : 5μA (100% duty)
500kHz : 70μA (Internal RC oscillation)
4MHz : 800μA (Internal PLL)
Chip or QFP144
ECSR1rm3
LR
DSR/CSR
EA
PC
Instruction
Register
Instruction
Decoder
Data-bus
RAM
6144Byte
RESET &
TEST
Interrupt
Controller
OSC
INT
1
LSCLK*
OUTCLK*
VDDL
VDDX
ELR1rm3
SP
VDD
VSS
TEST
UART×1, SSIO(SPI)×1,
I2C(master)×1
Serial I/F
ALU
Actual size shown
On-Chip
ICE
Ports
GREG
0 to 15
INT
4
Power
INT
1
INT
1
INT
1
VPP
SSIO
SCK0*
SIN0*
SOUT0*
UART
RXD0*
TXD0*
INT
1
INT
1
I2C
WDT
SDA*
SCL*
INT
3
TBC
PWM×3
PWM0* to PWM2*
Melody
MD0*
INT
1
1kHzTC
Capture×2
INT
4
BLD
INT
1
INT
5
RC-ADC
×2
12bit-ADC
Program
Memory
(Flash)
128KByte
BUS
Controller
GPIO
8bit Timer
×4
Display Allocation
RAM 1KByte
Display RAM
192Byte
NMI
P00 to P03
P10 to P11
P20 to P22
P30 to P35
P40 to P47
LCD Driver
COM0 to COM23
SEG0 to SEG55
LCD BIAS
VL1,VL2,VL3,VL4
C1,C2,C3,C4
* : Secondary function of port
14
www.lapis-semi.com/en
Segment Type
ML610Q409 / ML610Q409P
Package
Block diagram
CPU(nX-U8/100)
EPSW1 to 3
PSW
Timing
Controller
TQFP100
Actual size shown
On-Chip
ICE
Features
ROM
16KByte (Flash) (includes 1KByte test area)
RAM
1KByte
LCD Driver
Ports
(Includes
Secondary Function)
Input
Output
Input/Output
Serial I/F
UART×1 SSIO(SPI)×2
8bit Timer
16bit PWM
Timer
Others
External Interrupt
Other Functions
Operating
Frequency
High Speed
Low Speed
Operating Voltage
Operating Temperature
Current
Consumption
(Typ.)
At Standby
During Operation
Supply Form
ECSR1rm3
LR
DSR/CSR
EA
PC
SP
Instruction
Decoder
Instruction
Register
Data-bus
RESET_N
TEST0
TEST1_N
RAM
1KByte
RESET &
TEST
INT
1
OSC
LSCLK*
OUTCLK*
VDDL
Program
Memory
(Flash)
16KByte
BUS
Controller
INT
2
SSIO
×2
Interrupt
Controller
XT0**
XT1**
5
4
22
16bit RC oscillation type×2
ALU
ELR1 to 3
VDD
VSS
Max.185dot 37seg.×5com.
A/D Converter
GREG
0 to 15
INT
4
WDT
INT
1
UART
TBC
Power
IN0*
CS0*
RS0*
RT0*
CRT0*
RCM*
IN1*
CS1*
RS1*
RT1*
4
16bit-PWM×1
TBC(Time Base Counter)×1
WDT×1 Capture×2
13 (include 8bit-OR input)
INT
1
Capture
×2
RC-ADC
×2
INT
4
Melody
Buzzer
INT
6
8bit Timer
×4
GPIO
Display
Allocation
RAM
LCD
Driver
Display
register
320bit
LCD
BIAS
Buzzer/melody, low-speed oscillation frequency correction
(0.48ppm accuracy), clock output
500kHz or 2MHz (internal RC oscillation)
32.768kHz(crystal oscillation)
500kHz : 1.25V to 3.6V, 2MHz : 1.8V to 3.6V
ML610Q409 : –20°C to +70°C
ML610Q409P : –40°C to +85°C
STOP mode : 0.4μA HALT mode : 0.9μA
32kHz : 5μA 500kHz : 70μA 2MHz : 280μA
Chip or TQFP100
SCK0*
SIN0*
SOUT0*
SCK1*
SIN1*
SOUT1*
RXD0*
TXD0*
INT
1
PWM
INT
1
VPP
PWM0*
MD0*
P00 to P04
P20 to P22,P24
P30 to P35
P40 to P47
P50 to P53
P60 to P67(ML610Q407)
P60 to P63(ML610Q408)
COM0 to COM4(*1)(*2)(*3)
SEG0 to SEG31(ML610Q407)(*1)
SEG0 to SEG35(ML610Q408)(*2)
SEG0 to SEG39(ML610Q409)(*3)
VL1,VL2,VL3
C1,C2
* : Secondary or tertiary function of port
: Select between 29SEG × 5COM, 30SEG × 4COM, 31SEG × 3COM, or 32SEG × 2COM (via software)
: Select between 33SEG × 5COM, 34SEG × 4COM, 35SEG × 3COM, or 36SEG × 2COM (via software)
(*3)
: Select between 37SEG × 5COM, 38SEG × 4COM, 39SEG × 3COM, or 40SEG × 2COM (via software)
(*1)
(*2)
15
www.lapis-semi.com/en
S
Segment
Type
M
ML610401 / ML610401P
Package
Block diagram
CPU(nX-U8/100)
EPSW1 to 3
PSW
TQFP64
Actual size shown
Timing
Controller
GREG
0ĝ15
ALU
6KByte (Mask) (includes 1KByte test area)
RAM
192Byte
LCD Driver
Max.55dot 11seg.×5com.
Ports
(Includes
Secondary Function)
Input
Output
Input/Output
16bit RC oscillation type×2ch
Serial I/F
UART×1
8bit Timer
2
Others
TBC(Time Base Counter)×1,
WDT×1, Capture×2
External Interrupt
8 (include 4bit-OR input)
Other Functions
Buzzer/melody, low-speed oscillation frequency correction
(0.48ppm accuracy), clock output
Operating
Frequency
High Speed
500kHz(internal RC oscillation)
Low Speed
32.768kHz(crystal oscillation)
Operating Voltage
Operating Temperature
Current
Consumption
(Typ.)
At Standby
STOP mode : 0.3μA, HALT mode : 0.9μA
During Operation
32kHz : 3μA, 500kHz : 50μA
Supply Form
IN0*
CS0*
RS0*
RT0*
CRT0*
RCM*
IN1*
CS1*
RS1*
RT1*
PC
Instruction
Register
Program
Memory
(ROM)
6KByte
BUS
Controller
Interrupt
Controller
INT
1
INT
4
Power
INT
1
RC-ADC
×2
INT
1
UART
LSCLK*
OUTCLK*
1.25V to 3.6V
ML610401 : –20°C to +70°C
ML610401P : –40°C to +85°C
RESET &
TEST
OSC
VDDL
DSR/CSR
RAM
192Byte
XT0
XT1
4
12
18
A/D Converter
Timer
RESET_N
TEST0
LR
EA
Data-bus
VDD
VSS
ROM
ECSR1 to 3
SP
Instruction
Decoder
Features
ELR1 to 3
WDT
TBC
Capture
×2
INT
2
INT
1
Melody/
Buzzer
INT
5
GPIO
8bit Timer
×2
RXD0*
TXD0*
MD0*
P00 to P03
P20 to P22,P24
P30 to P35
P40 to P47
P50 to P53
P60 to P67(ML610401)
P60 to P63(ML610402)
Display
Allocation
RAM
LCD
Driver
COM0 to COM4(*1)(*2)(*3)
SEG0 to SEG13(ML610401)(*1)
SEG0 to SEG17(ML610402)(*2)
SEG0 to SEG21(ML610403)(*3)
Display
register
175bit
LCD
BIAS
VL1,VL2,VL3
C1,C2
* : Secondary function of port
: Select between 11SEG × 5COM, 12SEG × 4COM, 13SEG × 3COM, 14SEG × 2COM (via software)
(*2)
: Select between 15SEG × 5COM, 16SEG × 4COM, 17SEG × 3COM, 18SEG × 2COM (via software)
(*3)
: Select between 19SEG × 5COM, 20SEG × 4COM, 21SEG × 3COM, 22SEG × 2COM (via software)
(*1)
Chip or TQFP64
16
www.lapis-semi.com/en
Specifications
Standard Type
Operating Conditions
Part No.
ML610Q486 /
ML610Q486P
ML610Q487 /
ML610Q487P
ML610Q488 /
ML610Q488P
ML610Q489 /
ML610Q489P
Operating
voltage
(V)
Operating frequency
1.6 to 3.6
500kHz
*1
1.8 to 3.8
1.8 to 3.8
1μs
30.5μs
1MHz / 32.768kHz
0.25μs
30.5μs
4MHz / 32.768kHz
1.8 to 3.8
Current *2 Operating
Minimum instruction consumption temperature
execution time
(°C)
(Typ.@HALT)
2μs
4MHz / 31.25kHz
(4MHz frequency division)
0.25μs
30.5μs
15μA
1.7μA
*3 : Including secondary functions
*4 : Only master function can support fast mode (400kbps) / standard mode (100kbps)
*5 : Only the Master function supports Standard Mode (50kbps)
*6 : No compatible chip select signals exist for 8bit / 16bit SPI BUS
*7 : Includes 256Byte test area
*8 : Includes 1KByte test area
*9 : 1KByte LCD RAM allocation included
*1 : 4MHz generated via internal PLL / ceramic / crystal oscillation,
500kHz and 2MHz via RC oscillation,
32.768kHz via crystal oscillation, and 32kHz via RC oscillation
*2 : Low current consumption during Suspend (HALT) Mode via low-speed 32kHz crystal oscillation
Suspend (HALT) Mode : Low-speed oscillation - only a time-based counter and watchdog timer are active.
The CPU, LCD bias circuit, and high-speed operation are stopped. The internal regulator is ON.
–20 to +70 /
–40 to +85
–20 to +70 /
–40 to +85
1.7μA
–20 to +70 /
–40 to +85
–
–20 to +70 /
–40 to +85
ROM/RAM
RAM
Port *3
capacity
Input/
(Byte) Input Output Output
ROM
capacity
(Byte)
*7
Flash 32K
21
4
(16bit×2)
–
16bit×1
–
1
4
(Sequential)
1
1.5K
8
4
24
8
(16bit×4)
–
16bit×2
–
1
–
1.5K
8
4
24
8
(16bit×4)
–
16bit×2
2
1
1.5K
8
4
24
8
(16bit×4)
–
16bit×2
2
1
*7
NEW
ML610482 /
ML610482P
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
0.244μs / 2μs /
30.5μs
0.5μA
–20 to +70 /
–40 to +85
Mask 64K
NEW
ML610Q482 /
ML610Q482P
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
0.244μs / 2μs
/ 30.5μs
0.5μA
–20 to +70 /
–40 to +85
Flash 64K
4K
6
4
22
4
(16bit×2)
–
16bit×1
2
1
4K
6
4
22
4
(16bit×2)
–
16bit×1
2
1
8bit timer
1kHz
timer
PWM
4
(16bit×2)
1
16bit×1
*7
Supply
voltage
UART detection
Serial port
2
IC
5
*7
Flash 48K
Capture WDT ADC(method)
6
*7
Flash 48K
PWM
1K
*7
Flash 48K
Functions/Features
1kHz
8bit timer
timer
*5
*6
SSIO
LCD driver
Interrupt sources
internal : external
Package
Others
1
1
1
–
14 : 5
–
TQFP48-P-0707-0.50-K
1
1
2
–
–
19 : 6
Low speed frequency
correction
TQFP48-P-0707-0.50-K
–
1
1
2
–
–
19 : 6
Low speed frequency
correction
TQFP48-P-0707-0.50-K
–
1
1
2
–
–
19 : 6
Low speed frequency
correction
TQFP48-P-0707-0.50-K
1
1
1
1
–
15 : 5
Low speed frequency correction/ TQFP48-P-0707-0.50-K
Buzzer
1
1
1
1
–
15 : 5
Low speed frequency correction/ TQFP48-P-0707-0.50-K
Buzzer
LCD driver
Interrupt sources
internal : external
Others
2
(RC oscillation)
2
(RC oscillation)
*4
*4
Chip
Support
Under development
Dot Matrix Type
Operating Conditions
Part No.
ML610Q421 /
ML610Q421P
ML610Q422 /
Operating
voltage
(V)
Operating frequency
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
*1
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
1.1 to 3.6
4.096MHz / 2MHz
/ 32.768kHz
0.244μs / 2μs
/ 30.5μs
0.244μs / 2μs
/ 30.5μs
NEW
ML610Q428P
NEW
ML610Q429 /
ML610Q429P
1.1 to 3.6
4.096MHz / 2MHz
/ 32.768kHz
0.244μs
/ 2μs(@2MHz)
/ 30.5μs
0.244μs
/ 2μs(@2MHz)
/ 30.5μs
ML610Q431
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
ML610Q432
1.1 to 3.6
NEW
ML610Q435
NEW
0.5μA
RAM
Port *3
capacity
Input/
(Byte) Input Output Output
ROM
capacity
(Byte)
*7
–20 to +70 /
Flash 32K
–40 to +85
*7
0.5μA
–20 to +70 /
Flash 32K
–40 to +85
0.5μA
*7
–20 to +70 /
Flash 48K
–40 to +85
*7
0.5μA
–20 to +70 /
Flash 48K
–40 to +85
0.244μs / 2μs
/ 30.5μs
0.5μA
–20 to +70
Flash 64K
4.096MHz / 500kHz
/ 32.768kHz
0.244μs / 2μs
/ 30.5μs
0.5μA
–20 to +70
Flash 64K
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
0.244μs / 2μs
/ 30.5μs
0.5μA
–20 to +70
Flash 96K
ML610Q436
1.1 to 3.6
4.096MHz / 500kHz
/ 32.768kHz
0.244μs / 2μs
/ 30.5μs
0.5μA
–20 to +70
Flash 96K
NEW
ML610Q438 /
ML610Q438P
1.1 to 3.6
4.096MHz / 2MHz
/ 32.768kHz
NEW
ML610Q439 /
ML610Q439P
1.1 to 3.6
4.096MHz / 2MHz
/ 32.768kHz
0.244μs
/ 2μs(@2MHz)
/ 30.5μs
0.244μs
/ 2μs(@2MHz)
/ 30.5μs
Functions/Features
ROM/RAM
Current *2 Operating
Minimum instruction consumption temperature
execution time
(°C)
(Typ.@HALT)
*7
*7
*7
*7
0.5μA
*7
–20 to +70 /
Flash 128K
–40 to +85
0.5μA
–20 to +70 /
Flash 128K
–40 to +85
*7
*9
2K
6
3
22
*9
2K
6
3
14
4
(16bit×2)
14
2
(16bit×1)
*9
4K
6
3
*9
4K
1
1
16bit×3
–
1
2(RC oscillation)
1
6
3
22
4
(16bit×2)
1
16bit×1
2
1
2(RC oscillation)
2 (Sequential)
1
6
3
14
4
(16bit×2)
1
16bit×1
2
1
2(RC oscillation)
2 (Sequential)
1
6
3
22
4
(16bit×2)
1
16bit×1
2
1
2(RC oscillation)
2 (Sequential)
1
6
3
14
4
(16bit×2)
1
16bit×1
2
1
2(RC oscillation)
2 (Sequential)
1
10
3
20
4
(16bit×2)
1
16bit×3
2
1
2(RC oscillation)
2 (Sequential)
1
10
3
20
4
(16bit×2)
1
16bit×3
2
1
2(RC oscillation)
2 (Sequential)
1
*9
7K
2(RC oscillation)
1
1
*9
7K
1
2(RC oscillation)
2 (Sequential)
IC
2
(16bit×1)
*9
3K
–
1
2(RC oscillation)
2 (Sequential)
20
*9
3K
16bit×3
2
1
3
*9
3K
1
16bit×1
2
17
Supply
voltage
UART detection
Serial port
2
10
*9
3K
1
Capture WDT ADC(method)
*6
SSIO
*4
1
1
1
Max. 400dot
50seg × 8com.
17 : 5
Low speed frequency correction/
Melody : Buzzer
TQFP120-P-1414-0.40-K
1
1
1
Max. 800dot
50seg × 16com.
17 : 5
Low speed frequency correction/
Melody : Buzzer
TQFP120-P-1414-0.40-K
*4
*4
20 : 5
RTC / Low speed frequency correction/
TQFP128-P-1414-0.40-K
Melody : Buzzer
Max. 512dot
64seg × 8com.
20 : 9
RTC / Low speed frequency correction/
TQFP128-P-1414-0.40-K
Melody : Buzzer
1
Max. 1024dot
64seg × 16com.
20 : 5
RTC / Low speed frequency correction/
LQFP144-P-2020-0.50-ZK
Melody : Buzzer
1
1
Max. 1536dot
64seg × 24com.
20 : 5
RTC / Low speed frequency correction/
LQFP144-P-2020-0.50-ZK
Melody : Buzzer
1
1
1
Max. 1024dot
64seg × 16com.
20 : 5
RTC / Low speed frequency correction/
LQFP144-P-2020-0.50-ZK
Melody : Buzzer
1
1
1
Max. 1536dot
64seg × 24com.
20 : 5
RTC / Low speed frequency correction/
LQFP144-P-2020-0.50-ZK
Melody : Buzzer
1
1
1
Max. 1344dot
56seg × 24com.
23 : 9
Low speed frequency correction/
LQFP144-P-2020-0.50-ZK
Melody : Buzzer
1
1
1
Max. 1024dot
64seg × 16com.
23 : 9
Low speed frequency correction/
LQFP144-P-2020-0.50-ZK
Melody : Buzzer
1
1
1
1
1
1
1
1
1
*4
*4
*4
*4
*4
*4
*4
Package
Max. 1392dot
58seg × 24com.
www.lapis-semi.com/en
Chip
Support
Segment Type
NEW
NEW
NEW
NEW
NEW
NEW
NEW
NEW
NEW
ML610401 /
ML610401P
ML610402 /
ML610402P
ML610403 /
ML610403P
ML610404 /
ML610404P
ML610405 /
ML610405P
ML610406 /
ML610406P
ML610407 /
ML610407P
ML610408 /
ML610408P
ML610409 /
ML610409P
ML610Q407 /
ML610Q407P
ML610Q408 /
ML610Q408P
ML610Q409 /
ML610Q409P
ML610Q411 /
ML610Q411P
ML610Q412 /
ML610Q412P
Operating
voltage
(V)
Operating frequency
Minimum instruction
execution time
1.25 to 3.6
500kHz / 32.768kHz
2μs / 30.5μs
1.25 to 3.6
*1
500kHz / 32.768kHz
2μs / 30.5μs
Functions/Features
ROM/RAM
Operating Conditions
Part No.
Current
Operating
consumption temperature
(°C)
(Typ.@HALT)
0.9μA
0.9μA
*2
–20 to +70 /
–40 to +85
–20 to +70 /
–40 to +85
RAM
Port *3
capacity
Input/
(Byte) Input Output Output
ROM
capacity
(Byte)
*7
Mask 6K
500kHz / 32.768kHz
2μs / 30.5μs
0.9μA
–20 to +70 /
–40 to +85
Mask 6K
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
–20 to +70 /
–40 to +85
Mask 8K
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
–20 to +70 /
–40 to +85
Mask 8K
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
–20 to +70 /
–40 to +85
Mask 8K
Supply
voltage
UART detection
Serial port
*6
I2C
SSIO
LCD driver
Interrupt sources
internal : external
Others
Package
12
18
2
(16bit×1)
–
–
2
1
2 (RC oscillation)
–
–
1
–
Low speed frequency correction/
Max. 55dot
10 : 8
P-TQFP64-1010-0.50-ZK1
Melody : Buzzer
11seg × 5com. (include 4bit-OR input)
192
4
8
18
2
(16bit×1)
–
–
2
1
2 (RC oscillation)
–
–
1
–
Max. 75dot
Low speed frequency correction/
10 : 8
P-TQFP64-1010-0.50-ZK1
15seg × 5com. (include 4bit-OR input)
Melody : Buzzer
192
4
4
18
2
(16bit×1)
–
–
2
1
2 (RC oscillation)
–
–
1
–
Max. 95dot
Low speed frequency correction/
10 : 8
P-TQFP64-1010-0.50-ZK1
19seg × 5com. (include 8bit-OR input)
Melody : Buzzer
256
5
12
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Max. 105dot
Low speed frequency correction/
15 : 13
P-TQFP80-1414-0.65-ZK
21seg × 5com. (include 8bit-OR input)
Melody : Buzzer
256
5
8
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Max. 125dot
Low speed frequency correction/
15 : 13
P-TQFP80-1414-0.65-ZK
25seg × 5com. (include 8bit-OR input)
Melody : Buzzer
256
5
4
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Max. 145dot
Low speed frequency correction/
15 : 13
P-TQFP80-1414-0.65-ZK
29seg × 5com. (include 8bit-OR input)
Melody : Buzzer
*7
*7
*7
*8
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
–20 to +70 /
–40 to +85 Mask 16K
1K
5
12
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Max. 145dot
Low speed frequency correction/
15 : 13
P-TQFP100-1414-0.50-ZK
29seg × 5com. (include 8bit-OR input)
Melody : Buzzer
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
*8
–20 to +70 /
–40 to +85 Mask 16K
1K
5
8
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Low speed frequency correction/
Max. 165dot
15 : 13
P-TQFP100-1414-0.50-ZK
Melody : Buzzer
33seg × 5com. (include 8bit-OR input)
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
*8
–20 to +70 /
–40 to +85 Mask 16K
1K
5
4
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Low speed frequency correction/
Max. 185dot
15 : 13
P-TQFP100-1414-0.50-ZK
Melody : Buzzer
37seg × 5com. (include 8bit-OR input)
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
*8
–20 to +70 /
–40 to +85 Flash 16K
1K
5
12
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Max. 145dot
Low speed frequency correction/
15 : 13
P-TQFP100-1414-0.50-ZK
29seg × 5com. (include 8bit-OR input)
Melody : Buzzer
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
*8
–20 to +70 /
–40 to +85 Flash 16K
1K
5
8
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
2
1
–
Max. 165dot
Low speed frequency correction/
15 : 13
P-TQFP100-1414-0.50-ZK
33seg × 5com. (include 8bit-OR input)
Melody : Buzzer
2
1
–
Max. 185dot
Low speed frequency correction/
15 : 13
P-TQFP100-1414-0.50-ZK
37seg × 5com. (include 8bit-OR input)
Melody : Buzzer
1
1
1
Max. 144dot
36seg × 4com.
16 : 5
Low speed frequency correction/ TQFP120-P-1414-0.40-K
Buzzer
1
1
1
Max. 176dot
44seg × 4com.
16 : 5
Low speed frequency correction/
TQFP120-P-1414-0.40-K
Buzzer
1
1
1
Max. 144dot
36seg × 4com.
16 : 5
Low speed frequency correction/ TQFP120-P-1414-0.40-K
Buzzer
*8
1.25 to 3.6
2MHz / 32.768kHz
0.5μs / 30.5μs
0.9μA
–20 to +70 /
–40 to +85 Flash 16K
1K
5
4
22
4
(16bit×2)
–
16bit×1
2
1
2 (RC oscillation)
–
1.1 to 3.6
500kHz / 32.768kHz
2μs / 30.5μs
0.5μA
*7
–20 to +70 /
Flash 16K
–40 to +85
1K
6
3
22
4
(16bit×2)
1
16bit×1
2
1
2 (RC oscillation)
2 (Sequential)
1
1.1 to 3.6
500kHz / 32.768kHz
2μs / 30.5μs
0.5μA
–20 to +70 / Flash 16K
–40 to +85
1K
6
3
14
4
(16bit×2)
1
16bit×1
2
1
2 (RC oscillation)
2 (Sequential)
1
*7
*7
ML610Q415
Capture WDT ADC(method)
4
*7
1.25 to 3.6
PWM
192
*7
Mask 6K
1kHz
8bit timer
timer
1.1 to 3.6
500kHz
2μs
5.5μA
–20 to +70
Flash 16K
1K
6
3
22
4
(16bit×2)
1
16bit×/
2
1
2 (RC oscillation)
2(Sequential)
*5
*5
*5
1
Target Products and Compatible Product Development Support Systems
Segment Type
with Built-In LCD Driver
Dot Matrix Type
Standard Type
with Built-In LCD Driver
Target Products
ML610Q486 / ML610Q486P
ML610Q487 / ML610Q487P
ML610Q488 / ML610Q488P
ML610Q489 / ML610Q489P
ML610482 / ML610482P
ML610Q482 / ML610Q482P
ML610Q421 / ML610Q421P
ML610Q422 / ML610Q422P
ML610Q428 / ML610Q428P
ML610Q429 / ML610Q429P
ML610Q431
ML610Q432
ML610Q435
ML610Q436
ML610Q438 / ML610Q438P
ML610Q439 / ML610Q439P
ML610401 / ML610401P
ML610402 / ML610402P
ML610403 / ML610403P
ML610404 / ML610404P
ML610405 / ML610405P
ML610406 / ML610406P
ML610407 / ML610407P / ML610Q407 / ML610Q407P
ML610408 / ML610408P / ML610Q408 / ML610Q408P
ML610409 / ML610409P / ML610Q409 / ML610Q409P
ML610Q411 / ML610Q411P
ML610Q412 / ML610Q412P
ML610Q415
Hardware Tools
Software Tools
· Project management tool
(IDEU8 integrated development environment)
· Build tool
· Debugging tool
· Flash programming tool*11
· ROM code generation tool for code entry
Development
Tool
<Required environment>
· Windows® 2000/XP
· Graphic adapter and display of SVGA
(800×600) or more
μEASE
*10
· At least 20MB of free hard disk space
· Project management tool
(IDEU8 integrated development environment)
· Build tool
· Debugging tool
*11
· Flash programming tool
· Program development support tool for LCD control
· ROM code generation tool for code entry
μEASE*10
<Required environment>
· Windows® 2000/XP
· Graphic adapter and display of SVGA (800×600) or more
· At least 20MB of free hard disk space
18
Reference Board
ML610Q486
ML610Q487
ML610Q488
ML610Q489
ML610Q482
ML610Q482
ML610Q421
ML610Q422
ML610Q428
ML610Q429
ML610Q431
ML610Q432
ML610Q435
ML610Q436
ML610Q438
ML610Q439
ML610Q407
ML610Q407
ML610Q407
ML610Q407
ML610Q407
ML610Q407
ML610Q407
ML610Q408
ML610Q409
ML610Q411
ML610Q412
ML610Q415
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board*12
Reference board*13
Reference board*14
Reference board*15
Reference board*16
Reference board*17
Reference board
Reference board
Reference board
Reference board
Reference board
Reference board
*10 : All software except for MWμEASE is bundled in μEASE
*11 : All required μEASE units must be purchased when using MWμEASE
*12 : Setting the ML610Q407 reference board to ML610Q401 mode
enables operation equivalent to the ML610401 Mask version.
*13 : Setting the ML610Q407 reference board to ML610Q402 mode
enables operation equivalent to the ML610402 Mask version.
*14 : Setting the ML610Q407 reference board to ML610Q403 mode
enables operation equivalent to the ML610403 Mask version.
*15 : Setting the ML610Q407 reference board to ML610Q404 mode
enables operation equivalent to the ML610404 Mask version.
*16 : Setting the ML610Q407 reference board to ML610Q405 mode
enables operation equivalent to the ML610405 Mask version.
*17 : Setting the ML610Q407 reference board to ML610Q406 mode
enables operation equivalent to the ML610406 Mask version.
www.lapis-semi.com/en
Chip
Support
U8 Core, nX-U8/100 Core is an LAPIS Semiconductor's original 8bit CPU of RISC method.
IDEU8 is an LAPIS Semiconductor's project management tool for program development.
CCU8 is an LAPIS Semiconductor's C compiler for program development.
RASU8 is an LAPIS Semiconductor's assembler for program development.
RLU8 is an LAPIS Semiconductor's
linker for program development.
LIBU8 is an LAPIS Semiconductor's librarian (library generation tool) for program development.
OHU8 is an LAPIS Semiconductor's object
converter for program development.
FWμEASE is an LAPIS Semiconductor's flash writing tool.
HTU8 is an LAPIS Semiconductor's ROM code generation tool for code entry (flash
writing). DTU8 is an LAPIS Semiconductor's debug tool for program development.
μEASE is an LAPIS Semiconductor's on-chip debug emulator.
MWμEASE is an LAPIS Semiconductor's
MACU8 is an LAPIS Semiconductor's assemble package for program development. Windows ® 2000 / Windows ® XP / Windows ® Vista are
flash writing tool (for multi-writing).
registered trademarks of Microsoft Corporation USA in the US and other countries.
February 1st, 2011.
No.54BG6523E 10.2011
PDF