IEEE802.11b/g/n（1x1) Wireless LAN Module BP3580 HARDWARE SPECIFICATION Version 1.0.4 PROPRIETARY AND CONFIDENTIAL IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 Revision History VER. Descriptive Revision Date 1.0.4 First Edition 12/09/25 PROPRIETARY AND CONFIDENTIAL 2/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 1 ABSTRACT This guide is specification for the built-in wireless LAN LSI BU1805GU and based on IEEE802.11b/g/n (1×1) made by ROHM. PROPRIETARY AND CONFIDENTIAL 3/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 2 CONTENTS 1 ABSTRACT ................................................................ 3 2 CONTENTS ................................................................ 4 3 ABSOLUTE MAXIMUM RATINGS ............................................ 5 4 OPERATION CONDITIONS ................................................... 6 5 MAIN CHARACTERISTICS .................................................. 7 6 BLOCK DIAGRAM .......................................................... 8 7 ELECTRICAL CHARACTERISTICS ............................................ 9 8 TERMINAL FUNCTIONS .................................................... 10 9 DIMENSIONS ............................................................. 13 10 RECOMMENDED LAND PATTERN ........................................... 14 11 REFERENCE CIRCUIT ...................................................... 15 12 CAUTION FOR PCB LAYOUT ............................................... 20 13 RECOMMENDED REFLOW CONDITION ...................................... 21 14 PRECAUTIONS AS RESET OPERATION ....................................... 22 15 PRECAUTIONS ............................................................ 23 PROPRIETARY AND CONFIDENTIAL 4/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 3 ABSOLUTE MAXIMUM RATINGS No. 1 2 3 PARAMETER Power supply voltage Operating temperature range Storage temperature range SYMBOL LIMITS UNIT REMARKS VCC -0.3 ～ +3.6 V DC Topr -40 ～ 85 ℃ - Tstg -55 ～ 125 ℃ ESD-HBM 4 ESD endurance(*) Vsurge ±200 V MIL-STD-883/METHOD 3015 (*)RF-SW of the pin 35 (Ant terminal) inside is weak against static because of the specific. Please do enough static provision for operating module. Note) These are the values that must not be exceeded at any time under any application or any test conditions. Please make design keeping enough margins accordingly. PROPRIETARY AND CONFIDENTIAL 5/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 4 OPERATION CONDITIONS No. PARAMETER 1 Power supply voltage 2 Operating temperature range PROPRIETARY AND CONFIDENTIAL SYMBOL SPEC UNIT MIN. TYP. MAX. VCC 3.1 3.3 3.5 V Ta -40 25 85 ℃ 6/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 5 MAIN CHARACTERISTICS No. PARAMETER 1 Frequency width 2 Frequency tolerance CHARACTERISTICS 2,400MHz ～ 2,483.5MHz（ch1～ch13） Within ±25ppm IEEE802.11b ： 15dBm±2dB 3 RF output power IEEE802.11g ： 13dBm±2dB IEEE802.11n ： 12dBm±2dB IEEE802.11b ： 1 ～ 11Mbps 4 Supported data rates IEEE802.11g ： 6 ～ 54Mbps IEEE802.11n ： 6.5 ～ 72.2Mbps IEEE802.11b ： -94dBm @1Mbps, -89dBm @11Mbps 5 Receiving sensitivity IEEE802.11g ： -92dBm @6Mbps, -73dBm @54Mbps IEEE802.11n ： -90dBm @6.5Mbps, -68dBm @72.2Mbps 6 Diversity function 7 Security function Software diversity *Control signal for the external RF-SW control 64bit/128bit WEP, TKIP, AES (*) USB2.0 (High-Speed mode) 8 Host interface SDIO Ver.2.00 (High-Speed mode) UART (～921600bps) 9 Power supply voltage Only 3.3V (*) 64bit/128bit WEP, TKIP, and AES are everything processed with hardware. PROPRIETARY AND CONFIDENTIAL 7/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 6 BLOCK DIAGRAM BP3580 40MHz OSC RF-SW RF-SW RF IC 2.8V LDO 1.2V LDO RF I/F BaseBand & MAC 3.3V HOST I/F FLASH I/F EEPROM Fig1. Block diagram ・ Optional Flash memory is necessary for using flash boot functions. ・ External RF switch and antenna are needed for using Diversity functions. PROPRIETARY AND CONFIDENTIAL 8/28 HOST CPU FLASH MEMORY IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 7 ELECTRICAL CHARACTERISTICS CONDITIONS: Ta=25℃, VCC=3.3V, GND=0.0V No. PARAMETER CONDITION UNIT REMARKS 360 mA Continuous 340 400 mA 160 200 240 mA - 200 240 280 mA With USB Sleep mode - 500 - uA - Sending 1 SPEC Consumption current Receiving MIN. TYP. MAX. 240 300 280 Continuous (With USB) 2 Center frequency - 2412 - 2472 MHz - 3 Frequency deviation - -25 - 25 ppm - 11b：11Mbps 13 15 17 dBm - 11g：54Mbps 11 13 15 dBm - 11n：MCS7 10 12 14 dBm - - - - 2.5 uW/MHz - - - -30 dBr 1st Side-lobe - - -50 dBr 2nd Side-lobe - - -20 dBr ±11MHz - - -28 dBr ±20MHz - - -40 dBr ±30MHz - -89 -76 dBm PER<8% -73 -65 dBm PER<10% 4 5 RF output power Unnecessary out-of-band radiation DSSS 11Mbps 6 Transmit spectrum mask OFDM 54Mbps 11b：11Mbps 7 8 Receiving sensitivity 11g：54Mbps 11n：MCS7 - -68 -64 dBm PER<10% Unnecessary radiation Fr<1GHz - - 4 nW - for receiving Fr≧1GHz - - 20 nW - PROPRIETARY AND CONFIDENTIAL 9/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 8 TERMINAL FUNCTIONS Please refer the product DIMENSIONS for the terminal number position. Table 1. Terminal Functions（1/2） No. Terminal I/O Function Remarks 1 GND - Ground - 2 SDDATA3 I/O SDIO data 3 - 3 SDCLK I SDIO clock - 4 SDCMD I/O SDIO command - 5 GND - Ground - 6 USB_DP AI/O USB data plus - 7 USB_DM AI/O USB data minus - 8 GND - Ground - 9 SDDATA2 I/O SDIO data 2 - 10 SDDATA1 I/O SDIO data 1 or UART_RTS 11 SDDATA0 I/O SDIO data 0 or UART_CTS 12 GND - Ground - 13 GND - Ground - 14 VCC I Power supply 3.3V Module power supply input 15 VCC I Power supply 3.3V Module power supply input 16 V12 - 17 TRSTB I ARM JTAG TRSTB For debug 18 TDO O ARM JTAG TDO For debug 19 TDI I ARM JTAG TDI For debug 20 TCK I ARM JTAG TCK For debug 21 TMS I ARM JTAG TMS For debug 22 PRST I Power on reset 0 : Reset, 1 : Normal 23 HRST I Host reset 0 : Reset, 1 : Normal 24 GND - Ground - Bypass capacitor terminal (1.2V) PROPRIETARY AND CONFIDENTIAL 10/28 - IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 Table 1. Terminal Functions（2/2） No. Terminal I/O Function Remarks 25 GND - Ground - 26 GPIO8/32k I/O General purpose Input/Output 8 GP108 or 32.768kHz clock input 27 GPIO6 I/O General purpose Input/Output 6 28 GPIO2 I/O General purpose Input/Output 2 - 29 V28 - Bypass capacitor terminal(2.8V) - 30 M_ANA AI/O Analog monitor terminal For Debug 31 GPIO1 I/O General purpose Input/Output 1 - 32 GPIO0 I/O General purpose Input/Output 0 - 33 GND - Ground - 34 GND - Ground - 35 ANT AI/O RF Input/Output Antenna terminal（50Ω） 36 GND - Ground - 37 GND - Ground - 38 FLASH_SEL I (*) Flash memory area select 0: Region1, 1: Region2 39 FLASH_TXD I/O Flash memory sending data Flash boot terminal 40 FLASH_CLK O Flash memory clock Flash boot terminal 41 FLASH_CSB O Flash memory selection Flash boot terminal 42 FLASH_RXD I Flash memory receiving data Flash boot terminal 43 HOST_SEL I (*) Host I/F select 0:USB 1:SDIO 44 BOOT_SEL0 I (*) BOOT_SEL[1:0] Boot mode select 00:USB, 01:SDIO, 10:FLASH, 45 BOOT_SEL1 I (*) 46 UART_TXD O UART transmit data - 47 UART_RXD I UART receiving data - 48 GND - Ground - 11:UART Please refer to pin number in “DIMENSIONS.” V12 terminal and V28 terminal are for the external bypass capacitor. Be sure to connect the capacitor with large capacitance to VCC terminal and V28 terminal. Please match (impedance matching) ANT terminal (pin 35) to 50Ω. PROPRIETARY AND CONFIDENTIAL 11/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 (*)FLASH_SEL/HOST_SEL/BOOT_SEL0/BOOT_SEL1/ terminal hold the value when releasing the POWER ON RESET. After releasing the POWER ON RESET, these terminals are used for another purpose in the module. They have pull down resistance inside. Therefore, please pull up the voltage OPEN in case of setting for “0” and 3.3V (power supply voltage) with 3-5kΩ (recommendation is 4.7kΩ) in case of setting for “1”. When the host MCU controlling these terminal, please do not connect directly with output pin of host MCU and insert 3kΩ～5kΩresistor (recommendation is 4.7kΩ) between them. When FLASH BOOT function is used, FLASH_TXD terminal (pin 39) should be connected pull down resistance of 47kΩ. When FLASH BOOT function is not used, FLASH_TXD terminal (pin 39) and FLASH_RXD (pin 42) terminal would be connected pull down resistance, if you need. PRST terminal is POWER ON RESET terminal. It is connected 4.7kΩ+2.2uF at 3.3V inside the module. In case that need to watch the power supply voltage, please connect such as OPEN DRAIN RESET IC for this terminal. Please open the other unused terminal. PROPRIETARY AND CONFIDENTIAL 12/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 9 DIMENSIONS 1 pin mark Terminal pitch Fig.2 Dimensions（Unit: mm） Marking ： ROHM Trade Mark ＢＰ３５８０ ： Type Name １０１８＊ ： Production lot number (4 digits) （Example）１０１８＊→Year 2010 PROPRIETARY AND CONFIDENTIAL 13/28 Week 18 ＊Location IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 10 RECOMMENDED LAND PATTERN No patterning area Land pattern enlarged image Fig.3 Recommended Land Pattern (Unit: mm) Caution: There are patterning on the soldering surface (bottom side). Please be sure not to wire (including GND) on the part of PCB under the module (Fig.3 Recommended land pattern) except land pattern for mounting the module. PROPRIETARY AND CONFIDENTIAL 14/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 11 REFERENCE CIRCUIT 11-1 SDIO Interface Matching Circuit BP3580 Fig.4 SDIO Interface Reference Circuit ※Matching Circuit is depending on the type of antenna, PCB and etc. Please consult with antenna maker or PCB maker. ※ It is necessary impedance control (50Ω) that is the wireless from ANT terminal (pin 35) to ANT1. ※ Please reduce the ripple of power supply (VCC=3.3V) as much as possible (less than 10mVpp). ※ About the line of SDCLK/SDDATA/SDCMD Over shoot and under shoot of signal line cause lot of damage to wireless performance. Please design so that its noise level becomes lower as possible within the SDIO standard timing. It can be insert dumping resistor near the host signal source. PROPRIETARY AND CONFIDENTIAL 15/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 11-2 USB Host Interface Matching Circuit BP3580 Fig.5 USB Interface Reference Circuit ※About USB_DP/USB_DM line ・ Please shorten the wiring length as much as possible. ・ Please take the differential impedance matching 90Ω±10％. ・ Please set up the impedance matching of single end 45Ω±10％. ・ Please wire so that USB_DP and USB_DM may become the same lengths as possible. (Difference of the length is less than 0.5mm.) ・ Please do not bend many times and make the bend angle small. ・ Please do not make the through hole on wiring if possible. ・ Please do not cross the USB_DP/USB_DM line by other signal line, and USB_DP/USB_DM line do not cross also the sprit of power supply. ※ Please reduce the ripple of power supply (VCC=3.3V) as much as possible (less than 10mVpp). PROPRIETARY AND CONFIDENTIAL 16/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 11-3 UART INTERFACE MODE Matching Circuit BP3580 MAX3232EUE+ (MAXIM) Fig.6 UART Interface Reference Circuit ※ About the set up of BOOT terminal, please refer to Table 1 (Terminal Functions). ※ Please reduce the ripple of power supply (VCC=3.3V) as much as possible (less than 10mVpp). PROPRIETARY AND CONFIDENTIAL 17/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 11-4 FLASHBOOT (UART INTERFACE MODE) Matching Circuit BP3580 S25FL032P(SPANSION) or M25PE40(MICRON)(*) (*)The flash memory of above figure is S25FL032P. Fig.7 FLASH BOOT (UART Interface Mode) Reference Circuit PROPRIETARY AND CONFIDENTIAL 18/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 11-5 RESET IC BP3580 (ROHM) Fig.8 RESET IC Connection Reference Circuit PROPRIETARY AND CONFIDENTIAL 19/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 12 CAUTION FOR PCB LAYOUT 1) Wiring of ANT terminal (pin 35) to ANT1 needs impedance control (50Ω). 2) Soldering side of BP3580 (the bottom side of the module) has wiring patterns. Please be sure not to wire (including GND) on the part of PCB under the module except land pattern for mounting the module. 3) When mounting to multilayer PCB, second layer of under side of the module should be the GND layer, and all under side of the module should be GND. 4) Be sure to set ANT line not to cross the signal line or power line in the other layer too. 5) Be sure to set I/F signal line not to cross the signal line or power line in the other layer too. 6) Please set the bypass capacitors for VCC, V28, and V12 near the module. 7) When you arrange the GND layer in multilayer, please open the through hole to a nearest part of the module and through it to the GND layer. PROPRIETARY AND CONFIDENTIAL 20/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 13 RECOMMENDED REFLOW CONDITION ［℃］ 300 Peaking Temperature 250℃ 250 200 150 170℃ 140℃ 100 Pre-Heating 50 Room Temperature About 80s About 60s ※Reflow solder can be operated only once Fig.9 Recommended Reflow Profile PROPRIETARY AND CONFIDENTIAL 21/28 Above 200℃ Within 60s IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 14 PRECAUTIONS AS RESET OPERATION ･Please do not reset (PRST, HRST, COMMAND RESET) when BP3580 is accessing to its internal EEPROM. ･BP3580 under writing to the EEPROM is reset (*), which may cause unexpected failure such as incorrect checksum. ･BP3580 under reading from the EEPROM is reset (**), which may cause unstable condition, and you should supply VCC power again. (*) About write operations of the EEPROM BP3580 writes to the EEPROM in the following cases. ①Recording the MAC address ②Recording various settings used in TCP/IP firmware ③Recording credential data which is obtained when BP3591 with stand-alone mode acts WPS (**) About read operations of the EEPPROM BP3580 reads from the EEPROM in the following cases. ①After reset (≦100ms) ②After firmware starting (≦100ms) ③When WID_SERIAL_NUMBER command is issued. PROPRIETARY AND CONFIDENTIAL 22/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 15 PRECAUTIONS 1) This product allows the reflow process only once. (With ROHM’s recommended reflow conditions) During the reflow process, the solder inside the product may be re-fused or re-melt. Please note this and pay special attention. 2) If this product is laid neglected, it will absorb moisture from the surrounding environment. Please keep this product with below mentioned condition, and reflow mount it within 72 hours of opening the laminated bag. <Store condition> Temperature: 5～40℃ Relative Humidity: 50±10%RH 3) If storage in the desiccators where is humidity under the recommended values, Please do enough static provision. 4) Please use after baking process with following conditions when it passed 72 hours after opening; ・Baking condition: Reel type: 60℃, 48 hours, up to twice Single type: 125℃, 24 hours, up to twice 5) There will be a case of having different lot product within one or same reel. 6) When a mounter is used to place this product, its recognition should be taken with the reverse side (pad) of product. It is not recommended to use the dimensions of product for recognition as its tolerance is big. 7) About soldering parts of mounting on this product, presence of soldering fillet does not be asked. 8) This module is assumed to be mounted on glass epoxy PCB. If the module is mounted on other materials such as ceramic, be sure to evaluate it sufficiently. PROPRIETARY AND CONFIDENTIAL 23/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 9) RF-SW (pin 35, ANT terminal) which is mounted inside the module is a product very weak to static electricity on the specification. Please use it after doing the countermeasure against static electricity enough. 10) Please note that it is likely to come off when the stress joins the shield case. 11) BP3580 is written the same MAC Address in the EEPROM when shipped. Please set any MAC Address when you use. PROPRIETARY AND CONFIDENTIAL 24/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 ● Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in environment subject to strong vibration and impact. [f] Use in proximity to heat-producing components, plastic cords, or other flammable items [g] Use involving sealing or coating the products with resin or other coating materials [h] In contact with unclean solder or exposed to water or water-soluble cleaning agents used after soldering. [i] Use of the products in places subject to dew condensation 3) The products might receive the radio wave interference from electronic devices such as Wireless LAN devices, Bluetooth® devices, digital cordless telephone, microwave oven and so on that radiate electromagnetic wave. PROPRIETARY AND CONFIDENTIAL 25/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 4) The products are not radiation resistant. 5) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. 6) Confirm that operation temperature is within the specified range described in product specification. 7) Failure induced under deviant condition from what defined in the product specification can not be guaranteed. 8) When product safety related problems arises, please immediately inform to ROHM, and consider technical counter measure. ● Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) Soldering is reflow solder in principle. ●Precautions Regarding Reference Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The reference circuit examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. ● Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). PROPRIETARY AND CONFIDENTIAL 26/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 ● Precaution for Storage / Transportation 1) Product performance and connector mating may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company Temperature: 5℃～40℃, Humidity 40%～60% [c] Storage in direct sunshine or condensation. [d] Storage in high Electrostatic. 2) Even under ROHM recommended storage condition, connector mating of products over 1 year old may be degraded. The products which passed the recommended storage condition should be confirmed about soldering quality. ・Recommended storage condition: Temperature: 5℃～40℃,Humidity: 40%～60% 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Please use in regulation time after opening the damp-proof packing. Please use after baking process with following conditions when the regulation time passes; ・Regulation time: Within 72 hours, Temperature: 5℃～40℃, Humidity: 40%～60% ・Baking condition: Reel type: 60℃, 48 hours, up to twice Single type: 125℃, 24 hours, up to twice ● Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain an internal part number that is inconsistent with a product part number. ● Precaution for disposition When disposing products please dispose them properly with an industry waste company. PROPRIETARY AND CONFIDENTIAL 27/28 IEEE802.11b/g/n (1x1) BP3580 Hardware Specification 2012/09/25 ● Prohibitions Regarding Industrial Property 1) These Specifications contain information related to the ROHM industrial property. Any use of them other than pertaining to the usage of appropriate products is not permitted. Duplication of these Specifications and its disclosure to a third party without the Company’s permission is prohibited. 2) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 3) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. 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