Datasheet

Hall ICs
Omnipolar Detection Hall ICs
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
No.10045EGT02
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
●Description
The omnipolar Hall ICs are magnetic switches that can operate both S-and N-pole, upon which the output goes from Hi to
Low. In addition to regular single-output Hall ICs, We offer a lineup of dual-output units with a reverse output terminal (active
High).
●Features
1) Omnipolar detection
2) Micro power operation (small current using intermittent operation method)(BD7411G is excluded.)
3) Ultra-compact and thin wafer level CSP4 package (BU52054GWZ, BU52055GWZ)
4) Ultra-compact wafer level CSP4 package (BU52015GUL, BU52001GUL)
5) Ultra-Small outline package SSON004X1216 (BU52061NVX, BU52053NVX, BU52056NVX)
6) Ultra-Small outline package HVSOF5 (BU52011HFV, BU52021HFV)
7) Small outline package (BU52025G, BD7411G)
8) Line up of supply voltage
For 1.8V Power supply voltage (BU52054GWZ, BU52055GWZ, BU52015GUL, BU52061NVX, BU52053NVX,
BU52056NVX, BU52011HFV)
For 3.0V Power supply voltage (BU52001GUL)
For 3.3V Power supply voltage (BU52021HFV, BU52025G)
For 5.0V Power supply voltage (BD7411G)
9) Dual output type (BU52015GUL)
10) High ESD resistance 8kV (HBM) (6kV for BU52056NVX)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc.
●Lineup matrix
Product name
Supply
voltage
(V)
Operate
point
(mT)
(mT)
(ms)
Supply current
(AVG)
(A)
0.9
50
5.0µ
CMOS
UCSP35L1
Hysteresis
Period
Output
type
Package
BU52054GWZ
1.65～3.60
+/-6.3
※
BU52055GWZ
1.65～3.60
+/-4.1
※
0.8
50
5.0µ
CMOS
UCSP35L1
BU52015GUL
1.65～3.30
+/-3.0
※
0.9
50
5.0µ
CMOS
VCSP50L1
BU52001GUL
2.40～3.30
+/-3.7
※
0.8
50
8.0µ
CMOS
VCSP50L1
BU52061NVX
1.65～3.60
+/-3.3
※
0.9
50
4.0µ
CMOS
SSON004X1216
BU52053NVX
1.65～3.60
+/-3.0
※
0.9
50
5.0µ
CMOS
SSON004X1216
BU52056NVX
1.65～3.60
+/-4.6
※
0.8
50
5.0µ
CMOS
SSON004X1216
BU52011HFV
1.65～3.30
+/-3.0
※
0.9
50
5.0µ
CMOS
HVSOF5
BU52021HFV
2.40～3.60
+/-3.7
※
0.8
50
8.0µ
CMOS
HVSOF5
BU52025G
2.40～3.60
+/-3.7
※
0.8
50
8.0µ
CMOS
SSOP5
BD7411G
4.50～5.50
+/-3.4
※
0.4
-
2.0m
CMOS
SSOP5
※Plus is expressed on the S-pole; minus on the N-pole
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
●Absolute maximum ratings
BU52054GWZ, BU52055GWZ (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Power Supply Voltage
VDD
-0.1～+4.5※1
V
Output Current
IOUT
±0.5
Power Dissipation
Pd
Operating
Temperature Range
Storage
Temperature Range
Technical Note
BU52015GUL (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Power Supply Voltage
VDD
-0.1～+4.5※3
V
mA
Output Current
IOUT
±0.5
mA
100※2
mW
Power Dissipation
Pd
420※4
mW
Topr
-40～+85
℃
Topr
-40～+85
℃
Tstg
-40～+125
℃
Tstg
-40～+125
℃
Operating
Temperature Range
Storage
Temperature Range
※1. Not to exceed Pd
※2. Reduced by 1.00mW for each increase in Ta of 1℃ over 25℃
(mounted on 24mm×20mm Glass-epoxy PCB)
※3. Not to exceed Pd
※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52001GUL (Ta=25℃)
BU52061NVX, BU52053NVX, BU52056NVX(Ta=25℃)
Parameter
Symbol
Ratings
Unit
Parameter
Symbol
Ratings
Unit
Power Supply Voltage
VDD
-0.1～+4.5※5
V
Power Supply Voltage
VDD
-0.1～+4.5※7
V
Output Current
IOUT
±1
mA
Output Current
IOUT
±0.5
mA
Power Dissipation
Pd
420※6
mW
Power Dissipation
Pd
2049※8
mW
Topr
-40～+85
℃
Topr
-40～+85
℃
Tstg
-40～+125
℃
Tstg
-40～+125
℃
Operating
Temperature Range
Storage
Temperature Range
Operating
Temperature Range
Storage
Temperature Range
※5. Not to exceed Pd
※6. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52011HFV (Ta=25℃)
Parameter
Symbol
Power Supply Voltage
VDD
Output Current
IOUT
Power Dissipation
Pd
Operating
Temperature Range
Storage
Temperature Range
Ratings
※7. Not to exceed Pd
※8. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
Unit
※9
-0.1～+4.5
±0.5
10
536※
BU52021HFV (Ta=25℃)
Parameter
Symbol
V
Ratings
Power Supply Voltage
VDD
mA
Output Current
IOUT
±1
mW
Power Dissipation
Pd
536※
Topr
-40～+85
℃
Tstg
-40～+125
℃
Operating
Temperature Range
Storage
Temperature Range
Unit
※11
-0.1～+4.5
12
V
mA
mW
Topr
-40～+85
℃
Tstg
-40～+125
℃
※9. Not to exceed Pd
※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
※11 Not to exceed Pd
※12. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
BU52025G (Ta=25℃)
BD7411G (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Parameter
Symbol
Ratings
Unit
Power Supply Voltage
VDD
-0.1～+4.5※13
V
Power Supply Voltage
VDD
-0.3～+7.0※15
V
Output Current
IOUT
±1
mA
Output Current
IOUT
±1
mA
Power Dissipation
Pd
540※14
mW
Power Dissipation
Pd
540※16
mW
Topr
-40～+85
℃
Topr
-40～+85
℃
Tstg
-40～+125
℃
Tstg
-55～+150
℃
Operating
Temperature Range
Storage
Temperature Range
※13. Not to exceed Pd
※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Operating
Temperature Range
Storage
Temperature Range
※15. Not to exceed Pd
※16. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
2/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
●Magnetic, Electrical characteristics
BU52054GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
1.65
1.80
3.60
BopS
-
6.3
7.9
BopN
-7.9
-6.3
-
BrpS
3.5
5.4
-
BrpN
-
-5.4
-3.5
BhysS
-
0.9
-
BhysN
-
0.9
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
BrpN<B<BrpS
IOUT =-0.5mA
※17
Output Low Voltage
VOL
-
-
0.2
V
B<BopN, BopS<B
IOUT =+0.5mA
※17
Supply Current
IDD(AVG)
-
5
8
µA
Average
Supply Current During Startup Time
IDD(EN)
-
2.8
-
mA
During Startup Time Value
Supply Current During Standby Time
IDD(DIS)
-
1.8
-
µA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※17 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
3/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52055GWZ (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
1.65
1.80
3.60
BopS
-
4.1
5.5
BopN
-5.5
-4.1
-
BrpS
1.5
3.3
-
BrpN
-
-3.3
-1.5
BhysS
-
0.8
-
BhysN
-
0.8
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
BrpN<B<BrpS
IOUT =-0.5mA
※18
Output Low Voltage
VOL
-
-
0.2
V
B<BopN, BopS<B
IOUT =+0.5mA
※18
Supply Current
IDD(AVG)
-
5
8
µA
Average
Supply Current During Startup Time
IDD(EN)
-
2.8
-
mA
During Startup Time Value
Supply Current During Standby Time
IDD(DIS)
-
1.8
-
µA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※18 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
4/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52015GUL (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Operate Point
Release Point
Hysteresis
Period
Output High Voltage
Max.
VDD
1.65
1.80
3.30
BopS
-
3.0
5.0
BopN
-5.0
-3.0
-
BrpS
0.6
2.1
-
BrpN
-
-2.1
-0.6
BhysS
-
0.9
-
BhysN
-
0.9
-
Tp
-
50
100
VOH
VDD-0.2
-
-
Technical Note
Unit
Conditions
V
mT
mT
mT
ms
※19
V
OUT1: BrpN<B<BrpS
OUT2: B<BopN, BopS<B
IOUT = -0.5mA
※19
VOL
-
-
0.2
V
OUT1: B<BopN, BopS<B
OUT2: BrpN<B<BrpS
IOUT = +0.5mA
Supply Current 1
IDD1(AVG)
-
5
8
µA
VDD=1.8V, Average
Supply Current During Startup Time 1
IDD1(EN)
-
2.8
-
mA
VDD=1.8V,
During Startup Time Value
Supply Current During Standby Time 1
IDD1(DIS)
-
1.8
-
µA
VDD=1.8V,
During Standby Time Value
Supply Current 2
IDD2(AVG)
-
8
12
µA
VDD=2.7V, Average
Supply Current During Startup Time 2
IDD2(EN)
-
4.5
-
mA
VDD=2.7V,
During Startup Time Value
Supply Current During Standby Time 2
IDD2(DIS)
-
4.0
-
µA
VDD=2.7V,
During Standby Time Value
Output Low Voltage
※19 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
5/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52001GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
2.4
3.0
3.3
BopS
-
3.7
5.5
BopN
-5.5
-3.7
-
BrpS
0.8
2.9
-
BrpN
-
-2.9
-0.8
BhysS
-
0.8
-
BhysN
-
0.8
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.4
-
-
V
BrpN<B<BrpS
IOUT =-1.0mA
※20
Output Low Voltage
VOL
-
-
0.4
V
B<BopN,BopS<B
IOUT =+1.0mA
※20
Supply Current
IDD(AVG)
-
8
12
µA
Average
Supply Current During Startup Time
IDD(EN)
-
4.7
-
mA
During Startup Time Value
Supply Current During Standby Time
IDD(DIS)
-
3.8
-
µA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※20 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
6/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52061NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
1.65
1.80
3.60
BopS
2.3
3.3
4.7
BopN
-4.7
-3.3
-2.3
BrpS
1.2
2.4
3.4
BrpN
-3.4
-2.4
-1.2
BhysS
-
0.9
-
BhysN
-
0.9
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
BrpN<B<BrpS
IOUT =-0.5mA
※21
Output Low Voltage
VOL
-
-
0.2
V
B<BopN, BopS<B
IOUT =+0.5mA
※21
Supply Current 1
IDD1(AVG)
-
4
7
µA
VDD=1.8V, Average
Supply Current During Startup Time 1
IDD1(EN)
-
5.0
-
mA
VDD=1.8V,
During Startup Time Value
Supply Current During Standby Time 1
IDD1(DIS)
-
1.8
-
µA
VDD=1.8V,
During Standby Time Value
Supply Current 2
IDD2(AVG)
-
9
16
µA
VDD=3.0V, Average
Supply Current During Startup Time 2
IDD2(EN)
-
9.0
-
mA
VDD=3.0V,
During Startup Time Value
Supply Current During Standby Time 2
IDD2(DIS)
-
4.4
-
µA
VDD=3.0V,
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※21 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
7/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52053NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
1.65
1.80
3.60
BopS
-
3.0
5.0
BopN
-5.0
-3.0
-
BrpS
0.6
2.1
-
BrpN
-
-2.1
-0.6
BhysS
-
0.9
-
BhysN
-
0.9
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
BrpN<B<BrpS
IOUT =-0.5mA
※22
Output Low Voltage
VOL
-
-
0.2
V
B<BopN, BopS<B
IOUT =+0.5mA
※22
Supply Current
IDD(AVG)
-
5
8
µA
Average
Supply Current During Startup Time
IDD(EN)
-
2.8
-
mA
During Startup Time Value
Supply Current During Standby Time
IDD(DIS)
-
1.8
-
µA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※22 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
8/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52011HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
1.65
1.80
3.30
BopS
-
3.0
5.0
BopN
-5.0
-3.0
-
BrpS
0.6
2.1
-
BrpN
-
-2.1
-0.6
BhysS
-
0.9
-
BhysN
-
0.9
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
BrpN<B<BrpS
IOUT =-0.5mA
※23
Output Low Voltage
VOL
-
-
0.2
V
B<BopN, BopS<B
IOUT =+0.5mA
※23
Supply Current 1
IDD1(AVG)
-
5
8
µA
VDD=1.8V, Average
Supply Current During Startup Time 1
IDD1(EN)
-
2.8
-
mA
VDD=1.8V,
During Startup Time Value
Supply Current During Standby Time 1
IDD1(DIS)
-
1.8
-
µA
VDD=1.8V,
During Standby Time Value
Supply Current 2
IDD2(AVG)
-
8
12
µA
VDD=2.7V, Average
Supply Current During Startup Time 2
IDD2(EN)
-
4.5
-
mA
VDD=2.7V,
During Startup Time Value
Supply Current During Standby Time 2
IDD2(DIS)
-
4.0
-
µA
VDD=2.7V,
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※23 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
9/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52056NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Power Supply Voltage
Max.
Technical Note
Unit
Conditions
VDD
1.65
1.80
3.60
BopS
-
4.6
6.4
BopN
-6.4
-4.6
-
BrpS
2.0
3.8
-
BrpN
-
-3.8
-2.0
BhysS
-
0.8
-
BhysN
-
0.8
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
BrpN<B<BrpS
IOUT =-0.5mA
※24
Output Low Voltage
VOL
-
-
0.2
V
B<BopN, BopS<B
IOUT =+0.5mA
※24
Supply Current
IDD(AVG)
-
5
8
µA
Average
Supply Current During Startup Time
IDD(EN)
-
2.8
-
mA
During Startup Time Value
Supply Current During Standby Time
IDD(DIS)
-
1.8
-
µA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※24 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
10/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
BU52021HFV,BU52025G (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Power Supply Voltage
Technical Note
Unit
Conditions
VDD
2.4
3.0
3.6
BopS
-
3.7
5.5
BopN
-5.5
-3.7
-
BrpS
0.8
2.9
-
BrpN
-
-2.9
-0.8
BhysS
-
0.8
-
BhysN
-
0.8
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD-0.4
-
-
V
BrpN<B<BrpS
IOUT =-1.0mA
※25
Output Low Voltage
VOL
-
-
0.4
V
B<BopN, BopS<B
IOUT =+1.0mA
※25
Supply Current
IDD(AVG)
-
8
12
µA
Average
Supply Current During Startup Time
IDD(EN)
-
4.7
-
mA
During Startup Time Value
Supply Current During Standby Time
IDD(DIS)
-
3.8
-
µA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
※25 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
11/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BD7411G (Unless otherwise specified, VDD=5.0V, Ta=25℃)
Parameter
Symbol
Limits
Unit
Conditions
Min.
Typ.
Max.
VDD
4.5
5.0
5.5
BopS
-
3.4
5.6
BopN
-5.6
-3.4
-
BrpS
1.5
3.0
-
BrpN
-
-3.0
-1.5
BhysS
-
0.4
-
BhysN
-
0.4
-
Output High Voltage
VOH
4.6
-
-
V
BrpN<B<BrpS
IOUT =-1.0mA
※26
Output Low Voltage
VOL
-
-
0.4
V
B<BopN, BopS<B
IOUT =+1.0mA
※26
Supply Current
IDD
-
2
4
mA
Power Supply Voltage
Operate Point
Release Point
Hysteresis
V
mT
mT
mT
※26 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
Radiation hardiness is not designed.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
12/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Figure of measurement circuit
Tp
BOP/BRP
200Ω
VDD
VDD
100µF
VDD
VDD
OUT
GND
V
Bop and Brp are measured with applying the magnetic field from the outside.
Fig.1
OUT
Oscilloscope
GND
The period is monitored by Oscilloscope.
Fig.2
Bop,Brp mesurement circuit
Tp mesurement circuit
Product Name
VOH
VDD
VDD
OUT
100µF
GND
Fig.3
IOUT
V
BU52001GUL, BU52021HFV,
BU52025G, BD7411G
BU52054GWZ, BU52055GWZ,
BU52015GUL, BU52061NVX,
BU52053NVX, BU52056NVX,
BU52011HFV
Product Name
VDD
OUT
100µF
GND
Fig.4
1.0mA
0.5mA
VOH mesurement circuit
VOL
VDD
IOUT
IOUT
V
BU52001GUL, BU52021HFV,
BU52025G, BD7411G
BU52054GWZ, BU52055GWZ,
BU52015GUL, BU52061NVX,
BU52053NVX, BU52056NVX,
BU52011HFV
IOUT
1.0mA
0.5mA
VOL measurement circuit
IDD
Product Name
A
VDD
VDD
OUT
C
GND
Fig.5
C
BU52054GWZ, BU52055GWZ,
BU52015GUL, BU52001GUL,
BU52061NVX, BU52053NVX,
BU52056NVX, BU52011HFV,
BU52021HFV, BU52025G
2200µF
BD7411G
100µF
IDD measurement circuit
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
13/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Technical (Reference) Data
BU52054GWZ(VDD=1.65～3.6V type)
8.0
6.0
MAGNETIC FLUX DENSITY [mT]
Brp S
4.0
VDD=1.8V
2.0
0.0
-2.0
-4.0
Brp N
-6.0
Fig.6
2.0
70
Ta = 25°C
-2.0
Brp N
-6.0
10
Bop N
1.8
2.2
2.6
0
3.0
3.4
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
3.8
60
50
40
30
20
10
0
16.0
12.0
VDD=1.8V
10.0
8.0
6.0
4.0
2.0
14.0
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
100
1.4
1.8
Fig.11
Fig.10 IDD– Ambient temperature
Fig.9 TP– Supply voltage
Ta = 25°C
12.0
0.0
1.8
100
Fig.8 TP– Ambient temperature
Fig.7 Bop,Brp– Supply voltage
AVERAGE SUPPLY CURRENT [µA]
70
1.4
40
SUPPLY VOLTAGE [V]
Ta = 25°C
80
50
20
14.0
90
60
30
-4.0
1.4
Bop,Brp– Ambient temperature
VDD=1.8V
80
0.0
100
100
PERIOD [ms]
4.0
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
90
Brp S
Bop N
-8.0
100
Bop S
6.0
AVERAGE SUPPLY CURRENT [µA]
MAGNETIC FLUX DENSITY [mT]
Bop S
PERIOD [ms]
8.0
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
IDD– Supply voltage
BU52055GWZ(VDD=1.65～3.6V type)
8.0
VDD=1.8V
Bop S
4.0
Brp S
2.0
0.0
-2.0
Brp N
-4.0
Bop N
-6.0
90
Bop S
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
70
Brp S
2.0
0.0
-2.0
Brp N
Fig.12
0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
3.8
Fig.13 Bop,Brp– Supply voltage
16.0
Ta = 25°C
80
70
60
50
40
30
20
10
0
VDD=1.8V
AVERAGE SUPPLY CURRENT [µA]
AVERAGE SUPPLY CURRENT [µA]
90
12.0
10.0
8.0
6.0
4.0
2.0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
Fig.15 TP– Supply voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
Ta = 25°C
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0.0
1.4
100
Fig.14 TP – Ambient temperature
14.0
100
40
10
1.4
Bop,Brp– Ambient temperature
50
20
Bop N
-6.0
60
30
-4.0
100
VDD=1.8V
80
4.0
-8.0
-8.0
PERIOD [ms]
6.0
PERIOD [ms]
6.0
100
Ta = 25°C
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
100
Fig.16 IDD– Ambient temperature
14/31
1.4
1.8
Fig.17
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
IDD– Supply voltage
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52015GUL, BU52011HFV (VDD=1.65～3.3V type)
Ta = 25°C
4.0
MAGNETIC FLUX DENSITY [mT]
Bop S
2.0
Brp S
0.0
Brp N
-2.0
Bop N
-4.0
-6.0
90
6.0
4.0
70
2.0
Brp S
0.0
Brp N
-2.0
60
50
40
30
-4.0
Bop N
20
-6.0
10
0
-8.0
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
1.4
100
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
3.8
Fig.19 Bop,Brp Supply voltage
Fig.18 Bop,Brp– Ambient temperature
AVERAGE SUPPLY CURRENT [µA]
90
Ta = 25°C
80
70
60
50
40
30
20
10
0
14.0
12.0
VDD=1.8V
10.0
8.0
6.0
4.0
2.0
12.0
Ta = 25°C
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
0.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
3.8
SUPPLY VOLTAGE [V]
Fig.21 TP– Supply voltage
100
Fig.20 TP – Ambient temperature
14.0
100
VDD=1.8V
80
Bop S
AVERAGE SUPPLY CURRENT [µA]
MAGNETIC FLUX DENSITY [mT]
6.0
PERIOD [ms]
100
8.0
VDD=1.8V
PERIOD [ms]
8.0
Fig.22
100
1.4
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
Fig.23 IDD – Supply voltage
IDD– Ambient temperature
BU52001GUL (VDD=2.4～3.3V type)
8.0
6.0
Bop S
4.0
2.0
Brp S
0.0
-2.0
Brp N
-4.0
Bop N
-6.0
-8.0
90
6.0
Bop S
4.0
Fig.24
70
2.0
Brp S
0.0
-2.0
Brp N
-4.0
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
0
3.6
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
Fig.25 Bop,Brp– Supply voltage
70
60
50
40
30
20
10
0
14.0
12.0
VDD=3.0V
10.0
8.0
6.0
4.0
2.0
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
3.6
Fig.27 TP– Supply voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
Ta = 25°C
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0.0
2.0
100
Fig.26 TP– Ambient temperature
AVERAGE SUPPLY CURRENT [µA]
AVERAGE SUPPLY CURRENT [µA]
Ta = 25°C
80
40
20
14.0
90
50
10
2.0
100
60
30
Bop N
-6.0
100
Bop,Brp–Ambient temperature
VDD=3.0V
80
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
PERIOD [ms]
100
Ta = 25°C
PERIOD [ms]
VDD=3.0V
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
100
Fig.28 IDD– Ambient temperature
15/31
2.0
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
3.6
Fig.29 IDD – Supply voltage
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52061NVX(VDD=1.65～3.6V type)
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
6.0
90
70
2.0
Brp S
0.0
Brp N
-2.0
60
50
40
30
-4.0
Bop N
20
-6.0
10
0
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
100
1.4
Fig.30 Bop,Brp– Ambient temperature
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
3.8
Fig.32 TP – Ambient temperature
Fig.31 Bop,Brp– Supply voltage
100
Ta = 25°C
80
70
60
50
40
30
20
10
14.0
VDD=1.8V
AVERAGE SUPPLY CURRENT [µA]
AVERAGE SUPPLY CURRENT [µA]
14.0
90
12.0
10.0
8.0
6.0
4.0
2.0
0
12.0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
8.0
6.0
4.0
2.0
0.0
1.4
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.34 IDD– Ambient temperature
Fig.33 TP– Supply voltage
Ta = 25°C
10.0
0.0
1.4
VDD=1.8V
80
Bop S
4.0
-8.0
PERIOD [ms]
Ta = 25°C
PERIOD [ms]
Bop S
4.0
100
8.0
VDD=1.8V
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
Fig.35 IDD – Supply voltage
BU52053NVX (VDD=1.65～3.6V type)
8.0
Bop S
4.0
2.0
Brp S
0.0
Brp N
-2.0
Bop N
-4.0
-6.0
-8.0
90
6.0
4.0
70
2.0
Brp S
0.0
Brp N
-2.0
Bop N
0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
AVERAGE SUPPLY CURRENT [µA]
70
60
50
40
30
20
10
0
12.0
16.0
VDD=1.8V
10.0
8.0
6.0
4.0
2.0
0.0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
Fig.38 TP – Ambient temperature
14.0
80
1.4
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
3.8
Fig.37 Bop,Brp– Supply voltage
Ta = 25°C
90
3.8
Fig.39 TP– Supply voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
40
10
AVERAGE SUPPLY CURRENT [µA]
100
50
20
-6.0
1.4
Fig.36 Bop,Brp– Ambient temperature
60
30
-4.0
100
VDD=1.8V
80
Bop S
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
PERIOD [ms]
100
Ta = 25°C
PERIOD [ms]
VDD=1.8V
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
Ta = 25°C
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
100
Fig.40 IDD– Ambient temperature
16/31
1.4
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
3.8
Fig.41 IDD – Supply voltage
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52056NVX(VDD=1.65～3.6V type)
8.0
6.0
4.0
Brp S
2.0
0.0
-2.0
Brp N
-4.0
Bop N
-6.0
90
6.0
Bop S
70
Brp S
2.0
0.0
-2.0
Brp N
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
Fig.42
Bop,Brp– Ambient temperature
0
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
3.8
70
60
50
40
30
20
10
14.0
VDD=1.8V
AVERAGE SUPPLY CURRENT [µA]
AVERAGE SUPPLY CURRENT [µA]
80
12.0
10.0
8.0
6.0
4.0
2.0
Ta = 25°C
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0
1.4
1.8
2.2
2.6
3.0
3.4
SUPPLY VOLTAGE [V]
0.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
3.8
Fig.45 TP– Supply voltage
100
Fig.44 TP – Ambient temperature
14.0
Ta = 25°C
90
40
10
Fig.43 Bop,Brp– Supply voltage
100
50
20
Bop N
1.4
100
60
30
-4.0
-6.0
VDD=1.8V
80
4.0
-8.0
-8.0
PERIOD [ms]
100
Ta = 25°C
Bop S
PERIOD [ms]
VDD=1.8V
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
100
1.4
Fig.46 IDD– Ambient temperature
1.8
Fig.47
2.2
2.6
3.0
SUPPLY VOLTAGE [V]
3.4
IDD– Supply voltage
BU52021HFV, BU52025G (VDD=2.4～3.6V type)
8.0
VDD=3.0V
Bop S
4.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
Fig.48
0.0
Brp N
-2.0
80
70
Brp S
2.0
-6.0
0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
4.0
Fig.49 Bop,Brp– Supply voltage
70
60
50
40
30
20
10
12.0
14.0
VDD=3.0V
10.0
8.0
6.0
4.0
2.0
0.0
0
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
4.0
Fig.51 TP – Supply voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
100
Fig.50 TP – Ambient temperature
AVERAGE SUPPLY CURRENT [µA]
AVERAGE SUPPLY CURRENT [µA]
Ta = 25°C
80
40
10
14.0
90
50
20
Bop N
2.0
Bop,Brp–Ambient temperature
60
30
-4.0
100
100
PERIOD [ms]
Bop S
4.0
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
VDD=3.0V
90
6.0
PERIOD [ms]
6.0
100
Ta = 25°C
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
Ta = 25°C
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
100
Fig.52 IDD – Ambient temperature
17/31
2.0
2.4
2.8
3.2
3.6
SUPPLY VOLATAGE [V]
4.0
Fig.53 IDD – Supply voltage
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BD7411G (VDD=4.5～5.5V type)
8.0
6.0
Bop S
4.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
6.0
Ta = 25°C
6.0
VDD=5.0V
5.0
SUPPLY CURRENT [mA]
VDD=5.0V
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
Bop S
4.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-8.0
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE [℃]
Fig.54
100
Bop,Brp–Ambient temperature
4.0
3.0
2.0
1.0
0.0
4.0
Fig.55
4.5
5.0
5.5
SUPPLY VOLTAGE [V]
6.0
Bop,Brp– Supply voltage
-60 -40 -20 0
20 40 60 80
AMBIENT TEMPERATURE ［℃］
100
Fig.56 IDD – Ambient temperature
6.0
SUPPLY CURRENT [mA]
5.0
Ta = 25°C
4.0
3.0
2.0
1.0
0.0
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE [V]
6.0
Fig.57 IDD – Supply voltage
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
18/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Block Diagram
BU52054GWZ, BU52055GWZ
VDD
0.1µF
B1
Adjust the bypass capacitor
value as necessary, according
to voltage noise conditions, etc.
TIMING LOGIC
×
LATCH
ELEMENT
SAMPLE
& HOLD
DYNAMIC
OFFSET
CANCELLATION
HALL
B2
A1,A2
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
OUT
GND
Fig.58
PIN No.
PIN NAME
FUNCTION
A1
GND
GROUND
A2
GND
GROUND
B1
VDD
POWER SUPPLY
B2
OUT
OUTPUT
A1
COMMENT
A2
B1
B2
Surface
A2
A1
B1
B2
Reverse
BU52015GUL
VDD
0.1µF
B2
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
A1
OUT1
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
GND
LATCH
SAMPLE
& HOLD
×
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
HALL
ELEMENT
VDD
A2
OUT2
B1
GND
Fig.59
PIN No.
PIN NAME
FUNCTION
A1
OUT1
Output pin (Active Low)
A2
OUT2
Output pin (Active High)
B1
GND
GROUND
B2
VDD
Power Supply Voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
COMMENT
A1
B1
A2
B2
Surface
19/31
A2
A1
B2
B1
Reverse
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52001GUL
VDD
0.1µF
A1
Adjust the bypass capacitor value as
necessary, according to voltage noise conditions, etc.
LATCH
×
SAMPLE
& HOLD
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
OUT
B1
The CMOS output terminals enable direct connection
to the PC, with no external pull-up resistor required.
A2
GND
Fig.60
PIN No.
PIN NAME
FUNCTION
A1
VDD
POWER SUPPLY
A2
GND
GROUND
B1
OUT
OUTPUT
B2
N.C.
A1
COMMENT
OPEN or Short to GND.
A2
A2
B1
B2
A1
B2
B1
Reverse
Surface
BU52061NVX, BU52053NVX, BU52056NVX
VDD
0.1µF
4
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
LATCH
SAMPLE
& HOLD
×
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
HALL
ELEMENT
1
OUT
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
2
GND
Fig.61
4
PIN No.
PIN NAME
FUNCTION
1
OUT
OUTPUT
2
GND
GROUND
3
N.C.
4
VDD
OPEN or Short to GND.
POWER SUPPLY
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
3
3
4
2
1
COMMENT
1
2
Surface
20/31
Reverse
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BU52011HFV, BU52021HFV
VDD
0.1µF
4
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
LATCH
SAMPLE
& HOLD
×
The CMOS output terminals enable direct connection
to the PC, with no external pull-up resistor required.
DYNAMIC
OFFSET
CANCELLATION
HALL
ELEMENT
OUT
5
2
GND
Fig.62
PIN No.
PIN NAME
FUNCTION
1
N.C.
2
GND
3
N.C.
4
VDD
POWER SUPPLY
5
OUT
OUTPUT
COMMENT
5
4
4
5
1
2
3
Surface
3
1
2
Reverse
OPEN or Short to GND.
GROUND
OPEN or Short to GND.
BU52025G
VDD
0.1µF
4
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
LATCH
SAMPLE
& HOLD
×
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
HALL
ELEMENT
5
2
OUT
GND
Fig.63
PIN No.
PIN NAME
FUNCTION
1
N.C.
2
GND
3
N.C.
4
VDD
POWER SUPPLY
5
OUT
OUTPUT
5
4
4
5
1
2
3
Surface
3
2
1
Reverse
COMMENT
OPEN or Short to GND.
GROUND
OPEN or Short to GND.
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© 2011 ROHM Co., Ltd. All rights reserved.
21/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
BD7411G
VDD
5
0.1µF
Adjust the bypass capacitor
value as necessary, according
to voltage noise conditions, etc.
TIMING LOGIC
connection to the PC, with no external pull-up
LATCH
×
The CMOS output terminals enable direct
SAMPLE
& HOLD
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
REG
resistor required.
4
2
OUT
GND
Fig.64
PIN No.
PIN NAME
1
N.C.
2
GND
3
N.C.
FUNCTION
COMMENT
5
4
4
5
1
2
3
Surface
3
2
1
Reverse
OPEN or Short to GND.
GROUND
OPEN or Short to GND.
4
OUT
OUTPUT
5
VDD
POWER SUPPLY
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© 2011 ROHM Co., Ltd. All rights reserved.
22/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Description of Operations
(Micropower Operation)
IDD
The bipolar detection Hall IC adopts an intermittent operation method
to save energy. At startup, the Hall elements, amp, comparator and
other detection circuits power ON and magnetic detection begins.
During standby, the detection circuits power OFF, thereby reducing
current consumption. The detection results are held while standby is
active, and then output.
Period
Startup time
Standby time
Reference period: 50ms (MAX100ms)
Reference startup time: 48µs
t
Fig.65
(Offset Cancelation)
VDD
I
B×
+
Hall Voltage
－
※BD7411G don’t adopts an intermittent operation method.
The Hall elements form an equivalent Wheatstone (resistor) bridge
circuit. Offset voltage may be generated by a differential in this bridge
resistance, or can arise from changes in resistance due to package or
bonding stress. A dynamic offset cancellation circuit is employed to
cancel this offset voltage.
When Hall elements are connected as shown in Fig. 66 and a
magnetic field is applied perpendicular to the Hall elements, voltage is
generated at the mid-point terminal of the bridge. This is known as Hall
voltage.
Dynamic cancellation switches the wiring (shown in the figure) to
redirect the current flow to a 90˚ angle from its original path, and
thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold circuit
during the offset cancellation process and then released.
GND
Fig.66
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© 2011 ROHM Co., Ltd. All rights reserved.
23/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Magnetic
Flux
Magnetic
Flux
Fig.67
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
N
S
N
S
S
N
OUT [V]
Magnetic
Flux
High
Magnetic
Flux
High
High
Low
Low
Bop N
Brp N
N-Pole
0
Magnetic flux density [mT]
B
Brp S
Bop S
S-Pole
Fig.68
The bipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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© 2011 ROHM Co., Ltd. All rights reserved.
24/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
Standby time
Startup time
Supply current
(Intermittentaction)
Indefinite
interval
OUT
High
(No magnetic
field present)
Indefinite
interval
OUT
(Magnetic
field present)
Low
Fig.69
The bipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig. 69. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
※BD7411G don’t adopts an intermittent operation method.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 70 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 71 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and
10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
Magnetic flux density [mT]
9
t=3mm
8
t=1mm
7
t=2mm
6
5
4
3
2
7.6mm
1
9.2mm 10.4mm
0
0
2
4
6
8
10
12
14
Magnet Hall IC distance L [mm]
16
18
20
Fig.70
X
Magnet
t
Y
X=Y=4mm
t=1mm,2mm,3mm
Magnet size
t
Magnet material: NMX-44CH
Maker: Hitachi Metals.,LTD
L: Variable
…Flux density measuring point
Fig.71 Magnet Dimensions and Flux Density Measuring Point
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© 2011 ROHM Co., Ltd. All rights reserved.
25/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Position of the Hall Effect IC(Reference)
UCSP35L1
SSON004X1216
0.6
VCSP50L1
0.40
HVSOF5
SSOP5
0.6
0.8
0.55
0.2
0.35
0.25
0.8
0.8
0.55
0.40
1.45
0.6
0.2
(UNIT:mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
UCSP35L1
VCSP50L1
SSON004X1216
SD
b3
e
SE
e
Symbol
Reference
Value
e
0.40
b3
Φ0.20
SD
0.20
SE
0.20
HVSOF5
Please avoid having potential overstress
from PCB material, strength, mounting
positions.
If you had any further questions or
concerns, please contact your Rohm
sales and affiliate.
SSOP5
(UNIT:mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
26/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Terminal Equivalent Circuit Diagram
OUT , OUT1, OUT2
VDD
Because they are configured for CMOS (inverter) output, the
output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the
current that would otherwise flow to the external resistor during
magnetic field detection, and supports overall low current
(micropower) operation.
GND
Fig.72
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© 2011 ROHM Co., Ltd. All rights reserved.
27/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Notes for use
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
Magnet
Slide
Hall IC
L
Magnetic Flux
A
S
N
Fig.73
B
Magnetic Flux
Magnetic fux density[mT]
6) Slide-by position sensing
Fig.73 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet
and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen
in Fig.74, the magnetic field runs in opposite directions at Point A and Point B. Since the bipolar detection Hall IC can
detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the
process of position detection. Fig. 75 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic
field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This
demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and
prevents malfunctions.
10
8
6
4
2
0
-2
-4
-6
-8
-10
Reverse
Magnetic
Field
0
1
2
3
4
5
6
7
8
9
Fig.74
Fig.75
7) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
10) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
11) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
10
Horizontal distance from the magnet [mm]
28/31
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
●Ordering part number
B
U
5
Part No.
BU, BD
2
0
0
1
G
Part No.
52054, 52055, 52015
52001, 52061, 52053
52056, 52011, 52021
52025, 7411
U
L
-
Package
GWZ : UCSP35L1
GUL : VSCP50L1
NVX : SSON004X1216
HFV : HVSOF5
G
: SSOP5
E
2
Packaging and forming specification
E2: Embossed tape and reel
(UCSP35L1, VSCP50L1)
TR: Embossed tape and reel
(SSON004X1216,HVSOF5, SSOP5)
UCSP35L1(BU52054GWZ)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.4MAX
0.80±0.05
0.1±0.05
0.80±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4- φ 0.20±0.05
0.05 A B
0.06
0.2±0.05
S
S
A
B
0.4
B
A
1
0.2±0.05
2
0.4
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
UCSP35L1(BU52055GWZ)
0.80±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
E2
Direction
of feed
0.4MAX
1PIN MARK
0.1±0.05
0.80±0.05
<Tape and Reel information>
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.06
A
B
B
S
0.4
4- φ 0.20±0.05
0.05 A B
0.2±0.05
S
A
1
0.2±0.05
2
0.4
1pin
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
Reel
29/31
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
VCSP50L1(BU52015GUL)
<Tape and Reel information>
1.10±0.1
0.55MAX
1.10±0.1
0.10±0.05
1PIN MARK
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.30±0.1
0.08 S
4-φ0.25±0.05
0.05 A B
A
B
A
0.30±0.1
1
2
0.50
0.50
B
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VCSP50L1(BU52001GUL)
<Tape and Reel information>
0.55MAX
1.10±0.1
1.10±0.1
0.10±0.05
1PIN MARK
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.30±0.1
0.08 S
4-φ0.25±0.05
0.05 A B
A
B
A
0.30±0.1
1
2
0.50
0.50
B
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SSON004X1216
<Tape and Reel information>
1.6 ± 0.1
1.2±0.1
Embossed carrier tape
Quantity
5000pcs
Direction
of feed
0.6MAX
1PIN MARK
1
2
4
3
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.8 ± 0.1
(0.12)
0.65±0.1
+0.03
0.02 -0.02
S
0.2 ± 0.1
0.08 S
+0.05
0.2 -0.04
Tape
1pin
0.75±0.1
Reel
(Unit : mm)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
30/31
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.12 - Rev.G
BU52001GUL,BU52011HFV,BU52021HFV,BU52015GUL,BU52025G,BU52053NVX,
BU52054GWZ,BU52055GWZ,BU52056NVX,BU52061NVX,BD7411G
Technical Note
HVSOF5
4
4
(0.91)
5
0.2MAX
(0.3)
(0.05)
1.0±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
5
(0.41)
1.6±0.05
(0.8)
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 −0.02
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
<Tape and Reel information>
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
1.25Max.
)
0.05±0.05
1.1±0.05
S
+0.05
0.42 −0.04
0.95
0.1
S
Direction of feed
Reel
(Unit : mm)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
31/31
∗ Order quantity needs to be multiple of the minimum quantity.
2011.12 - Rev.G
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001