BD8374HFP-M ,BD8374EFJ-M : Power Management

Datasheet
Constant Current LED Drivers
50V 500mA
1ch Source Driver for Automotive
BD8374HFP-M
BD8374EFJ-M
General Description
Key Specifications




BD8374HFP-M and BD8374EFJ-M are 50V-withstanding
LED source drivers. Most suitably for Automotive
LED driving, it can control light through PWM of constant
current output.
Having LED open/short detective circuit and overvoltage
mute functions integrated, it can deliver high reliability.
Also by utilizing our patented PBUS function, it is possible
to turn OFF all LEDs in case where a row of LEDs are
short/open-circuited if multiple rows of LEDs are driven
through multiple number of the ICs.
Input Voltage Range: 4.5V to 42V
Max Output Current: 500mA (Max)
Output Current Accuracy: ±5% (Max)
Operating Temperature Range: -40°C to +125°C
Packages
HRP7
HTSOP-J8
W(Typ) x D(Typ) x H(Max)
9.395mm x 10.540mm x 2.005mm
4.90mm x 6.00mm x 1.00mm
Features






AEC-Q100 Qualified
Variable form Constant-Current Source Driver
PWM Dimming Function
CR Timer for PWM Dimming Function Integrated
LED Open/Short detective Circuit Function Integrated
Overvoltage Mute and Temperature Protection
Functions Integrated
 Abnormal Output Detection and Output Functions
(PBUS)
HRP7
HTSOP-J8
Application
 On-board Exterior Lamp
(Rear Lamp, Turn Lamp, DRL/Position Lamp,
Fog Lamp, etc.)
 On-board Interior Lamp
(Air Conditioner Lamp, Interior Lamp,
Cluster Light, etc.)
Basic Application Circuit
Figure 1. Typical Application Circuit
○Product configuration: Silicon monolithic integrated circuit
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○ The product is not designed for radiation resistance.
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BD8374HFP-M
Datasheet
BD8374EFJ-M
Pin Configurations
(TOP VIEW)
FIN(GND)
(TOP VIEW)
VIN_F
1
8
IOUT
VIN
2
7
CRT
N.C.
3
6
DISC
GND
4
5
PBUS
1
2
3
4
5
6
7
PBUS
DISC
CRT
GND
IOUT
VIN_F
VIN
FIN(GND)
Figure 2. HRP7 Package Pin Configuration
Figure 3. HTSOP-J8 Package Pin Configuration
Pin Descriptions
HRP7 Package
HTSOP-J8 Package
Pin No.
Pin Name
Error detection I/O
1
VIN_F
DISC
Discharge setting
2
VIN
Power supply input
3
CRT
PWM dimming
timer setting
3
N.C.
N.C.
4
GND
GND
4
GND
GND
5
IOUT
Current output
5
PBUS
Error detection I/O
6
VIN_F
Output current detection
6
DISC
Discharge setting
7
VIN
7
CRT
PWM dimming
timer setting
8
IOUT
Current output
Pin No.
Pin Name
1
PBUS
2
Function
Power supply input
Function
Output current detection
Block Diagram
IOUT
VIN_F
VIN
VREF
VREF
VIN-0.180V
(Typ)
ON/OFF
CRT
OSC
LED OPEN
DET
DISC
PBUS
VIN0.05V
(Typ)
LED GND SHORT
DET
0.6V
(Typ)
GND
PBUS
Figure 4. Block Diagram
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Datasheet
BD8374EFJ-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VIN
-0.3 ~ +50
V
VVIN_F,VCRT,VDISC,VIOUT,VPBUS
-0.3 ~ VIN+0.3
V
Supply Voltage
VIN_F,CRT,DISC,IOUT,PBUS
Terminal Voltage
Power Dissipation
HRP7
2.3(Note1)
HTSOP-J8
1.1(Note2)
Pd
W
Operating Temperature Range
Topr
-40~125
°C
Storage Temperature Range
Tstg
-55~150
°C
Tjmax
150
°C
IOUT
500
mA
Junction Temperature
IOUT Output Maximum Current
(Note1)
(Note2)
HRP7
Derate by 18.4mW/°C when operating above Ta=25°C
(when mounted in ROHM’s standard board(70mm×70mm×1.6mm) 2 layer copper foil(15mm×15mm)).
HTSOP-J8
Derate by 8.8mW/°C when operating above Ta=25°C
(when mounted in ROHM’s standard board(70mm×70mm×1.6mm) 2 layer copper foil(15mm×15mm)).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Unit
Supply Voltage(Note1)
VIN
4.5~42.0
V
Operating Temperature Range
Topr
-40~125
°C
RVIN_F
0.36~3.6
Ω
C IOUT_MIN
0.1
μF
CRTIMER Frequency Rage
F PWM
100~5000
Hz
PWM Minimum Pulse Width
T MIN
20
µs
Current Setting Resistor
Minimum capacitor
connecting IOUT terminal
(Note1)
Pd, ASO should not be exceeded
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Datasheet
BD8374EFJ-M
Electrical Characteristics(Unless otherwise specified Ta=-40~125°C, VIN= 13V, RVIN_F=0.47Ω, RPBUS=10kΩ)
Parameter
Symbol
Min
Typ
Max
UNIT
Condition
Circuit Current
IVIN
-
2.1
6.0
mA
IOUT Terminal
Output Current Accuracy
373
383
393
mA
Ta=25°C
IOUT
364
383
402
mA
Ta=-40°C~125°C
VIN – IOUT Drop Voltage
VDR_IOUT
-
0.45
1.0
V
IOUT Terminal OFF Current
IIOUT_OFF
-
-
1
μA
V IOUT =2V, V CRT =0.7V
Ta=25°C
IOUT Current at GND Short
IIOUT_SHORT
-
-
40
μA
V IOUT =0V
VIN_F_REF
0.171
0.180
0.189
V
V IN
-0.15
V IN
-0.300
V IN
-0.050
V IN
-0.150
V IN
-0.020
V IN
-0.060
0.2
0.6
1.0
V
VIN_F Terminal Voltage
IOUT Voltage
at LED Open Detection
IOUT Voltage
at LED Open Detection Release
IOUT Voltage
at LED Short Detection
VIOUT_OPEN
VIOUT_OPEN
_RELEASE
V IOUT_
SHORT
I OUT =383mA
V IN_F_REF =V IN -V IN_F
V
V
CRT Terminal Charge Current
I CRT_SO
29.75
35.00
40.25
μA
CRT Terminal Charge Voltage
V CRT_CHA
0.990
1.10
1.21
V
V CRT_DIS1
2.7
3.0
3.3
V
V CRT_DIS2
3.6
4.0
4.4
V
R CHA
51.6
54.3
57.0
kΩ
R CHA =(V CRT_DIS1 -
V CRT_CHA ) / I CRT_SO
R D1
-
50.0
100
Ω
V CRT =3.4V
R D2
2.5
5.0
10
kΩ
V CRT =5V
V IH_PBUS
4.0
-
V IN
+0.20
V
V IL_PBUS
GND
-0.20
-
2.0
V
V OL_PBUS
-
-
1.5
V
I PBUS =2mA
I IN_PBUS
-
38.0
100
μA
V PBUS =13V
V IN_
OVPMUTE
27
29
33
V
CRT Terminal
Discharge Voltage 1
CRT Terminal
Discharge Voltage 2
CRT Terminal
Charge Resistance
DISC Terminal
Discharge Resistance 1
DISC Terminal
Discharge Resistance 2
PBUS Terminal
Input Voltage High
PBUS Terminal
Input Voltage Low
PBUS Terminal
Low Voltage
PBUS Terminal
Input Current
Overvoltage Mute
V CRT =0.9V
R D1<-> R D2 (Note1)
V IOUT =6V
(Note) This product is not designed for use in radioactive environments.
(Note1) Refer to Functional Description
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Datasheet
BD8374EFJ-M
Typical Performance Curves (Reference Data)
(Unless otherwise specified Ta=25°C, VIN=VIN_F=13V)
500
450
400
IOUT[mA]
350
300
250
200
150
100
ΔIOUT=(IOUT/(0.18V/RVIN_F)-1)×100[%]
50
0
0.0
0.5
1.0
1.5 2.0 2.5
RVIN_F[Ω]
3.0
3.5
4.0
Figure 6. RVIN_F vs ΔIOUT
0.190
0.20
0.188
0.18
0.186
0.16
0.184
0.14
0.182
VIN_F_REF[V]
VIN_F_REF[V]
Figure 5. RVIN_F vs IOUT
0.180
0.178
0.176
0.12
0.10
0.08
0.06
0.174
0.04
0.172
0.02
0.170
-50
-25
0
25 50 75
Temp[°C]
0.00
100 125 150
0
20
30
40
50
VIN[V]
Figure 7. Temperature vs VIN_F_REF
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Figure 8. VIN vs VIN_F_REF
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Datasheet
BD8374EFJ-M
40
7.00
39
ICRT_SO[µA]
37
36
35
34
33
6.85
6.80
6.75
6.70
6.65
32
6.60
31
6.55
30
6.50
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
VCRT[V]
Figure 9. VCRT vs ICRT_SO
(VCRT:CRT Terminal Voltage)
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TSZ22111・15・001
CCRT=0.033μF, RCRT=3.9kΩ
(On-Duty 6.7% setting)
6.90
Ta=-40°C
Ta=25°C
Ta=125℃
PWM ON-Duty[%]
38
6.95
-50
-25
0
25
50
75
Temp[°C]
100 125 150
Figure 10. Temperature vs PWM ON Duty
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Datasheet
BD8374EFJ-M
Functional Description
(Unless otherwise specified, Ta=25°C, VIN=13V, IOUT=6V and RVIN_F=0.47Ω. Numbers are "Typical" values.)
1.
Output Current Setting
LED Current IOUT can be set as below depending on values of current setting resistance RVIN_F.
IOUT 
(VIN VIN_F) VIN_F_REF

[A]
RVIN_F
RVIN_F
where:
VIN_F_REF is 0.18V (Typ)
Figure 11. Output Current Setting
2.
Table of Operations
PWM dimming mode switches to linear control depending on CRT terminal voltage.
When CRT terminal voltage surpasses VCRT_DIS2 (4.0V(Typ)), Dimming mode turns to Linear Control,
and discharge resistance of DISC terminal changes from RD1(50Ω(Typ)) to RD2(5kΩ(Typ)).
LED open/short-circuit protection is activated depending on IOUT terminal voltage status, and output current is turned OFF.
Output current is also turned OFF when Low signal is input to PBUS terminal.
Operation Mode
CRT Terminal
IOUT Terminal
Voltage
(VIOUT)
Output Current
(IOUT)
PBUS Terminal
Linear Control
4.0V(Typ)≤VCRT
-
50mA~500mA
Hi-Z
PWM dimming
OPEN
-
See Features
Description, 3. PWM
Light Control Operation
Hi-Z
LED Open
-
VIOUT ≥
VIN - 0.050V(Typ)
1μA(Max)
Low Output
LED Short
-
VIOUT ≤ 0.6V(Typ)
40μA(Max)
Low Output
PBUS Control OFF
-
-
1μA(Max)
Low Input
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3.
Datasheet
BD8374EFJ-M
PWM Dimming Operation
PWM Dimming is performed if CRT terminal is the following circuit.
Dimming cycle and Duty width can be set through external resistance value and capacity.
CR timer function in IC is activated if CRT terminal turned OPEN. In order to perform PWM light control of LED current,
triangular waveform is generated at CRT terminal. Output is controlled so that LED current is turned OFF while CRT
voltage is ramping up, and LED current is turned ON while CRT voltage is ramping down.
Ramp up/down time of CRT voltage can be set by values of external components (CCRT, RCRT).
+B
VIN_F
IOUT
IOUT
VIN
VREF
ICRT=35µA(Typ)
ON/OFF
VIN-0.180V
(Typ)
OSC
CRT
CCRT
RCRT
DISC
GND
50Ω(Typ)
CRT Voltage Ramp-up
CRT Voltage Ramp-down
CRT Terminal
Waveform
IOUT Waveform
Figure 12. PWM Fimming Operation
(1)
CRT Ramp up Time T1
CRT ramp up time can be obtained from the following equations:
T1 
ΔVCRT  CCRT
 RCHA  CCRT [s]
ICRT_SO
where:
ICRT_SO is the CRT Terminal Charge Current 35μA (Typ)
RCHA is the CRT Terminal Charge Resistance 54.3kΩ(Typ)
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(2)
Datasheet
BD8374EFJ-M
CRT Ramp down Time T2
CRT ramp down time is defined by discharge period due to external capacity CCRT and resistance (RCRT + RD1).
(CRT Terminal Charge Current is OFF at CRT ramp down)
Make sure that T2 is set at not smaller than Min. pulse width 20μs(Min).
 VCRT_CHA 
T2  CCRT  ( RCRT  RD1)  ln 
 [s]
 VCRT_DIS1 
where:
RD1 is the CRT Terminal Discharge Resistance 1
50Ω (Typ)
VCRT_CHA is the CRT Terminal Discharge ON Voltage 1.1V (Typ)
VCRT_DIS1 is the CRT Terminal Discharge ON Voltage 3.0V (Typ)
(3)
Dimming Frequency fPWM
PWM frequency is defined by T1 and T2.
f PWM 
(4)
1
T1 T 2
[Hz]
ON Duty (DON)
Like the above, PWM ON duty is defined by T1 and T2.
DON 
T2
T 1 T 2
(Ex) In case of fPWM = 518Hz and 6.7% Duty (Typ),
From fPWM=518Hz; T1 + T2 = 1 / fPWM = 1 / 518Hz = 1931μs
From ON Duty = 6.7%; CRT ramp up time T1 is T1 = (T1 + T2) × 0.933 = 1801.6μs
External capacity CCRT is;
CCRT = T1 × (ICRT / ΔVCRT) = 1800.7μs × 35μA / 1.9V ≒ 0.033μF
CRT ramp down time T2 is; T2 = (T1 + T2) × 0.067 = 129μs
External resistance RCRT is;
RCRT = -T2 / (CCRT × ln(VCRT_CHA / VCRT_DIS)) - RD1 = -129usec / (0.033μF × ln(1.1 / 3.0) – 50Ω) ≒ 3.9kΩ
In case where PWM signal is applied from external;
It is possible to directly input PWM signal from external microcomputer for Dimming.
Input PWM signal to CRT terminal. In that case, ’High’ level voltage of PWM signal should be equal to or higher than
VCRT_DIS2( 4.4V(Max)) and ’Low’ level voltage of PWM signal should be equal to or less than VCRT_CHA(0.99V(Min)).
Figure 13. External Input of PWM Signal
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4.
Datasheet
BD8374EFJ-M
LED Setting Range
Number of LED connections N should meet the following conditions:
Vf_led × N ≤ +B – Vf_diode –VIN_F_REF –VDR_IOUT
where:
+B is the Battery Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
VIN_F_REF is the VIN_F Terminal Voltage (VIN – VIN_F)
VDR_IOUT is the IOUT Terminal Drop Voltage
Vf_led is the LED Vf
N is the Number of LED Levels
Ex) If you want to supply constant current to LED at 9V or higher Battery Voltage (+B) (Supposing that Vf_diode is 0.5V),
Vf_led × N ≤ +B – Vf_diode - VIN_F_REF - VDR_IOUT = 9V –0.5V –0.189V(Max) – 1.0V(Max) = 7.311V
(Sum of Vf of LED connected to IOUT terminal is set to be 7.311V Max.)
Vf_diode
VIN_F_REF
IOUT
Vf_led × N
Figure 14. LED Setting Range Schematic
5.
Overvoltage Mute
If 29V (Typ) ≤ VIN, Overvoltage Mute is activated to restrict output current in order to suppress heat generated from IC.
IOUT attenuates by 3.2%/V(Typ).
Figure 15. Overvoltage Mute Performance
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6.
Datasheet
BD8374EFJ-M
Protective Function
In this IC integrated is a function for protection from short/open-circuit of external component, and it is possible to detect
abnormal condition at PBUS terminal.
(1) LED Open Detective Function
In case where LED connected to IOUT terminal is open-circuited, it is detected due to overvoltage of IOUT terminal.
During the detection, PBUS terminal is switched to Low to notify the trouble.
Figure 16. LED Open Detection
(2) LED Short-circuit Detective Function
In case where LED connected to IOUT terminal is short-circuited, it is detected due to low voltage of IOUT terminal.
During the detection, output current is turned OFF to prevent thermal destruction of IC, and PBUS terminal is
switched to Low to notify the trouble.
OFF
VIN_F
IOUT
VIN
Current
Control
VREF
PBUS
PBUS
OFF Signal
SHORT
+
0.6V
(Typ)
GND
Figure 17. LED Short-circuit Detection
(3) IOUT Current at GND Short (IIOUT_SHORT)
When VIOUT is less than 1.4V(Typ), IOUT Current at GND Short(IIOUT_SHORT) flows from IOUT terminal.
It is varied due to IOUT terminal Voltage.
Figure 18.
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About IOUT Current at GND Short
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Datasheet
BD8374EFJ-M
(4) About Active zone of LED Open Detective & LED Short Detective Function and IOUT Terminal Hi-Z zone
Active zone of LED Open Detective & LED Short Circuit Detective Function is different from Linear Control Mode
and PWM dimming Mode.(Refer to Figure19.)
Linear Control Mode :Each function is active at All zone.
PWM dimming Mode :LED Open Detective Fucntion is active only Fall time of VCRT.
LED Short Circuit Detective Function is active at All zone.
There is IOUT Terminal Hi-Z zone at PWM dimming Mode.
(Note1)
,
To prevent Malfunction of LED Short Detective Function by noise
(Note2)
)
It is necessary to connect Capacitor(more than 0.1uF
between IOUT terminal and GND terminal nearby terminal
(ROHM Recommended Value : CIOUT=0.1μF GCM188R11H104KA42 murata)
(Note1) Conducted noise, Radiated noise, Interference of connecter and PCB pattern etc…
(Note2) If connect more than 0.1uF, please evaluate the time of VIN on to IIOUT on.
Linear Control Mode
PWM dimming Mode
VIN
VIN
0V
0V
VCRT
VCRT
0V
VIOUT
VIOUT
0V
0V
IIOUT
IIOUT
0mA
0mA
IOUT Terminal
Hi-Z zone
None
IOUT Terminal
Hi-Z zone
LED Open
Detective
Functom
Active
LED Open
Detective
Functom
LED Short
Circuit Detective
Function
Active
LED Short
Circuit Detective
Function
Hi-Z
Hi-Z
Active
Hi-Z
Active
Active
Active
Figure 19. About Active zone of LED Open Detective & LED Short Detective Function
and IOUT Terminal Hi-Z zone
Figure 20. About the capacitor of connecting IOUT terminal
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Datasheet
BD8374EFJ-M
Evaluation example(The time of VIN on to IIOUT on)
Condition:+B=13V
Ta=25°C
LED 3Strings
VCRT=VIN
DC Mode
The time of VIN on to IIOUT on
VIN
(5.0V/div)
CIOUT= CIOUT= CIOUT=
0.1μF 0.47μF 1.0μF
CIOUT=
2.2μF
CIOUT=0.1μF
: 11ms
CIOUT=0.47μF : 51ms
CIOUT=1.0μF
: 130ms
CIOUT=2.2μF
: 290ms
IIOUT
(20mA/div)
Evaluation example(IIOUT pulse width at PWM Dimming operation)
Condition:+B=13V
Ta=25°C
LED 3Strings
RCRT=560Ω
CCRT=0.033μF
PWM Dimming Mode
CIOUT=0.1μF
RVIN_F=3.6Ω
(IIOUT=50mA)
RVIN_F=0.91Ω
(IIOUT=198mA)
CIOUT=0.47μF
VCRT
(1.0V/div)
VCRT
(1.0V/div)
VIOUT
(2.0V/div)
VIOUT
(2.0V/div)
IIOUT
(20mA/div)
IIOUT
(20mA/div)
VCRT
(1.0V/div)
VCRT
(1.0V/div)
VIOUT
(2.0V/div)
VIOUT
(2.0V/div)
IIOUT
(20mA/div)
IIOUT
(20mA/div)
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7.
Datasheet
BD8374EFJ-M
PBUS Function
PBUS terminal is an input/output terminal for outputting trouble and inputting trouble detection.
In case where a trouble occurred due to open/short-circuit of external component, it is possible to notify the trouble outside
(Note1)
to Low.
by switching PBUS terminal output from High
It is possible to turn OFF output current by externally controlling PBUS from High→Low.
(Note1) PBUS terminal is an open drain terminal. Even when used separately, please be pulled up(10kΩ) to power supply voltage.
In case where you use multiple number of this LSI to drive multiple LEDs, as shown in the drawing below, it is possible to
turn off all rows of LEDs even if some LEDs are short/open-circuited by connecting PBUS terminal of each CH.
VIN
VIN
VIN_F
CRT
IOUT
LED
OPEN
CH1
PBUS
+B
VIN
VIN_F
CRT
VIN_F
IOUT
CH2
PBUS
PBUS
Hi-Z ⇒Low
LED
OFF
CRT
IOUT
CH3
LED
OFF
PBUS
OPEN
Trouble
Occurs
PROTECT BUS
Possible to turn OFF all LEDs
Connect PBUS of each CH
Figure 21. PBUS Function
▼Example of Protective Operation by LED Open
LED Open
Connect PBUS of each CH
Output voltage is brought up
when LED Open occurs.
 LED current turns OFF.
 PBUS output become Low.
Clamp to 1.4V
during OFF
 Turns OFF LED current of
other CH.
Clamp to 1.4V
during OFF
Figure 22. Example of Protective Operation
If LED OPEN occurs, PBUS of CH1 is switched from Hi-z to Low output. As PBUS becomes Low, LED drivers of
other CH detect the trouble and turns OFF their own LEDs. VIOUT clamps to 1.4V (Typ) during the OFF period, in
order to prohibit ground fault detection.
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8.
Datasheet
BD8374EFJ-M
Caution of driving IC used multi-power supply
Each Input terminal is built- in ESD protection diodes. (Refer to I/O equivalence circuits)
If VIN terminal is not supplied voltage and Input terminal (without VIN) is supplied voltage,
IC may occur malfunction(abnormal operation mode, abnormal LED lighting )
due to arise VIN terminal voltage .
The Application Example of accidental operation is below.
H
TAIL
L
TAIL
STOP
VIN
L
VIN
VIN_F
STOP
A
B
CRT
PBUS
DISC
PBUS
GND
GND
VIN
(B)
VPBUS
(B)
VCRT
(B)
VIN
(A)
GND
H
L
H
L
H
L
H
L
⇒Due to Voltage arises VIN(A),
CRT(B) is not triangle wave output
Figure 23. Application Example
(Operational Explanation)
Only input Tail
: Arise VIN terminal voltage of IC A from ESD protection Diode between VIN terminal
and PBUS terminal of IC A.
Due to connect VIN terminal of IC A and CRT terminal of IC B across Diode,
DC voltage inputs CRT terminal of IC B, so it is possible to operate ICB DC mode.
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Timing Chart
Figure 24. Timing Chart
 If PWM_in is switched ON, VCRT will start oscillation, and according to its waveform LED current IOUT is output.
(PWM light control mode)
 If DC_in is switched ON, VCRT will be fixed at High (VIN-Vf). LED current IOUT will be continuously output.
(Linear control mode)
 If LED becomes OPEN, LED current IOUT will stop. At the same time, VPBUS falls to Low.
 If LED is short-circuited to GND, LED current IOUT will stop. At the same time, VPBUS falls to Low.
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Datasheet
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Guaranteed Range of Current Accuracy and LED Open Detection Range
Guaranteed range of current accuracy and LED open detection range can be obtained from the following equation:
PBUS output becomes Low if IOUT terminal output (VIOUT) is higher than the LED open detection range at the time of reduced
VIN terminal voltage.
Therefore, pay attention to respective setting range during power ON/OFF, and consider operating voltage range of the set.
Guaranteed Range of Current Accuracy
VIN ≥ Vf_led × N + VIN_F_REF + VDR_IOUT [V]
Where:
VIN is the VIN Terminal Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
Vf_led is the LED Vf
N is the: Number of LED Levels
VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F)
VDR_IOUT is the IOUT Terminal Drop Voltage
LED Open Detection Voltage
VIOUT = VIN - 50mV(Typ)
LED Open Detection Release Voltage
VIOUT = VIN - 150mV(Typ)
VIN >
Vf_led × N + VIN_F_REF + VDR_IOUT
VIN
Guaranteed Range of current accuracy
VIOUT <
VIN -150mV(Typ)
LED Open
Detection
Area
VIOUT
VIN
VIOUT_OPEN
VIOUT_OPEN_RELEASE
VIOUT <
VIN -50mV(Typ)
LED Open
Detection
Area
VIOUT
ILED
VPBUS
PBUS Low
Output
High(Hi-Z)
PBUS Low
Output
Low
Figure 25. Guaranteed Range of Current Accuracy and LED Open Detection Range
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Datasheet
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How to Connect LED
In case of connected LED to IOUT terminal as shown in the following, note that protective detection becomes
possible/impossible depending on connection patterns.
1st Level
2nd Level
3rd Level
2nd Row
1st Row
(1 series)
Nth Row
(2 or more parallels)
(2 parallels or more, matrix connection)
Figure 26. LED Connection Patterns
(Note1)
(Note2)
Connection Pattern
LED Short-circuit Detection
(GND short of IOUT terminal)
LED OPEN detection
1 Series
Detectable
Detectable-
2 parallels or more
Detectable
Non-detectable (Note 1)
2 parallels or more
(Matrix Connection)
Detectable
Non-detectable (Note 2)
: Detectable only when one or more LEDs become open in all rows.
: Detectable only when all LEDs on the same level become open.
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Datasheet
BD8374EFJ-M
Recommended Application Circuit
D1
RVIN_F
VIN_F
IOUT
PWM_in
CVIN
ZD1
VIN
CIOUT
D2
D3
BD8374HFP-M
BD8374EFJ-M
CRT
DC_in
+B
CCRT
RCRT
DISC
FIN
RPBUS
GND
PBUS
Figure 27. Recommended Application Circuit
▼Corresponding EMC Test Items
・ISO11425-2
・ISO11452-4
・ISO7637-2
(pulse1, pulse 2a,2b, pulse 3a,3b)
No.
1
2
3
4
5
6
7
8
9
10
Component
Name
Component
Value
Product
Name
Company
D1
RF201L2S
ROHM
RF201L2S
ROHM
RF201L2S
ROHM
ZD1
-
TNR12H-220K
NIPPON CHEMICON
CVIN
4.7µF
GCM32ER71H475KA40
murata
RVIN_F
0.91Ω
MCR10 Series
ROHM
RPBUS
10kΩ
MCR03 Series
ROHM
CCRT
0.033µF
GCM188R11H333KA40
murata
RCRT
3.9kΩ
MCR03 Series
ROHM
CIOUT
0.1µF
GCM188R11H104KA42
murata
D2
D3
Table 1. BOM List
PWM_in
DC_in
Mode
Low
Low
OFF
Low
PWM Dimming Mode
(14mA 6.7% ON [email protected])
High
Linear Control Mode (Note2)
(200mA 100% ON duty)
High
Linear Control Mode (Note2)
(200mA 100% ON duty)
(Note1,Note2)
High
Low
High
(Note1) See Functional Description "3. PWM Dimming Operation."
(Note2) See Functional Description "2. Table of Operations."
Table 2. Table of Operations
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Figure 28. Example of Waveform Measurement
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Datasheet
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Thermal Loss
VIN_F_REF
Vf_diode
IOUT
D1
RVIN_F
VIN_F
IOUT
PWM_in
CVIN
ZD1
VIN
CIOUT
D2
Vf_led × N
D3
CRT
DC_in
+B
CCRT
BD8374HFP-M
BD8374EFJ-M
RCRT
DISC
FIN
RPBUS
PBUS
GND
Figure 29. Application Circuit Diagram for Thermal Description
Thermal design should meet the following equation:
Pd > Pc = (+B – Vf_diode - VIN_F_REF – Vf_led×N)×IOUT + IVIN×VIN
Pd = (1/θja) × (Tjmax - Ta) or (1/θjc) ×(Tjmax - Tc)
where:
Pd is the Power Dissipation
Pc is the Power Consumption
+B is the Battery Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
VIN_F_REF is the VIN_F Terminal Voltage (VIN-VIN_F)
Vf_led is the LED Vf
N is the Number of LED Levels
IOUT is the Output Current
IVIN is the Circuit Current
VIN is the Power Supply Voltage
θja is the Thermal Resistance between Tj and Ta
θjc is the Thermal Resistance between Tj and Tc
Tjmax is the Max Joint Temperature (150°C)
Ta is the Ambient Temperature
Tc is the Case Surface Temperature
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Datasheet
BD8374EFJ-M
HRP7 Package
5.0
2 layer copper foil 50mm x 50mm
θja = 30℃/W
4.16W
Power dissipation Pd [W]
4.0
2 layer copper foil 15mm x 15mm
θja = 54.4℃/W
1 layer
θja = 78.1℃/W
3.0
2.3W
2.0
1.6W
1.0
0.0
0
25
50
75
100
125
150
Temp Ta [℃]
HTSOP-J8 Package
2.0
2 layer copper foil 50mm x 50mm
θja = 69℃/W
Power dissipation Pd [W]
1.81W
2 layer copper foil 15mm x 15mm
θja = 113.6℃/W
1 layer
θja = 153.2℃/W
1.1W
1.0
0.82W
0.0
0
25
50
75
100
125
150
Temp Ta [℃]
(Caution1)
(Caution2)
(Caution3)
When mounted with 70.0mm X 70.0mm X 1.6mm glass epoxy substrate.
Above copper foil area indicates backside copper foil area.
Value changes according to number of substrate layers and copper foil area. Note that this value is a measured value, not a guaranteed value.
Figure 30. Thermal Dissipation Curve
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Datasheet
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Thermal Design for Few Number of LED Lamps
If there are few LED lamps, insert resistance between IOUT terminal and LED to reduce heat generation from IC and
dissipate heat.
(This does not apply where amperage is low.)
In that case, note that guaranteed range of current accuracy will be as shown in the following equation:
+B ≥ Vf_diode + Vf_led × N + VIN_F_REF + VDR_IOUT +IOUT×R1
Vf_diode is the Reverse Connection Preventing Diode Vf
Vf_led is the LED Vf
N is the Number of LED Levels
VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F)
VDR_IOUT is the IOUT Terminal Drop Voltage
IOUT is the Output Current
R1 is the Thermal Dissipation Resistance
Thermal design should meet the following equation when inserting thermal dissipation resistance:
Pd = (1/θja) × (Tjmax - Ta) or (1/θjc) ×(Tjmax - Tc)
Pd is the Power Dissipation
Pc is the Power Consumption
+B is the Battery Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F)
Vf_led is the LED Vf
N is the Number of LED Levels
IOUT is the Output Current
R1 is the Thermal Dissipation Resistance
IVIN is the Circuit Current
VIN is the Power Supply Voltage
θja is the Thermal Resistance between Tj and Ta
θjc is the Thermal Resistance between Tj and Tc
Tjmax is the Max Joint Temperature (150°C)
Ta is the Ambient Temperature
Tc is the Case Surface Temperature
VIN_F_REF
Vf_diode
Thermal Dissipation
Resistance
Vf_led × N
Figure 31. Example of How to Connect Thermal Dissipation Resistance
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Datasheet
BD8374EFJ-M
I/O equivalence circuits (HRP7 Package)
Number
Terminal Name
1
PBUS
Equivalence Circuit
VIN
(7pin)
2
DISC
DISC
(2pin)
RD2=
5kΩ(Typ)
RD1=
50Ω(Typ)
GND
(4pin)
3
CRT
4
GND
5
IOUT
6
VIN_F
7
VIN
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Datasheet
BD8374EFJ-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
BD8374EFJ-M
Operational Notes – continued
11.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 32. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD8374HFP-M
Datasheet
BD8374EFJ-M
Ordering Information
B
D
8
3
7
4
H
F
P
-
Package
HFP:HRP7
B
D
8
3
7
4
E
F
Package
EFJ:HTSOP-J8
MTR
Packaging and forming specification
M: High Reliability Design
TR: Embossed tape and reel
(HRP7)
J
-
ME2
Packaging and forming specification
M: High Reliability Design
E2: Embossed tape and reel
(HTSOP-J8)
Marking Diagrams
HRP7 (TOP VIEW)
Part Number Marking
BD8374HFP
LOT Number
1PIN MARK
HTSOP-J8(TOP VIEW)
Part Number Marking
D
8
3
7
4
LOT Number
1PIN MARK
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BD8374HFP-M
Datasheet
BD8374EFJ-M
Physical Dimension, Tape and Reel Information(BD8374HFP-M)
Package Name
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HRP7
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BD8374HFP-M
Datasheet
BD8374EFJ-M
Physical Dimension, Tape and Reel Information(BD8374VEFV-M)
Package Name
HTSOP-J8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
∗ Order quantity needs to be multiple of the minimum quantity.
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Datasheet
BD8374EFJ-M
Revision History
Date
Revision
6.Aug.2013
14.May.2013
001
002
Changes
New Release
General Added the capacitor to all Block Diagram
Page.3 Absolute Maximum Ratings Revised
Recommended Operating Conditions
Minimum Pulse Width 100μs → 20μs
Minimum capacitor connecting IOUT terminal CIOUT_MIN added
CRTIMER Frequency Range added
Page.4 Electrical Characteristics
IOUT Open detection Release Voltage added
Page.5 Figure 7.(VIN vs VIN_F_REF) revised
Page.7 Table of Operations revised
Page.8 Figure 11. (PWM Dimming Operation) revised
Page.11 the explanation of IOUT Current at GND Short added
Page.12 the explanation about Active zone of LED Open Detective
& LED Short Detective Function and IOUT Terminal Hi-Z zone added
Page.15 Caution of driving IC used multi-power supply added
Page.17 Guaranteed Range of Current Accuracy and LED Open Detection Range
Tenor Revised
Page.18 How to Connect LED LED Tenor Revised
Page.23 I/O equivalence circuits Number1,2 Revised
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001