Datasheet

Datasheet
3.0V to 20V, 6A 1ch
Synchronous Buck Converter Integrated FET
BD95500MUV
General Description
BD95500MUV is a switching regulator with current capability of 6A and the ability to achieve low output voltages of 0.7V to
5.0V from a wide input voltage range of 3V to 20V. Built-in NMOS power transistors and implementation of Simple Light Load
Mode technology (SLLMTM) make this device highly-efficient. SLLMTM improves efficiency when the device is used is used
with light load, providing high efficiency over a wider range of loads. The device also uses H3RegTM, a ROHM proprietary
control method, to achieve ultra-fast transient response against load changes. BD95500MUV is especially designed for
various applications and is integrated with protection features such as soft-start, variable frequency, short circuit protection
with timer latch, over voltage protection, and power good function.
Features
Key Specifications







 H3RegTM DC/DC Converter Controller
 Selectable Simple Light Load Mode (SLLMTM), and
Forced Continuous Mode
 Built-in Thermal Shut Down (TSD), Under Voltage
Lockout (UVLO), Adjustable Over-Current
Protection (OCP), Over Voltage Protection (OVP),
Short Circuit Protection (SCP)
 Soft Start Function to Minimize Rush Current
during Startup
 Adjustable Switching Frequency (f=200KHz to600KHz)
 Built-in Output Discharge Function
 Tracking Function
 Integrated Boot Strap Diode
 Power Good Function
Input Voltage Range:
Output Voltage Range:
Output Current:
High Side ON Resistance:
Low Side ON Resistance:
Standby Current:
Operating Temperature Range:
Package
3.0V to 20V
0.7V to 5.0V
6.0A(Max)
50mΩ(Typ)
50mΩ(Typ)
0μA (Typ)
-10°C to +100°C
W (Typ) x D (Typ) x H (Max)
Applications
Mobile PC, Desktop PC, LCD-TV, Digital Components, etc.
VQFN040V6060
6.00mm x 6.00mm x 1.00mm
Typical Application Circuit
SW
BOOT
IS+
Is+
REF
C4
R5
C3
C1
R2
SW2
C7
IPULSE
VOUT
C14
C14
R20
R13
16
15
C6
14
12
11
SS
VDD (5V)
R18
R10
C5
R7
C2
VREG
GND_VDD
13
5
R3
1
3
6
18
10
9
8
SS
FS
VREG
7
GND
VCC
6
MODE
5
MOD
E
VDD
ISIs-
ILIM
EN
40
CE
39
VIN_S
VDD
4
C13
38
PGND
3
VDD
C12
VIN
NC
EN
PGND
VQFN040V6060
PGOOD
37
R12
PGND 17
BD95500MUV
VIN
2
36
Q1
19
R11
PGND
1
R15
C8
VIN
20
R20
21
PGND
22
23
SW
SW
SW
24
25
26
SW
SW
28
SW
PGND
VIN
35
PGND
VIN
34
C16
VOUT
(3.3V/6A)
GND_VOUT
R19
33
C11
+
C10
R19
GND_VIN
VIN
SW
29
30
32
SW
31
C15
PGND
VIN
(5V)
27
R14
C9
D1
L1
REF
R6
R4
ILIM
R8
R9
PGOOD
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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Pin Configuration
（TOP VIEW）
PGND SW
30
29
SW
SW
SW
SW
SW
SW
SW PGND
28
27
26
25
24
23
22
21
VIN
31
20 PGND
VIN
32
19 PGND
VIN
33
18 PGND
VIN
34
17 PGND
VIN
35
16 PGND
VIN
36
15 PGND
14 VDD
VINS 37
BOOT 38
EN 39
13
IS+
12
IS -
11
MODE 40
1
2
PGOOD N.C.
3
4
5
6
7
8
9
VOUT
10
SS/ REF
TRACK
Note: Connect the bottom side (FIN) to the ground terminal
ILIM
VCC GND VREG FS
Figure 2. Pin Configuration
Pin Description
(Function Table)
Pin No.
CE
Pin Name
1
PGOOD
2
N.C.
Pin Function
Power good output (±10% window)
No connection
3
CE
Ceramic capacitor reactive pin
4
ILIM
Current limit setting
5
VCC
Power supply input (control block)
6
GND
Sense ground
7
VREG
IC reference voltage (2.5V/500µA)
Switching frequency adjustment (30kΩ to 100kΩ)
8
FS
9
SS/TRACK
10
REF
11
VOUT
12
IS-
Current sense (-)
13
IS+
Current sense (+)
14
VDD
FET driver power supply (5V input)
15 to 21
PGND
22 to 29
SW
30
PGND
Soft start setting (w/ capacitor)/Tracking voltage input
VOUT setting
Output voltage sense
Power ground
High side FET source
Power ground
Battery voltage input (3.3V to 20V input)
31 to 36
VIN
37
VINS
Battery voltage sense
38
BOOT
HG driver power supply
39
EN
40
MODE
bottom
FIN
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Enable input (IC is ON when high)
Control mode selection
Low: Continuous Mode
High: SLLMTM
Substrate connection
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Block Diagram
VVDD
DD
VIN
VIN
VCC
Vcc
VINS
5
VREG
37
SS
9
7
VDD
EN
39
UVLO
VREG
VIN
Reference
Block
BOOT
2.5V
SS
38
2.5VReg
Soft Start
REF × 1.2
SCP
REF × 0.85
SS × 0.85
V OUT
Vcc
31
|
36
OVP
CCIN
IN
3.3V
3.3V～to
20V
20V
V OUT
Delay
H 3 Reg TM
Controller
Block
REF
10
R
Q
SLLM/
Driver
S
Circuit
1
PGOOD
VIN
Power
Good
22
|
29
CCOUT
OUT
14
VDD
5V
MODE
SS
VOUT
OUT
V
VVOUT
OUT
SW
11
EN/UVLO
UVLO
ILIM
SCP
TSD
15
|
21
Current
Limit
ILIM
30
TSD
Thermal
Protection
PGND
PGND
3
× 0.1
6
8
GND
2
40
FS
MODE
4
N.C.
CE
13
ILIM
12
IS+
Is+
IS-Is
Figure 3. Block Diagram
Description of Blocks
1. VCC (Pin 5)
This is the power supply pin for the IC’s internal circuits, except for the FET driver. The input supply voltage ranges
from 4.5V to 5.5V. It is recommended that a 10Ω/0.1µF RC filter be connected to this pin and VDD.
2. EN (Pin 39)
Enables or disables the switching regulator. When the voltage on this pin reaches 2.3V or higher, the internal switching
regulator is turned ON. At voltages less than 0.8V, the regulator is turned OFF.
3. VDD (Pin 14)
This is the power supply pin that drives the LOW side FET and the Boot-strap diode. It is recommended that a 1µF to
10µF bypass capacitor be connected to compensate for rush current during the FET ON/OFF transition.
4. VREG (Pin 7)
This is the reference voltage output pin. The voltage at this pin is 2.5V, with 500µA of current ability. It is recommended
to put a 0.22µF to 1µF capacitor (X5R or X7R) between VREG and GND (Pin 6). When REF is not adjusted from the
external voltage supply, the REF voltage can be adjusted using the external resistor divider of VREG.
5. REF (Pin 10)
This is the output voltage adjustment pin. The output voltage (0.7V to 2.0V) is determined by a resistor divider network
from VREG pin. It is also very convenient for synchronizing the external voltage supply. Variations in the voltage level
on this pin affect the output voltage (REF≈VOUT).
6. ILIM (Pin 4)
BD95500MUV detects the voltage between IS+ pin and IS- pin and limits the output current (OCP). Voltage equivalent
to 1/10 of the voltage at ILIM is the voltage drop of the external current sense resistor. A very low current sense resistor
or inductor DCR can also be used for this platform.
7. SS/TRACK (Pin 9)
This is the adjustment pin to set the soft start time. SS voltage is low during standby status. When EN is ON, the soft
start time can be determined by the SS charge current and capacitor between SS-GND. Until SS reaches REF voltage,
the output voltage is equivalent to SS voltage. And also this pin enables the tracking function. The output voltage keeps
track of a power supply rail by connecting 10kΩ-resistor between the power supply rail and SS/TRACK pin.
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Description of Blocks - continued
8. VINS (Pin 37)
The duty cycle, which controls the output voltage, is determined by the input voltage. In other words, the output voltage
is affected by the input voltage. Therefore, when the voltage at VINS fluctuates, the output voltage also becomes
unstable. Since the VINS line is also the input voltage of the switching regulator, stability depends on the impedance of
the voltage supply. It is recommended to connect a bypass capacitor or RC filter that is suitable for the actual
application.
9. FS (Pin 8)
This pin adjusts the switching frequency with the use of a resistor. It is recommended that a resistor be connected
across FS and GND (pin 6).The frequency range is from 200 kHz to 600 kHz.
10. IS+ (Pin 13), IS- (Pin 12)
These pins are connected to both sides of the current sense resistors to detect output current. The voltage drop
between IS+ and IS- is compared with the voltage equivalent to 1/10 of the voltage at ILIM. When this voltage drop hits
the specified voltage level, the output voltage is turned OFF. Since the maximum input voltage to these pins is 2.7V, set
the output voltage by the resistor divider network in case the output voltage is 2.7V or more.
11. BOOT (Pin 38)
This is the voltage supply which drives the high side FET and a diode for the built-in Boot-strap function. The maximum
absolute ratings are 30V (from GND) and 7V (from SW). The BOOT voltage swings between (VIN+VCC) and VCC during
active operation.
12. PGOOD (Pin 1)
This pin is the output pin for Power Good. It is an open drain pin and is recommended to be connected to a power
supply through a pull-up resistor (about 100kΩ).
13. CE (Pin 3)
This pin is for the ceramic capacitor. It is used to utilize low ESR capacitor for output capacitor.
14. MODE (Pin 40)
This is the pin that can change the control mode. Low: continuous mode, High: SLLMTM.
15. VOUT (Pin 11)
This is the monitor pin for the output voltage. This IC forces the voltage at this pin to be almost equal to VOUT
(REF≈VOUT). When output voltage required is 2V or more, output voltage can be set by the resistor divider network.
16. SW (Pin 22-29)
This is a connection pin for the inductor. The voltage at this pin swings between VIN and GND. The trace from the
output to the inductor should be as short and wide as possible.
17. VIN (Pin 31-36)
This is the input power supply pin. The recommended input voltage is 3.3V to 20V. This pin should be bypassed
directly to ground by a power capacitor.
18. PGND (Pin 15-21, 30)
This is the power ground pin. The wiring pattern to this pin should be as short and wide as possible. Connect to the
reverse side of IC when connecting to GND (6 pin).
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Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VCC
7 (Note 1)
V
Input Voltage 2
VDD
7
(Note 1)
V
Input Voltage 3
VIN
24 (Note 1)
V
Input Voltage 1
BOOT Voltage
BOOT-SW Voltage
LG Voltage
REF Voltage
Output Voltage
ILIM/SS/FS/MODE Voltage
VBOOT
30
V
VBOOT-SW
7
V
VLG
VDD
V
VREF
VCC
V
VOUT/VIS+/VIS-
VCC
V
VILIM/VSS/VFS/VMODE
VCC
V
VREG Voltage
VREG
VCC
V
EN Input Voltage
VEN
7
V
Output Current (Average)
ISW
6
A
Power Dissipation 1
Pd1
0.54 (Note 2)
W
Power Dissipation 2
Pd2
1.00 (Note 3)
W
Power Dissipation 3
Pd3
3.77 (Note 4)
W
Power Dissipation 4
Pd4
4.66
(Note 5)
W
Operating Temperature Range
Topr
-10 to +100
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Junction Temperature
(Note 1) Not to exceed Pd, ASO, and Tjmax=150°C.
(Note 2) Reduce by 4.3mW/oC for Ta over 25°C (not mounted on heat radiation board )
(Note 3) Reduce by 8.0mW/oC for Ta over 25°C (when mounted on a 1 layer 70.0mm x 70mm x 1.6mm Glass-epoxy. (Copper foil area : 0mm2))
(Note 4) Reduce by 30.1mW/oC for Ta over 25°C (when mounted on a 4 layer 70.0mm x 70mm x 1.6mm Glass-epoxy PCB. (1st and 4th layer copper foil area :
20.2mm2, 2nd and 3rd layer copper foil area : 5505mm2))
(Note 5) Reduce by 37.3mW/oC for Ta over 25°C (when mounted on a 4 layer 70.0mm x 70mm x 1.6mm Glass-epoxy. (All copper foil area : 5505mm2))
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum
ratings.
Recommended Operating Conditions (Ta=25°C)
Parameter
Rating
Symbol
Min
Max
Unit
Input Voltage 1
VCC
4.5
5.5
V
Input Voltage 2
VDD
4.5
5.5
V
Input Voltage 3
VIN
3.0
20
V
BOOT Voltage
VBOOT
4.5
25
V
SW Voltage
BOOT-SW Voltage
MODE Input Voltage
VSW
-0.7
+20
V
VBOOT-SW
4.5
5.5
V
VMODE
0
5.5
V
EN Input Voltage
VEN
0
5.5
V
Output Adjustable Voltage
VREF
0.7
2.0
V
IS Input Voltage
VIS+/VIS-
0.7
2.7
V
Minimum ON Time
tON_MIN
-
200
nsec
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Electrical Characteristics
(Unless otherwise noted, Ta=25°C, VCC=5V, VDD=5V, VEN / VMODE=5V, VIN=12V, VREF=1.8V, RFS=68kΩ）
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
[Whole Device]
VCC Bias Current
ICC
1200
2000
μA
VIN Bias Current
IIN
100
200
μA
VCC Standby Current
ICCSTB
0
10
μA VEN＝0V
VIN Standby Current
IINSTB
0
10
μA VEN＝0V
EN Low Voltage
VENLOW
GND
0.8
V
EN High Voltage
VENHIGH
2.3
5.5
V
EN Bias Current
IEN
7
10
μA
IVREG=0 to 500μA,
VREG Voltage
VREG
2.475
2.500
2.525
V
Ta=-10°C to +100°C
[Under Voltage Locked Out ]
VCC Threshold Voltage
VCC_UVLO
4.1
4.3
4.5
V
VCC:Sweep Up
VCC Hysteresis Voltage
dVCC_UVLO
100
160
220
mV VCC:Sweep Down
VIN Threshold Voltage
VIN_UVLO
2.4
2.6
2.8
V
VIN:Sweep Up
VIN Hysteresis
dVIN_UVLO
100
160
220
mV VIN:Sweep Down
VREG Threshold Voltage
VREG_UVLO
2.0
2.2
2.4
V
VREG:Sweep Up
VREG Hysteresis Voltage
dVREG_UVLO
100
160
220
mV VREG:Sweep Down
[H3RegTM Control Block]
ON Time
tON
400
500
600
nsec
Maximum ON Time
tONMAX
3
6.0
μsec
Minimum OFF Time
tOFFMIN
450
550
nsec
[FET Block]
High Side ON Resistance
RHGHON
50
80
mΩ
Low Side ON Resistance
RHGLON
50
80
mΩ
[SCP Block]
SCP Start up Voltage
VSCP
REF x 0.60 REF x 0.70 REF x 0.80
V
Delay Time
tSCP
1.0
2.0
ms
[OVP Block]
OVP Detect Voltage
VOVP
REF x 1.16 REF x 1.2 REF x 1.24
V
[Soft Start Block]
Charge Current
ISS
2
4
6
μA
Discharge Current
IDIS
0.5
1.0
2.0
μA
Standby Voltage
VSS_STB
50
mV
[Over-Current Protection Block]
VILIM=0.5V ,
Current Limit Threshold 1
VILIM1
40
50
60
mV
Ta=-10°C to +100°C
Current Limit Threshold 2
VILIM2
160
200
240
mV VILIM=2.0V
[VOUT Setting]
VOUT Offset Voltage 1
VOUTOFF1
REF-10m
REF
REF+10m
V
Ta=-10°C to +100°C
VOUT Bias Current
IVOUT
-100
0
+100
nA
REF Bias Current
IREF
-100
0
+100
nA
IS+ Input Current
IIS+
-1
0
+1
μA VIS+=1.8V
IS- Input Current
IIS-1
0
+1
μA VIS-=1.8V
[MODE Block]
SLLM Threshold
VTHSLLM
VCC-0.5
VCC
V
Forced Continuous Mode
VTHCONT
GND
0.5
V
Input Impedance
RMODE
400
kΩ
[Power Good Block]
VOUT Power Good Low
VOUTPL
REF x 0.85 REF x 0.90 REF x 0.95
V
Voltage
VOUT Power Good High
VOUTPH
REF x 1.05 REF x 1.10 REF x 1.15
V
Voltage
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VREG Voltage : VREG[V]
VCC Threshold Voltage : VCC_UVLO[V]
Typical Performance Curves
Temperature : Ta(°C)
Temperature : Ta(°C)
Figure 4. VREG Voltage vs Temperature
VIN Threshold Voltage : VIN_UVLO[V]
VREG Threshold Voltage : VREG_UVLO[V]
Figure 5. VCC Threshold Voltage vs
Temperature
Temperature : Ta(°C)
Temperature : Ta(°C)
Figure 7. VREG Threshold Voltage vs
Temperature
Figure 6. VIN Threshold Voltage vs
Temperature
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VREG Voltage : VREG[V]
VOUT Offset Voltage : VOUT _ REF[mV]
Typical Performance Curves – continued
Input Voltage : VCC(V)
Temperature : Ta(°C)
Figure 8. VREG Voltage vs Input Voltage
Current Limit Threshold : VILIM[mV]
Figure 9. VOUT Offset Voltage vs
Temperature
Frequency [kHz]
IO=2A
IO=0A
VILIM=0.5V
Temperature : Ta(°C)
Input Voltage : VIN(V)
Figure 10. Current Limit Threshold vs
Temperature
Figure 11. Frequency vs Input Voltage
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Efficiency :  [%]
Efficiency :  [%]
Typical Performance Curves – continued
Output Current : IOUT(mA)
Figure 12. Efficiency vs Output Current
(VIN=7V, VOUT=1.5V)
Figure 13. Efficiency vs Output Current
(VIN=12V, VOUT=1.5V)
Output Voltage [V]
Efficiency :  [%]
Output Current : IOUT(mA)
Output Current : IOUT(mA)
Output Current : IOUT [A]
Figure 14. Efficiency vs Output Current
(VIN=19V, VOUT=1.5V)
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Figure 15. Output Voltage vs
Output Current
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Frequency [kHz]
Temperature Change : ΔTC [°C]
Typical Performance Curves – continued
Output Current : IOUT [A]
Output Current : IOUT [A]
Figure 16. Frequency vs Output Current
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Figure 17. Temperature Change vs
Output Current
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Typical Waveforms
VOUT
VOUT
IOUT
IOUT
Figure 18. Transient Response
(VIN=7V)
Figure 19. Transient Response
(VIN=12V)
VOUT
VOUT
IOUT
IOUT
Figure 21. Transient Response
(VIN=7V)
Figure 20. Transient Response
(VIN=19V)
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Typical Waveforms – continued
VOUT
VOUT
IOUT
IOUT
IOUT
Figure 22. Transient Response
(VIN=12V)
Figure 23. Transient Response
(VIN=19V)
VOUT
VOUT
IL
IL
IL
Figure 25. SLLM Mode
(IOUT=0.4A)
Figure 24. SLLM Mode
(IOUT=0A)
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Typical Waveforms – continued
VOUT
IL
IL
Figure 27. Continuous Mode
(IO=0A)
Figure 26. SLLM Mode
(IOUT=1A)
IL
IL
Figure 28. Continuous Mode
(IO=4A)
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Figure 29. OCP Status
(IO=5A)
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Typical Waveforms – continued
VIN
VIN
VOUT
VOUT
Figure 30. VIN Change
(5V to 19V)
Figure 31. VIN Change
(19V to 5V)
VOUT
Figure 32. EN Wake Up
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Application Information
1. Explanation of Operation
The BD95500MUV is a switching regulator that incorporates ROHM’s proprietary H3RegTM CONTROLLA control system.
When VOUT drops suddenly due to changes in load, the system quickly restores the output voltage by extending the tON
time interval. This improves the regulator’s transient response. When light-load mode is activated, the IC employs the
Simple Light Load Mode (SLLMTM) controller, further improving system efficiency.
H3RegTM control
(Normal Operation)
VOUT
When VOUT falls to a threshold voltage (REF), the
H3RegTM CONTROLLA system is activated.
REF
t ON 
HG
LG
REF 1
 sec ・・・(1)
VIN
f
High Gate output is determined by the above equation.
(Rapid Changes in Load)
VOUT
When VOUT drops due to a sudden change in load and
VOUT remains below REF after the preprogrammed tON
time interval has elapsed, the system quickly restores
VOUT by extending the tON time, thereby improving
transient response.
REF
IO
tON+α
HG
LG
VIN
VIN
HG
REF
H3RegTM
CONTROLLA
R
Q
SLLMTM
S
SLLM
Driver
Circuit
VOUT
LG
SW
VOUT
PGND
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BD95500MUV
2. Timing Chart
(1) Soft Start Function
Soft start function is enabled when EN pin is set to
HIGH. Current control circuitry takes effect at startup,
yielding a moderate “ramping start” in output voltage.
Soft start timing and incoming current are given by
equation (2) and (3) below:
EN
tSS
Soft Start Time
SS
t SS 
REF  C SS
4A(typ)
sec
・・・(2)
Rush Current
VOUT
I IN (ON ) 
CO  VOUT
t SS
A・・・(3)
IIN
Where:
CSS is the Soft start capacitor
CO is the Output capacitor
(2) Soft Stop Function
Soft stop is enabled when EN pin is set to LOW.
Current circuitry control takes effect at startup, yielding
a gradually falling output voltage. Soft stop time and
rush current are given by equation (4) below.
EN
tSS(OFF)
Soft Stop Time
1.2V
t SS (OFF ) 
SS
0.1V
Spontaneous Discharge
(It is determined by load and output
capacitor)
VOUT
tdelay
V SS  1.2
tdelay 
( REF  2V BE )  C SS
1A(typ)
[V ]
C SS
1A(typ)
sec ・・・(4)
(typ)
sec
・・・(5)
(3) Timer Latch Type Short Circuit Protection
REF x 0.70
When output voltage (IS-) falls to REF x 0.7 or less, the
SCP comparator inside the IC is enabled. If the High
state continues for 1ms or more (programmed time
inside IC), the IC goes OFF. It can be restored either by
reconnecting the EN pin or disabling UVLO.
VOUT
1ms
SCP
EN/UVLO
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BD95500MUV
Timing Chart – continued
(4) Output Over Voltage Protection
REF x 1.2
When the output reaches or exceeds REF x 1.2, the
output over voltage protection is triggered, turning the
low-side FET completely ON to reduce the output
(LG=High, HG=Low）. When the output falls, it returns to
the standard operation.
VOUT
HG
LG
Switching
(5) Over-Current Protection Circuit
tON
tON
tMAX
tON
During normal operation, the High Gate becomes HIGH
during the ON time tON (P.15) when VOUT becomes less
than REF. However, when the inductor current IL
exceeds OCP setting current (ILIMIT), HG becomes LOW.
After the max ON time tMAX, HG becomes HIGH again if
the output voltage is lower than the specific voltage level
and IL is lower than ILIMIT level.
HG
LG
ILIMIT
IL
(6) Synchronous Operation with External Power Supply
These power supply sequences are realized to connect
SS pin to other power supply output through the
resistance (10kΩ).
3.3V (External Power Supply)
1.5 V (BD95500 Output 1)
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BD95500MUV
3. External Component Selection
(1) Inductor (L) Selection
The inductor’s value directly influences the output ripple current.
As indicated by equation (4) below, the greater the inductance or
switching frequency, the lower the ripple current:
ΔIL
I L 
VIN
A
・・・(4)
The proper output ripple current setting is about 30% of the maximum
output current.
IL
HG
(V IN - VOUT )  VOUT
L  V IN  f
SW
VOUT
L
I L  0.3  I OUTMAX
A
・・・(5)
(VIN - VOUT )  VOUT
L  VIN  f
H 
・・・(6)
Co
LG
L
PGND
Output Ripple Current
where:
ΔIL is the output ripple current
f is the switch frequency
(a) Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and
decreases system efficiency. In selecting the inductor, be sure to allow enough margin to assure that the peak current
does not exceed the inductor’s rated current value.
(b) To minimize possible inductor damage and maximize efficiency, choose an inductor with a low DCR and ACR.
(2) Output Capacitor (CO) Selection
VIN
HG
SW
VOUT
L
When determining the proper output capacitor, be sure to consider the equivalent
series resistance (ESR) and equivalent series inductance (ESL) required to set the
output ripple voltage to 20mV or more.
When selecting the limit of the inductor, be sure to allow enough margin for the
output voltage.
Output ripple voltage is determined by equation (7) below.
ESR
LG
VOUT  I L  ESR  ESL I L / tON ・・・(7)
ESL
Where:
ΔIL is the output ripple current
ESR is the CO equivalent series resistance
ESL is the equivalent series inductance
CO
PGND
Output Capacitor
Please give consideration to the conditions of equation (8) below for output capacity, bear in mind that the output rise
time must be established within the soft start time frame.
CO 
t SS  ( Limit  I OUT )
・・・(8)
VOUT
where:
tSS is the Soft start time (See formula (2) in P16)
Limit is the over-current detection (See formula (10)(11) in P19)
Note: Improper capacitor may cause startup malfunctions
(3) Input Capacitor (CIN) Selection
VIN
In order to prevent extreme over-current conditions, the input capacitor must have
a low enough ESR to fully support a large ripple in the output.
The formula for ripple current IRMS is given by equation (9) below.
CIN
HG
SW
VOUT
L
I RMS  I OUT 
V IN (V IN  VOUT )
[ A] ・・・(9)
V IN
CO
LG
Where VIN  2  VOUT ,IRMS 
PGND
IOUT
2
Input Capacitor
A low-ESR capacitor is recommended to reduce ESR loss and maximize efficiency.
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BD95500MUV
External Component Selection – continued
(4) Setting Detection Resistance
The over-current protection function detects the peak value of the output
ripple current.
This parameter (setting value) is determined by equation (10) below.
VIN
HG
L
SW
R
VOUT
ILIMIT 
VILIM  0.1
R
[A] ・・・(10)
IL
CO
LG
PGND
where:
VILIM is the ILIM voltage
R is the detection resistance
IS+
ISCurrent Limit
VIN
When the over-current protection is detected by the DCR of coil L, this
parameter (setting value) is determined by equation (11) below.
IL
HG
L
SW
RL
R
LG
PGND
VOUT
ILIMIT  VILIM  0.1
CO
C
( RL 
IS+
RC
L
[A]
・・・(11)
L
)
RC
where:
VILIM is the ILIM voltage
RL is the DCR value of coil
ISCurrent Limit
IL
detect point
As soon as the voltage drop between IS+ and IS-, which is generated by the
inductor current, reaches a specific threshold, the gate voltage of the high
side MOSFET becomes low.
Since the peak voltage of the inductor ripple current is detected, this
operation can sense high current ripple operation caused by inductance
saturated rated current and lead to high reliable systems.
ILIMIT
0
t
VIN
HG
L
SW
R
VOUT
When the output voltage is 2.7V or more, use the setup like in the left
figure for setting output voltage for IS+ and IS-.
According to the setting value above, ILIMIT setting current is proportion to
the resistor divider ratio.
IL
CO
LG
PGND
R1
R1
IS+
IS-
VOUT
Current Limit
R2
R2
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ILIMIT 
R1  R2 VILIM  0.1

R1
R
[A]
・・・(12)
where:
VILIM is the ILIM voltage
R is the detection resistance
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BD95500MUV
External Component Selection – continued
(5) Frequency Adjustment
The On Time (tON) at steady state is determined by the
resistor value connected to FS pin.
But actually SW rising time and falling time are the
effects of the influence of the external MOSFET gate
capacitance and switching time. This leads to an
increase in tON and slight lowering of the total
frequency.
When tON, input voltage and VREF voltage are known,
the switching frequency can be determined by the
following equation:
3000
VIN=5V
7V
12V
16V
19V
ON Time: tON [nsec]
TON [nsec]
2500
2000
1500
1000
500
REF=1.8V
f 
0
0
50
200
150
100
[kΩ]
RFS
RFS[kΩ]
Exchange
to Frequency Characteristic
VREF
・・・(13)
VIN  tON
Additionally, when output current is around 0A in
continuous mode, this “dead time” also has an effect
on tON, further lowering the switching frequency.
Confirm the switching frequency by measuring the
current through the coil (at the point where current
does not flow backwards) during normal operation.
1200
VIN=5V
7V
12V
16V
19V
Frequency [kHz]
1000
800
600
400
200
0
0
50
100
150
200
Resistance [kΩ]
(6) Setting Standard Voltage (REF)
VIN
REF
H3RegTM
CONTROLLA
R
Q
It is possible to set the reference voltage (REF) with
external power supply voltage.
Q
It is possible to set the reference voltage (REF) by the
resistance division value from VREG in case it is not set
with an external power supply.
S
Outside
Voltage
VOUT
VREG
VIN
R1
REF
H3RegTM
CONTROLLA
R
S
R2
REF 
R2
 VREG
R1  R2
[V]
・・・(14)
VOUT
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BD95500MUV
External Component Selection – continued
(7) Setting Output Voltage
This IC is operated wherein the output voltage is almost equal to REF voltage (REF≈VOUT).
It is also operated that the output voltage is feed back to FB pin in case the output voltage is 0.7V to 2.0V.
VIN
REF
VIN
R
H3RegTM
CONTROLLA
Q
SLLM
S
Output
voltage
Driver
Circuit
SLLM
VOUT
In case the output voltage range is 0.7V to 2.0V.
Additionally, in case the output voltage is more than 2.0V, the output voltage is feed back to VOUT pin through a resistor
divider network.
OutputVoltage
R1  R2
 REF
R2
[V ] ・・・(15)
And then the frequency is also in proportion to the divided ratio.
f 
R2
REF

R1  R2 VIN  tON ・・・(16)
VIN
REF
VIN
H3RegTM
CONTROLLA
R
Q
SLLM
S
Output
voltage
Driver
Circuit
SLLM
VOUT
R1
R2
In case the output voltage is more than 2.0V.
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BD95500MUV
4. Evaluation Board Circuit (Frequency=300kHz Continuous/SLLM Circuit Example)
SW
IS+
Is+
BOOT
REF
C4
R5
C3
C1
R2
SW2
C14
C14
R20
R13
C6
14
12
VOUT
11
SS
VDD (5V)
R18
R10
C5
R7
R3
VREG
GND_VDD
13
5
C2
1
3
6
15
10
SS
9
GND
FS
8
1
MODE
7
VDD
6
MOD
E
VCC
40
VREG
IsIS-
EN
5
39
ILIM
C13
IPULSE
16
VDD
VIN_S
4
38
18
PGND
CE
VDD
C12
PGND
VQFN040V6060
VIN
3
EN
VIN
NC
37
R12
PGND 17
BD95500MUV
PGOOD
36
Q1
19
C7
PGND
2
R15
C8
VIN
R20
21
PGND
22
23
SW
SW
SW
24
25
26
SW
SW
SW
28
29
PGND
VIN
35
20
PGND
VIN
34
C16
GND_VOUT
R11
33
C11
VOUT
(3.3V/6A)
R19
GND_VIN
+
C10
R19
C15
VIN
SW
30
32
SW
31
PGND
VIN
(5V)
27
R14
C9
D1
L1
REF
R6
R4
ILIM
R8
R9
PGOOD
5. Evaluation Board Parts List
Part No
Value
Company
Part name
Part No
Value
Company
Part name
U1
-
ROHM
BD95500MUV
R17
100kΩ
ROHM
MCR03 Series
D1
-
ROHM
RB051L-40
R18
1kΩ
ROHM
MCR03 Series
L1
4.3µH
Sumida
CDEP105NP-4R3MC-88
R19
10kΩ
ROHM
MCR03 Series
Q1
-
-
-
R20
12kΩ
ROHM
MCR03 Series
R1
0Ω
ROHM
MCR03 Series
C1
0.1µF
MURATA
GRM18 Series
R2
0Ω
ROHM
MCR03 Series
C2
100pF
MURATA
GRM18 Series
R3
100kΩ
ROHM
MCR03 Series
C3
0.47µF
MURATA
GRM18 Series
R4
150kΩ
ROHM
MCR03 Series
C4
1000pF
MURATA
GRM18 Series
R5
68kΩ
ROHM
MCR03 Series
C5
1000pF
MURATA
GRM18 Series
R6
100kΩ
ROHM
MCR03 Series
C6
10µF
MURATA
GRM21 Series
R7
150kΩ
ROHM
MCR03 Series
C7
-
MURATA
GRM18 Series
R8
-
ROHM
MCR03 Series
C8
220µF
SANYO or
something
functional high
polymer
R9
100kΩ
ROHM
MCR03 Series
C9
10µF
MURATA
GRM21 Series
R10
10Ω
ROHM
MCR03 Series
C10
0.1µF
MURATA
GRM18 Series
R11
-
ROHM
MCR03 Series
C11
10µF
KYOSERA or
something
CM316B106M25A
R12
10Ω
ROHM
MCR03 Series
C12
0.1µF
MURATA
GRM18 Series
ROHM
MCR03 Series
C13
0.1µF
MURATA
GRM18 Series
R13
R14
1kΩ
ROHM
MCR03 Series
C14
100pF
MURATA
GRM18 Series
R15
1kΩ
ROHM
MCR03 Series
C15
10µF
KYOSERA or
something
CM316B106M25A
R16
100kΩ
ROHM
MCR03 Series
C16
0.1µF
MURATA
GRM18 Series
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BD95500MUV
I/O Equivalent Circuit
Pin 1 (PGOOD)
Pin 3 (CE)
Pin 4 (ILIM)
VCC
Pin 7 (VREG)
VCC
Pin 10 (REF)
VCC
Pin 13 (IS+)
Pin 8 (FS)
VCC
Pin 9 (SS/TRACK)
VCC
VCC
Pin 11 (VOUT)
VCC
Pin 12 (IS-)
VCC
VCC
Pin 22-29 (SW)
Pin 31-36 (VIN)
VIN
VCC
SW
PGND
Pin 37 (VINS)
Pin 38 (BOOT)
Pin 39 (EN)
VDD
Pin 40(MODE)
SW
VCC
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BD95500MUV
Power Dissipation
VQFN040V6060
5.0
④4.66W
4.5
4.0
③3.77W
Power Dissipation: Pd [W]
3.5
3.0
2.5
2.0
1.5
②1.00W
1.0
①0.54W
0.5
0
0
25
50
75
100
125
150
Ambient Temperature :Ta [°C]
①IC Only
θj-a=231.5°C/W
②IC mounted on 1-layer board (with 20.2 mm2 copper thermal pad)
θj-a=125.0°C/W
③IC mounted on 4-layer board (with 20.2 mm2 pad on top layer,5505 mm2 pad on layers 2,3)
θj-a=33.2°C/W
④IC mounted on 4-layer board (with 5505mm2 pad on all layers)
θj-a=26.8°C/W
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BD95500MUV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD95500MUV
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 33. Example of monolithic IC structure
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
BD95500MUV
TSD ON Temp. [°C] (typ)
Hysteresis Temp. [°C] (typ)
175
15
15. Ground wiring traces
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground
caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND
voltage.
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BD95500MUV
Ordering Information
B
D
9
5
5
0
0
Part Number
M
U
V
-
Package
MUV: VQFN040V6060
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
VQFN040V6060 (TOP VIEW)
Part Number Marking
D95500
LOT Number
1PIN MARK
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
27/29
TSZ02201-0A1A0A900050-1-2
27.Nov.2014 Rev.001
BD95500MUV
Physical Dimension Tape and Reel information
Package Name
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
VQFN040V6060
28/29
TSZ02201-0A1A0A900050-1-2
27.Nov.2014 Rev.001
BD95500MUV
Revision History
Date
Revision
27.Nov.2014
001
Changes
New Release
www.rohm.com
© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
29/29
TSZ02201-0A1A0A900050-1-2
27.Nov.2014 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001