BH6172GU : Power Management ICs

CMOS LDO Regulators for Potable Equipments
System Regulator
with High Efficiency DC/DC Converters
BH6172GU
No.11020EAT08
●Descriptions
BH6172GU incorporates 1 DCDC+ 5 Linear LDO regulators. It is integrated in a small 2.6mm×2.6mm size package, with 16
steps adjustable Vo’s for every channel, low voltage output (0.8V~) to support almost any kind of mobile application now
available.
●Features
2
1) 1ch 500mA, high efficiency Step-down Converter. (16 steps adjustable VO by I C)
2
2) 5-channel CMOS-type LDOs. (16 steps adjustable VO by I C, 150mA×3, 300mA×2)
3) Power ON/OFF control enabled by I2C interface or external pin
4) I2C compatible Interface. (Device address is “1001111”)
5) Wafer Level CSP package(2.6mm×2.6mm) for space-constrained applications
6) Discharge resistance selectable for power-down sequence ramp speed control
7) Over-current protection in all LDO regulators
8) Over-current protection in Step-down Converter
9) Over-voltage protection in Step-down Converter
10) Thermal shutdown protection
●Applications
Mobile phones, Portable game systems, Portable mp3 players, Portable DVD players, Portable TV, Portable GPS,
PDA, Portable electronic dictionaries, etc.
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Maximum Supply Voltage (VBAT)
VBATMAX
6.0
V
Maximum Supply Voltage (PBAT)
VPBATMAX
6.0
V
Maximum Supply Voltage (VUSB)
VUSBMAX
6.0
V
Maximum Supply Voltage (DVDD)
DVDDMAX
4.5
V
Maximum Input Voltage 1
(LX, FB, OUT1, OUT2, OUT3, OUT4, OUT5,
EN_LD1, EN_LD2, EN_LD3, EN_LD4)
VINMAX1
VBAT + 0.3
V
Maximum Input Voltage 2
(NRST, CLK, DATA)
VINMAX2
DVDD + 0.3
V
Pd
900*1
mW
Operating Temperature Range
Topr
-35 ~ +85
℃
Storage Temperature Range
Tstg
-55 ~ +125
℃
Power Dissipation
*
This is an allowable loss of the ROHM evaluation glass epoxy board(60mm×60mm×16mm).
To use at temperature higher than 25℃ , derate 9.0mW per 1℃.
*1 Must not exceed Pd or ASO.
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© 2011 ROHM Co., Ltd. All rights reserved.
1/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Recommended Operating Conditions (Ta=25℃)
Parameter
Symbol
Ratings
Unit
VBAT Voltage
VBAT
2.20 ~ 5.50*2
V
PBAT Voltage
VPBAT
2.20 ~ 5.50*2
V
VUSB Voltage
VUSB
2.20 ~ 5.50*2*3
V
DVDD Voltage
VDVDD
1.70 ~ 4.20*4
V
*2 Whenever the VBAT or PBAT or VUSB voltage is under the LDO, SWREG output voltage,
or else under certain levels, the LDO and SWREG output is not guaranteed to meet its published specifications.
*3 VUSB Power Supply can be externally connected to the VBAT, PBAT Power Supply when necessary.
*4 The DVDD Voltage must be under the Battery Voltage VBAT, PBAT at any times.
●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
Circuit Current
VBAT Circuit Current 1
(OFF)
IQVB1
-
0.4
1
µA
VUSB Circuit Current 1
(OFF)
IQUSB1
-
0
1
µA
VBAT Circuit Current 2
(OFF)
IQVB2
-
0.4
1
µA
VBAT Circuit Current 3
(STANDBY)
IQVB3
-
0.7
1.4
µA
VUSB Circuit Current 2
(STANDBY)
IQUSB2
-
0
1
µA
VBAT Circuit Current 4
(STANDBY)
IQVB4
-
0.7
1.4
µA
VBAT Circuit Current 5
(Active)
IQVB5
-
170
300
µA
VUSB Circuit Current 3
(Active)
IQUSB3
-
35
70
µA
VBAT Circuit Current 6
(Active)
IQVB6
-
200
350
µA
LDO1~5=OFF
SWREG1=OFF
NRST=L
DVDD=0V
LDO1~5=OFF
SWREG1=OFF
NRST=L
DVDD=0V
VUSB=VBAT external connection
LDO1~5=OFF
SWREG1=OFF
NRST=H
DVDD=2.6V
LDO1~5=OFF
SWREG1=OFF
NRST=H
DVDD=2.6V
VUSB=VBAT external connection
LDO1~5=ON(no load, initial voltage)
SWREG1=ON(no load, initial voltage)
NRST=H
DVDD=2.6V
LDO1~5=ON(no load, initial voltage)
SWREG1=ON(no load, initial voltage)
NRST=H
DVDD=2.6V
VUSB=VBAT external connection
◎This product is not especially designed to be protected from radioactivity.
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© 2011 ROHM Co., Ltd. All rights reserved.
2/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V, DVDD=2.6V)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
Logic pin character
NRST
(CMOS input)
EN_LD1,
EN_LD2,
EN_LD3,
EN_LD4
(NMOS input)
Input
“H” level
Input
“L” level
Input leak
current
Input
“H” level
Input
“L” level
Input leak
current
VIH1
DVDD
×0.7
-
DVDD
+0.3
DVDD
×0.3
VIL1
-0.3
-
IIC1
0
0.3
1
µA
VIH2
1.44
-
-
V
VIL2
-
-
0.4
V
IIC2
-1
0
1
µA
V
Pin voltage: DVDD
V
Pin voltage: 0 V
Digital characteristics (Digital pins: CLK and DATA )
Input "H" level
VIH3
DVDD
×0.8
-
DVDD
+0.3
DVDD
×0.2
Input "L" level
VIL3
-0.3
-
Input leak current
IIC3
-1
0
1
µA
Pin voltage: DVDD
DATA output "L" level voltage
VOL
-
-
0.4
V
IOL=6mA
Output Voltage
VOSW
0.94
1.00
1.06
V
initial value
Io=100mA
Output current
IOSW
-
-
500
mA
Vo=1.00V
Efficiency
ηSW
-
90
-
%
Oscillating Frequency
fOSC
-
1.7
-
MHz
Output Inductance
LSWREG
1.5
2.2
-
µH
Ta= -30~75℃
Short circuit current
ISHTSW
-
500
-
mA
Ta= -30~75℃
Output Capacitance
CSWREG
3.3
4.7
-
µF
Ta= -30~75℃
with SWREG's DC bias
V
V
SWREG
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3/16
Io=100mA, Vo=2.40V, VBAT=3.2V
Vo=1.00V
2011.03 - Rev.A
Technical Note
BH6172GU
●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
LDO1
initial value
[email protected]=4.5V
[email protected]=3.4V
Output Voltage
VOM1
0.970
1.000
1.030
V
Output current
VOM1C
-
-
150
mA
Vo=1.0V
VOM1DP
-
0.1
-
V
Io=50mA
Input Voltage Stability
⊿VIM1
-
2
-
mV
Load Stability
⊿VLM1
-
20
-
mV
Ripple rejection ratio
RRM1
-
60
-
dB
VR=-20dBV, fR=120Hz
Io=50mA, Vo=2.6V
BW=20Hz~20kHz
Short circuit current
ISHTM3
-
180
-
mA
Vo=0V
Output Capacitor
COUT1
-
1.0
-
µF
Ta= -30~75℃
with LDO's DC bias
Output Voltage
VOM2
2.522
2.600
2.678
V
initial value
[email protected]=4.5V
[email protected]=3.4V
Output current
VOM2C
-
-
150
mA
Vo=2.6V
VOM2DP
-
0.1
-
V
Io=50mA
Input Voltage Stability
⊿VIM2
-
2
-
mV
Load Stability
⊿VLM2
-
20
-
mV
Ripple rejection ratio
RRM2
-
60
-
dB
VR=-20dBV, fR=120Hz
Io=50mA, Vo=2.6V
BW=20Hz~20kHz
Short circuit current
ISHTM3
-
180
-
mA
Vo=0V
Output Capacitor
COUT2
-
1.0
-
µF
Ta= -30~75℃
with LDO's DC bias
Output Voltage
VOM3
2.716
2.800
2.884
V
initial value
[email protected]=4.5V
[email protected]=3.4V
Output current
VOM3C
-
-
300
mA
Vo=2.8V
VOM3DP
-
0.1
-
V
Io=50mA
Input Voltage Stability
⊿VIM3
-
2
-
mV
Load Stability
⊿VLM3
-
20
-
mV
Ripple rejection ratio
RRM3
-
60
-
dB
VR=-20dBV, fR=120Hz
Io=50mA, Vo=2.6V
BW=20Hz~20kHz
Short circuit current
ISHTM3
-
180
-
mA
Vo=0V
Output Capacitor
COUT3
-
1.0
-
µF
Ta= -30~75℃
with LDO's DC bias
Dropout Voltage
VBAT=3.4~4.5V, Io=50mA
Vo=1.0V
Io=50µA~150mA, VBAT=3.6V
Vo=1.0V
LDO2
Dropout Voltage
VBAT=3.4~4.5V, Io=50mA
Vo=2.6V
Io=50µA~150mA, VBAT=3.6V
Vo=2.6V
LDO3
Dropout Voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
4/16
VBAT=3.4~4.5V, Io=50mA
Vo=2.8V
Io=50µA~300mA, VBAT=3.6V
Vo=2.8V
2011.03 - Rev.A
Technical Note
BH6172GU
●Electrical Characteristics (Unless otherwise specified, Ta=25℃, VBAT=PBAT =3.6V, VUSB=5.0V)
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
LDO4
initial value
[email protected]=4.5V
[email protected]=3.4V
Output Voltage
VOM4
1.746
1.800
1.854
V
Output current
VOM4C
-
-
300
mA
Vo=1.8V
VOM4DP
-
0.1
-
V
Io=50mA
Input Voltage Stability
⊿VIM4
-
2
-
mV
Load Stability
⊿VLM4
-
30
-
mV
Ripple rejection ratio
RRM4
-
60
-
dB
VR=-20dBV, fR=120Hz
Io=50mA, Vo=2.6V
BW=20Hz~20kHz
Short circuit current
ISHTM4
-
340
-
mA
Vo=0V
Output Capacitor
COUT4
-
1.0
-
µF
Ta= -30~75℃
with LDO's DC bias
Output Voltage
VOM5
3.201
3.300
3.399
V
initial value
[email protected]=5.5V
[email protected]=4.4V
Output current
VOM5C
-
-
150
mA
Vo=3.3V
VOM5DP
-
0.1
-
V
Io=50mA
Input Voltage Stability
⊿VIM5
-
2
-
mV
Load Stability
⊿VLM5
-
20
-
mV
Ripple rejection ratio
RRM5
-
60
-
dB
VR=-20dBV, fR=120Hz
Io=50mA, Vo=2.6V
BW=20Hz~20kHz
Short circuit current
ISHTM5
-
180
-
mA
Vo=0V
Output Capacitor
COUT5
-
1.0
-
µF
Ta= -30~75℃
with LDO's DC bias
Dropout Voltage
VBAT=3.4~4.5V, Io=50mA
Vo=1.8V
Io=50µA~300mA, VBAT=3.6V
Vo=1.8V
LDO5
Dropout Voltage
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© 2011 ROHM Co., Ltd. All rights reserved.
5/16
VUSB=4.4~5.5V, Io=50mA
Vo=3.3V
Io=50µA~150mA, VUSB=5.5V
Vo=3.3V
2011.03 - Rev.A
Technical Note
BH6172GU
●SWREG & LDOs Output Voltage table
Usage example
Power Supply
Initial
Output Voltage
Load max
Adjustable range
SWREG
CORE
VBAT/PBAT
1.00V
500mA
0.80-2.40V
LDO1
CORE
VBAT
1.00V
150mA
1.00-3.30V
LDO2
I/O1
VBAT
2.60V
150mA
1.00-3.30V
LDO3
MEMORY
VBAT
2.80V
300mA
1.20-3.30V
LDO4
I/O2
VBAT
1.80V
300mA
1.20-3.30V
LDO5
USB
VBAT/VUSB
3.30V
150mA
1.20-3.30V
Parameter
Parameter
Programmable
Output Voltages
SWREG
LDO1
LDO2
LDO3
LDO4
LDO5
0.80V
1.00V
1.00V
1.20V
1.20V
1.20V
0.85V
1.10V
1.10V
1.30V
1.30V
1.30V
0.90V
1.20V
1.20V
1.40V
1.40V
1.40V
0.95V
1.30V
1.30V
1.50V
1.50V
1.50V
1.00V
1.40V
1.40V
1.60V
1.60V
1.60V
1.05V
1.50V
1.50V
1.70V
1.70V
1.70V
1.10V
1.60V
1.60V
1.80V
1.80V
1.80V
1.15V
1.70V
1.70V
1.85V
1.85V
1.85V
1.20V
1.80V
1.80V
1.90V
1.90V
1.90V
1.365V
1.85V
1.85V
2.00V
2.00V
2.00V
1.40V
2.60V
2.60V
2.60V
2.60V
2.60V
1.50V
2.70V
2.70V
2.70V
2.70V
2.70V
1.65V
2.80V
2.80V
2.80V
2.80V
2.80V
1.80V
2.85V
2.85V
2.85V
2.85V
2.85V
1.85V
3.00V
3.00V
3.00V
3.00V
3.00V
2.40V
3.30V
3.30V
3.30V
3.30V
3.30V
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© 2011 ROHM Co., Ltd. All rights reserved.
6/16
2011.03 - Rev.A
Technical Note
BH6172GU
4.7µF
VBAT2
VBAT1
●Block diagram, Ball matrix
LDO1
DVDD
1.00-3.30V
0.1V step
DATA
init 1.00V OUT1
150mA
1µF
EN_LD1
I2CIF
CLK
LDO2
1.00-3.30V
0.1V step
NRST
PBAT
LDO3
LX
2.2µH
4.7µF
PGND
1.20-3.30V
0.1V step
SWREG
150mA
1µF
1µF
EN_LD3
500mA
init 1.00V
LDO4
1.20-3.30V
0.1V step
init 1.80V
OUT4
VBAT2
OUT3
D
OUT2
EN_LD2
EN_LD3
NRST
OUT1
C
GND
EN_LD1
EN_LD4
CLK
DVDD
B
REFC
TEST
DATA
FB
A
OUT5
VUSB
PGND
LX
PBAT
1
2
3
4
5
OUT4
300mA
1µF
EN_LD4
(OPEN) TEST
VUSB
(OPEN) TEST2
1µF
REFC
TEST2
init 2.80V OUT3
300mA
0.8-2.40V
FB
VBAT1
init 2.60V OUT2
EN_LD2
4.7µF
E
REF
LDO5
0.1µF
OUT5
150mA
1µF
GND
1.20-3.30V
0.1V step
init 3.30V
Fig.1 Block diagram
Fig.2 Ball matrix
●Pin description
Ball No.
PIN Name
Function
B4
DATA
Data input/output for I2C
C4
CLK
CLK input for I2C
E1
VBAT1
Power Supply 1
E4
VBAT2
Power Supply 2
A5
PBAT
A4
LX
A3
PGND
B5
FB
D4
NRST
RESET Input Pin (Low Active)
D5
OUT1
LDO1 Output
D1
OUT2
LDO2 Output
E5
OUT3
LDO3 Output
E3
OUT4
LDO4 Output
A1
OUT5
LDO5 Output
B1
REFC
Reference Voltage Output
C2
EN_LD1
LDO1 Enable Pin
D2
EN_LD2
LDO2 Enable Pin
D3
EN_LD3
LDO3 Enable Pin
C3
EN_LD4
LDO4 Enable Pin
A2
VUSB
USBVBUS Power Supply*1
C5
DVDD
Digital Power Supply
C1
GND
Analog Ground
B3
TEST
TEST PIN (Always keep OPEN at normal use)
E2
TEST2
TEST PIN (Always keep OPEN at normal use)
Power Supply for SWREG
Inductor Connect pin for SWREG
Ground for SWREG
Voltage Feed back pin for SWREG
*
EST, TEST2 pin is used during our company shipment test.
lease keep TEST pin and TEST2 pin “OPEN” at all times.
*1 USB Power Supply can be externally connected to the VBAT Power Supply when necessary.
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7/16
2011.03 - Rev.A
Technical Note
BH6172GU
●I2C Bus Interface
2
The I C compatible synchronous serial interface provides access to programmable functions and register on the device.
This protocol uses a two-wire interface for bi-directional communications between the LSI’s connected to the bus.
The two interface lines are the Serial Data Line (DATA), and the Serial Clock Line (CLK). These lines should be connected to
the power supply DVDD by a pull-up resistor, and remain high even when the bus is idle.
1. Start and Stop Conditions
When CLK is high, pulling DATA low produces a start condition and pulling DATA high produces a stop condition.
Every instruction is started when a start condition occurs and terminated when a stop condition occurs. During read, a stop
condition causes the read to terminate and the chip enters the standby state. During write, a stop condition causes the
fetching of write data to terminate, after which writing starts automatically. Upon the completion of writing, the chip enters
the standby state. Two or more start conditions cannot be entered consecutively.
tSU.STA tHD.STA
tSU.STO
CLK
DATA
Start condition
Stop condition
2
Fig.3 I C Start, Stop condition
2. Data transmission
Data on the DATA input can be modified while CLK is low. When CLK is high, modifying the DATA input means a start or
stop condition.
tSU.DAT
tHD.DAT
CLK
DATA
Modify data
Modify data
2
Fig.4 I C Data Transmission Timing
All other acknowledge, write, and read timings all conform to the I2C standard.
3. Device addressing
The device address for this device is “1001111”.
Read/write instruction
code
Device address
1
0
0
1
1
1
1
MSB
R/W
LSB
2
Fig.5 I C device address
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8/16
2011.03 - Rev.A
Technical Note
BH6172GU
●I2C Bus
AC specification
Characteristics
Symbol
Min.
Max.
Unit
CLK clock frequency
fCLK
0
400
kHz
CLK clock “low” time
tLOW
1.3
-
µs
CLK clock “high” time
tHIGH
0.6
-
µs
Bus free time
tBUF
1.3
-
µs
Start condition hold time
tHD.STA
0.6
-
µs
Start condition setup time
tSU.STA
0.6
-
µs
Data input hold time
tHD.DAT
0
-
ns
Data input setup time
tSU.DAT
100
-
ns
Stop condition setup time
tSU.STO
0.6
-
µs
tF
tHIGH
tR
tLOW
CLK
tSU.STA tHD.STA
tSU.STO
tHD.DAT tSU.DAT
DATA
(INPUT)
tBUF
Fig.6 Bus timing 1
CLK
DATA
(INPUT)
DO
tWR
Write data input
Acknowledge output
Stop condition
Start condition
Fig.7 Bus timing 2
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9/16
2011.03 - Rev.A
Technical Note
BH6172GU
●I2C Register information
○REGCNT(SWREGON, LDO*ON)
Control each SWREG, LDO.
0
ON
1
OFF
○SWADJ(SWREGADJ[3:0])
Change SWREG output voltage by 16 steps.
~
0.80V
~
“0000”
“1111”
2.40V
○LDOADJ*(LDO*ADJ[3:0])
Change LDO1~5 output voltage by 16 steps.
~
1.00V(LDO1, 2), 1.20V(LDO3, 4, 5)
~
“0000”
“1111”
3.30V
○PDSEL(SWPDSEL, LDO*PDSEL)
Change the discharge resistance of SWREG, LDO.
0
1kΩ
1
10kΩ
○PDCNT(SWPD, LDO*PD)
Enable/disable the discharge resistance of SWREG, LDO.
0
Discharge disable
1
Discharge enable
○EN_SEL(ENLD*_EN)
2
Select either an enable pin or I C register for LDO1~4 ON/OFF control.
0
External enable pin selected
1
I2C register selected
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10/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Reference data(ICC)
ICC(OFF) VUSB=5.0V
ICC(OFF) VBAT=VUSB short
9
9
8
8
7
7
6
6
I_VBAT [uA]
10
I_VBAT [uA]
10
5
4
5
4
3
3
2
2
1
1
0
0
0
0.5
1
1.5
2
2.5
3
3.5
VBAT [V]
4
4.5
5
5.5
6
0
0.5
1
2
2.5
3
3.5
VBAT [V]
4
4.5
5
5.5
6
ICC(ACTIVE) VBAT=VUSB short
ICC(STBY) VBAT=VUSB short
1
9
0.9
8
0.8
7
0.7
6
0.6
I_VBAT [mA]
10
I_VBAT [uA]
1.5
5
4
0.5
0.4
3
0.3
2
0.2
1
0.1
0
0
0
0.5
1
1.5
2
2.5
3
3.5
VBAT [V]
4
4.5
5
5.5
6
3.2
3.7
4.2
4.7
5.2
5.7
VBAT [V]
●Reference data(SWREG)
SWREG L o ad Re g u lat io n V O=1.0V
SWREG L in e Re g u lat io n V O=1.0V
2
6
1.9
5.5
1.8
VBAT
1.7
5
1.6
1.5
4.5
1.4
1.3
1.2
3.5
1.1
FB [V]
FB [ V]
4
3
2.5
1
0.9
0.8
0.7
2
0.6
1.5
0.5
0.4
1
0.3
0.2
0.5
0.1
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
6
50
100
150
200
250
300
350
400
450
500
IO [mA]
VB AT [ V]
SWREG Ef f icie n cy vs Io (V o =1.365V )
V BA T=3.6V
100
90
80
Ef ficien cy[ %]
70
60
50
40
30
20
10
0
0
50
100
150
200
250
300
350
400
450
500
IO[ mA]
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© 2011 ROHM Co., Ltd. All rights reserved.
11/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Reference data(Output stability)
4
4
4
3
3
2.5
2.5
2
OUT3 [V]
3
2.5
OUT2 [V]
OUT1 [V]
3.5
3.5
2
2
1.5
1.5
1.5
1
1
1
0.5
0.5
0.5
0
0
0
0
50
100
IO [mA]
150
0
200
4
50
100
IO [mA]
150
200
150
200
0
50
100
150
IO [mA]
200
250
300
4
LDO4 Load Regulation 1.80V
LDO5 Load Regulation 3.30V
3.5
3.5
3
3
2.5
2.5
OUT5 [V]
OUT4 [V]
LDO3 Load Regulation 3.0V
LDO2 Load Regulation 2.60V
LDO1 Load Regulation 1.20V
3.5
2
1.5
2
1.5
1
1
0.5
0.5
0
0
0
100
200
IO [mA]
300
400
0
50
100
IO [mA]
●Reference data(Input stability)
6
6
LDO1 Line Regulation 1.20V
5.5
5
VBAT
VBAT
4.5
3.5
3.5
3.5
OUT3 [V]
4
2.5
3
2.5
3
2.5
2
2
2
1.5
1.5
1.5
1
1
1
0.5
0.5
0.5
0
0
0
0.5
1
1.5
2
2.5
3
3.5
VBAT [V]
4
4.5
5
5.5
6
0
0
6
VBAT
4.5
4
OUT2 [V]
OUT1 [V]
5
4
3
LDO3 Line Regulation 3.0V
5.5
5
4.5
0.5
1
1.5
2
2.5
3
3.5
VBAT [V]
4
4.5
5
5.5
6
0
0.5
1
1.5
2
2.5
3
3.5
VBAT [V]
4
4.5
5
5.5
6
6
LDO4 Line Regulation 1.80V
5.5
LDO5 Line Regulation 3.30V
5.5
5
5
VBAT
4.5
4.5
4
4
3.5
3.5
OUT5 [V]
OUT4 [V]
6
LDO2 Line Regulation 2.60V
5.5
3
2.5
3
2.5
2
2
1.5
1.5
1
1
0.5
0.5
0
VUSB
0
0
0.5
1
1.5
2
2.5
3
3.5
VBAT [V]
4
4.5
5
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© 2011 ROHM Co., Ltd. All rights reserved.
5.5
6
0
0.5
1
1.5
2
2.5
3
3.5
VUSB [V]
12/16
4
4.5
5
5.5
6
2011.03 - Rev.A
Technical Note
BH6172GU
●Reference data(Load transient response)
LDO1
LDO2
IO
IO
IO
IO
LDO2
LDO1
LDO1
LDO2
LDO3
LDO4
IO
IO
IO
IO
LDO3
LDO3
LDO4
LDO4
LDO5
IO
IO
LDO5
LDO5
●Reference data(Rise time)
LDO1
LDO2
EN_LD1
EN_LD2
LDO1
LDO2
LDO3
LDO4
EN_LD3
EN_LD4
LDO3
LDO4
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
13/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Reference data(VBAT line transient response)
LDO1
VBAT
LDO1
LDO2
VBAT
VBAT
VBAT
LDO2
LDO4
LDO3
LDO3
LDO5
VUSB
LDO4
LDO5
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
14/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Notes for use
(1) Absolute maximum ratings
If applied voltage (VBAT, VADP, VUSB), operating temperature range (Topr), or other absolute maximum ratings are exceeded,
there is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is
those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection,
take measures such as externally placing a diode between the power supply and the power supply pin of the LSI.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance. When doing so, although the
digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog
power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the
wiring patterns. Similarly take pattern design into account for GND lines as well. Furthermore, for all power supply pins of
the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors,
determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for
various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm
that there are no pins for which the potential becomes less than a GND by actually including transition phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI.
If it is installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign
substance getting between pins or between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the LSI in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low
impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the inspection
process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the
power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take
appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being
applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than
the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage
to change. Take care that the GND wiring pattern of externally attached components also does not change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal shutdown circuit (TSD)
When the junction temperature becomes higher than a certain specific value, the thermal shutdown circuit operates and
turns the switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as
possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Rush Current
Extra care must be taken on power coupling, power, ground line impedance, and PCB design while excess amount of rush
current might instantly flow through the power line when powering-up a LSI which is equipped with several power supplies,
depending on on/off sequence, and ramp delays.
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© 2011 ROHM Co., Ltd. All rights reserved.
15/16
2011.03 - Rev.A
Technical Note
BH6172GU
●Ordering part number
B
H
6
Part No.
1
7
2
G
Part No.
U
-
Package
GU: VCSP85H2
E
2
Packaging and forming specification
E2: Embossed tape and reel
VCSP85H2(BH6172GU)
<Tape and Reel information>
0.25± 0.1
1.0MAX
2.60±0.05
1PIN MARK
2.60±0.05
3000pcs
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.3± 0.05
0.06 S
0.05 A B
Embossed carrier tape
Quantity
Direction
of feed
S
24- φ 0.3±0.05
Tape
A
(φ0.15)INDEX POST
B
D
C
B
A
1
0.3±0.05
2
3 4
P=0.5 × 4
E
1pin
5
P=0.5×4
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
(Unit : mm)
Reel
16/16
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.03 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001