Datasheet Gate Driver Providing Galvanic isolation Series Isolation voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation BM60054FV-C Key Specifications General Description The BM60054FV-C is a gate driver with isolation voltage 2500Vrms, I/O delay time of 110ns, and a minimum input pulse width of 90ns. Fault signal output function, ready signal output function, under voltage lockout (UVLO) function, short current protection (SCP) function, and switching controller function are all built-in. Package Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Isolation Voltage: Maximum Gate Drive Voltage: I/O Delay Time: Minimum Input Pulse Width: SSOP-B28W 2500Vrms 20V(Max) 110ns(Max) 90ns(Max) W(Typ) x D(Typ) x H(Max) 9.2 mm x 10.4 mm x 2.4 mm Provides Galvanic Isolation Fault Signal Output Function Ready Signal Output Function Under Voltage Lockout Function Short Circuit Protection Function Soft Turn-Off Function for Short Circuit Protection (Adjustable Turn-OFF time) Thermal Protection Function Active Miller Clamping Switching Controller Function Output State Feedback Function UL1577 Recognized:File No. E356010 AEC-Q100 Qualified(Note 1) (Note 1:Grade1) Applications ■ ■ Driving IGBT Gate Driving MOSFET Gate Typical Application Circuit Figure 1. Typical Application Circuit ○Product structure：Silicon integrated circuit .www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Contents General Description ...................................................................................................................................................................... 1 Features ......................................................................................................................................................................................... 1 Applications .................................................................................................................................................................................. 1 Key Specifications ........................................................................................................................................................................ 1 Package W(Typ) x D(Typ) x H(Max) ....................................................................................................................................... 1 Typical Application Circuit ........................................................................................................................................................... 1 Contents ........................................................................................................................................................................................ 2 Recommended Range of External Constants……………………………………………………………………………………………3 Pin Configuration .......................................................................................................................................................................... 3 Pin Descrlptions ........................................................................................................................................................................... 3 Absolute Maximum Ratings ......................................................................................................................................................... 4 Recommended Operating Conditions ........................................................................................................................................ 4 Insulation Related Characteristics .............................................................................................................................................. 4 Electrical Characteristics ............................................................................................................................................................. 5 Electrical Characteristics – continued ........................................................................................................................................ 6 Typical Performance Curves ........................................................................................................................................................ 7 Figure 3. Main Power Supply Circuit Current…………………………………………………………………………………………7 Figure 4. Output Side Circuit Current(MODE=H, VEE2=0V, OUT1=L)…………………………………………………………….7 Figure 5. Output Side Circuit Current(MODE=H, VEE2=0V, OUT1=H)…………………………………………………………….7 Figure 6. FET_G ON-Resistance(Source side/Sink side)…………………………….……………………..………………………7 Figure 7. Oscillation Frequency………...……………………………………….………………………………………………………8 Figure 8. Soft-start Time…………………………………………………………………………………….…………………….….......8 Figure 9. FB Pin Threshold Voltage……………………………………………………………………….…………………………....8 Figure 10. COMP Pin Sink Current………………………………………………………………………………...…………….……...8 Figure 11. COMP Pin Source Current………………………………………………………………………......................................9 Figure 12. Over-Current Detection Threshold…..……………………………………………………………………………...……..9 Figure 13. Logic Input Filtering Time(L pulse)………………………………………………...……………………………………...9 Figure 14. Logic Input Filtering Time(H pulse)…………………………………………………………………………………….….9 Figure 15. ENA Input Filtering Time………………………………………………..……………………….....................................10 Figure 16. MODE Input Voltage H/L…………………………………………………………….……………………………..……….10 Figure 17. OUT1H ON-Resistance(IOUT1=40mA).………………………………….…………………………………….………...10 Figure 18. OUT1L ON-Resistance(IOUT1=40mA)…………………………………………………...………………………………10 Figure 19. PROOUT ON-Resistance(IPROOUT=40mA) ……………………………………………………………………………11 Figure 20. Turn ON time……………………………………….………………………………………………..……….….…………...11 Figure 21. Turn OFF time……………………………………………………………………………………………….……........…….11 Figure 22. OUT2 ON-Resistance(IOUT2=40mA)…………………………………………………………………..……………...….11 Figure 23. Short Current Detection Threshold Voltage……………………………………………………………..……………..12 Figure 24. DESAT Leading Edge Blanking Time…………………………………………………………………………………....12 Figure 25. Short Current Detection Filter Time………………..…………………………….………………….…………………..12 Figure 26. Short Current Detection Delay Time…………………………………………….………………….…………………...12 Figure 27. SCPIN Low Voltage………………….………………………………………………..……………….……..…………….13 Figure 28. Output Delay Difference between PROOUT and FLT………………………………….……………………….….....13 Figure 29. Thermal Detection Voltage…………………………………………………………………………..……...……………..13 Application Information.............................................................................................................................................................. 14 Description of Functions and Examples of Constant Setting…………………………………………………………………..…..16 Selection of Components Externally Connected ..................................................................................................................... 27 Power Dissipation ....................................................................................................................................................................... 27 Thermal Design ........................................................................................................................................................................... 27 I/O Equivalence Circuits ............................................................................................................................................................. 28 Operational Notes…………………………………………………………………………………………………………………………...32 Ordering Information…………………………………………………………………………………………………………………33 Marking Diagram………….…………………………………………………………………………………………………………………33 Physical Dimension, Tape and Reel Information ..................................................................................................................... 34 Revision History ......................................................................................................................................................................... 35 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Recommended Range of External Constants Pin Name Symbol VREG Recommended Value Unit Min Typ Max CVREG 1.0 3.3 10.0 µF VCC2 CVCC2 0.33 - - µF RT RRT 24 68 150 kΩ Pin Configuration (TOP VIEW) VEE2 1 PROOUT 2 VTSIN 3 SCPIN 4 NC 5 GND2 6 MODE 7 UVLOIN 8 VCC2 9 28 8 27 8 26 8 25 8 24 8 23 8 22 8 21 8 20 8 19 8 9 18 8 17 8 16 8 15 8 NC 10 OUT1H 11 1 OUT1L 12 OUT2 13 VEE2 14 GND1 SENSE FET_G VREG V_BATT COMP FB RT RDY INB INA ENA FLT GND1 Pin Descrlptions 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin Name VEE2 PROOUT VTSIN SCPIN NC GND2 MODE UVLOIN VCC2 NC OUT1H OUT1L OUT2 VEE2 GND1 FLT ENA INA INB RDY RT FB COMP V_BATT VREG FET_G SENSE GND1 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Pin Function Output-side negative power supply pin Soft turn-off pin / Gate voltage input pin Thermal detection pin Short circuit current detection pin No connection Output-side ground pin Mode selection pin of output-side UVLO Output-side UVLO setting pin Output-side positive power supply pin No connection Source side output pin Sink side output pin Output pin for Miller Clamp Output-side negative power supply pin Input-side ground pin Fault output pin Input enabling signal pin Control input pin A Control input pin B Ready output pin Switching frequency setting pin for switching controller Error amplifier inverting input pin for switching controller Error amplifier output pin for switching controller Main power supply pin Input-side internal power supply pin MOS FET control pin for switching controller Current detection pin for switching controller Input-side ground pin 3/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Absolute Maximum Ratings Parameter Main Power Supply Voltage Output-Side Positive Supply Voltage Symbol Limit Unit VBATT -0.3 to +40.0(Note 2) V VCC2 +24.0(Note 3) V +0.3(Note 3) V -0.3 to Output-Side Negative Supply Voltage VEE2 Maximum Difference Between Output-Side Positive and Negative Voltages VMAX2 30.0 V VIN -0.3 to +7.0(Note 2) V VMODE -0.3 to +VCC2+0.3 or +24.0(Note 3) V VSCPIN -0.3 to +VCC2+0.3 or +24.0(Note 3) V -0.3 to +VCC2+0.3 or +24.0(Note 3) V VUVLOIN -0.3 to +VCC2+0.3 or +24.0(Note 3) V IOUT1PEAK 5.0(Note 4) A IOUT2PEAK 5.0(Note 4) A IPROOUTPEA 2.5(Note 4) A K IFLT 10 mA IFET_GPEAK 1 A Pd 1.12(Note 5) W Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Tjmax +150 °C INA, INB, ENA Pin Input Voltage MODE Pin Input Voltage SCPIN Pin Input Voltage VTSIN Pin Input Voltage -15.0 to VVTS UVLOIN Pin Input Voltage OUT1H, OUT1L Pin Output Current (Peak 10μs) OUT2 Pin Output Current (Peak 10μs) PROOUT Pin Output Current (Peak 10μs) FLT, RDY Pin Output Current FET_G Pin Output Current (Peak 1μs) Power Dissipation Junction Temperature (Note 2) Relative to GND1 (Note 3) Relative to GND2 (Note 4) Should not exceed Pd and Tj=150C (Note 5) Derate above Ta=25C at a rate of 9.5mW/C. Mounted on a glass epoxy of 70 mm 70 mm 1.6 mm Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Min Max Unit Main Power Supply Voltage(Note 6) VBATT 4.0 32 V Output-Side Positive Supply Voltage(Note 7) VCC2 10 20 V VEE2 -12 0 V VMAX2 10 28 V fSWR 100 500 kHz Output-Side Negative Supply Voltage(Note 7) Maximum Difference Between Output-Side Positive and Negative Voltages Switching frequency for switching controller (Note 6) Relative to GND1 (Note 7) Relative to GND2 Insulation Related Characteristics (UL1577) Parameter Symbol Characteristic Unit RS >109 Ω Insulation Withstand Voltage / 1min VISO 2500 Vrms Insulation Test Voltage / 1sec VISO 3000 Vrms Insulation Resistance (VIO=500V) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, VBATT=4.0V to 32V, VCC2=UVLO to 20V, VEE2=-12V to 0V) Parameter Symbol Min Typ Max Unit Conditions General Main Power Supply 1.1 1.6 2.1 IBATT1 mA V_BATT=4.0V Circuit Current 1 Main Power Supply 0.8 1.3 1.8 IBATT2 mA V_BATT=12.0V Circuit Current 2 Main Power Supply 0.8 1.3 1.8 IBATT3 mA V_BATT=32.0V Circuit Current 3 0.7 1.4 2.1 Output Side Circuit Current 1 ICC21 mA VCC2=14V, OUT1=L 0.4 1.1 1.8 Output Side Circuit Current 2 ICC22 mA VCC2=14V, OUT1=H 0.8 1.5 2.2 Output Side Circuit Current 3 ICC23 mA VCC2=18V, OUT1=L Output Side Circuit Current 4 ICC24 0.8 1.2 1.9 mA Output Side Circuit Current 5 ICC25 0.9 1.6 2.3 mA Output Side Circuit Current 6 ICC26 0.6 1.3 2.0 mA VCC2=16V, VEE2=-8V, OUT1=H FET_G Output Voltage H1 VFETGH1 3.8 4.0 4.2 V 4.2V<V_BATT≤32V IFET_G=0A(open) FET_G Output Voltage H2 VFETGH2 - V_BATT-0.2 V_BATT V V_BATT ≤ 4.2V IFET_G =0A(open) FET_G Output Voltage L FET_G ON-Resistance (Source-side) FET_G ON-Resistance (Sink-side) VFETGL 0 - 0.3 V IFET_G =0A(open) RONGH 3 6 12 Ω 10mA RONGL 0.3 0.6 1.3 Ω 10mA Oscillation Frequency Soft-start Time fSW tSS 182 - 200 - 222 50 kHz ms FB Pin Threshold Voltage FB Pin Input Current VFB IFB 1.47 -0.8 1.50 0 1.53 0.8 V µA COMP Pin Sink Current COMP Pin Source Current ICOMPSINK ICOMPSOURCE -160 40 -80 80 -40 160 µA µA V_BATT UVLO ON Voltage V_BATT UVLO Hysteresis VUVLOBATTL VUVLOBATTHYS 3.20 0.07 3.40 0.1 3.60 0.13 V V DONMAX VOVTH 1.60 48 1.65 1.70 % V VUVTH 1.23 1.30 1.37 V VOCTH 0.17 0.20 0.23 tDCDCRLS 20 40 60 V ms Logic High Level Input Voltage VINH 2.0 - 5.5 V INA, INB, ENA Logic Low Level Input Voltage Logic Pull-Down Resistance VINL RIND 0 25 50 0.8 100 V kΩ INA, INB, ENA INA, INB, ENA Logic Input Filtering Time ENA Input Filtering Time tINFIL tENAFIL - 0.5 90 0.8 ns µs INA, INB ENA MODE Low Level Input Voltage MODE High Level Input Voltage VMODEL VMODEH 0 0.7×VCC2 - 0.3×VCC2 VCC2 V V MODE, relative to GND2 MODE,relative to GND2 VCC2=18V, OUT1=H VCC2=16V, VEE2=-8V, OUT1=L Switching Power Supply Controller Maximum ON DUTY Over Voltage Detection Threshold Under Voltage Detection Threshold Over-Current Detection Threshold Protection Holding Time Logic Block www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/35 RT=68kΩ TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Electrical Characteristics – continued (Unless otherwise specified Ta=-40°C to +125°C, VBATT=4.0V to 32V, VCC2=UVLO to 20V, VEE2=-12V to 0V) Parameter Symbol Min Typ Max Unit Conditions Output IOUT1H=40mA OUT1H ON-Resistance RONH 0.50 0.85 1.45 Ω OUT1L ON-Resistance RONL 0.25 0.45 0.80 Ω IOUT1L=40mA VCC2=15V 3.0 4.5 OUT1 Maximum Current IOUT1MAX A Design assurance 0.45 0.85 1.55 IPROOUT=40mA PROOUT ON-Resistance RONPRO Ω Turn ON Time tPONA 45 75 105 ns INA=PWM, INB=L tPONB 50 80 110 ns INA=H, INB=PWM tPOFFA 40 70 100 ns INA=PWM, INB=L tPOFFB tPDISTA 35 -25 65 -5 95 15 ns ns INA=H, INB=PWM tPOFFA – tPONA -35 - -15 50 5 - ns ns tPOFFB – tPONB Rise Time tPDISTB tRISE Fall Time OUT2 ON-Resistance tFALL RON2 0.25 50 0.45 0.80 ns Ω Design assurance IOUT2=40mA VOUT2ON CM 1.8 100 2 - 2.2 - V kV/μs Relative to VEE2 Design assurance VUVLOINL 0.85 0.90 0.95 V UVLOIN, MODE=L 0.11× VUVLOINL 11.5 0.12× VUVLOINL 12.1 V UVLOIN, MODE=L VUVLO2L 0.10× VUVLOINL 10.9 V VCC2, MODE=H VUVLO2HYS tUVLO2FIL 0.8 0.25 1.2 1.5 1.6 3.7 V µs VCC2, MODE=H DESAT Leading Edge Blanking Time tDESATleb 0.14 0.20 0.26 µs Design assurance Short Current Detection Voltage VSCDET 0.50 0.2 0.53 0.28 Relative to GND2 tSCPFIL 0.47 0.12 V Short Current Detection Filter Time µs tSCPPRO 0.26 0.38 0.50 µs SCPIN Pin Low Voltage VSCPINL - 0.1 0.22 V Output Delay Difference between PROOUT and FLT tPROFLT 0.1 0.4 0.7 µs Thermal Detection Voltage Thermal Detection Filter Time VTSDET tTSFIL 1.61 4 1.70 10 1.79 30 V µs tSTO VFLTL 30 - 0.18 110 0.40 µs V IFLT=5mA VOSFBH 4.5 5.0 5.5 V Relative to GND2 VOSFBL 4.0 4.5 5.0 V Relative to GND2 tOSFBFIL 1.5 2.0 2.5 µs VRDYL - 0.18 0.40 V Turn OFF Time Propagation Distortion OUT2 ON Threshold Voltage Common Mode Transient Immunity Protection Functions Output-side UVLO ON Threshold Voltage Output-side UVLO Threshold Hysteresis Output-side UVLO ON Voltage Output-side UVLO Hysteresis Output-side UVLO Filtering Time Short Current Detection Delay Time (PROOUT) Soft Turn Off Release Time FLT Output Low Voltage Gate State H Detection Threshold Voltage Gate State L Detection Threshold Voltage OSFB Output Filtering Time RDY Output Low Voltage INA VUVLOINHYS 50% 10nF between OUT1-VEE2 ISCPIN=1mA Relative to GND2 IRDY=5mA 50% tPON tPOFF OUT1H/L 10% 90% 50% 90% tFALL tRISE 50% 10% Figure 2. INA-OUT1H/L Timing Chart www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Typical Performance Curves 2.2 2 2 25°C 1.8 1.6 1.4 ICC2 [mA] IBATT [mA] 1.8 125°C 25°C 1.6 1.4 1.2 1 1.2 -40°C 0.8 1 0.6 -40°C 0.8 4 0.4 11 18 25 10 32 15 20 VCC2 [V] VBATT [V] Figure 4. Output Side Circuit Current (MODE=H, VEE2=0V, OUT1=L) Figure 3. Main Power Supply Circuit Current 12 2.2 2 Source side 25°C 1.6 RONGH /RONGL[Ω] 1.8 ICC2 [mA] 125°C 125°C 1.4 1.2 1 0.8 9 6 3 Sink side -40°C 0.6 0.4 0 10 15 20 VCC2 [V] 0 40 80 120 Ta [°C] Figure 5. Output Side Circuit Current (MODE=H, VEE2=0V, OUT1=H) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 7/35 Figure 6. FET_G ON-Resistance (Source side/Sink side) TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C 500 50 40 tSS [ms] fSW [kHz] 400 300 30 20 200 10 100 0 20 40 60 0 80 100 120 140 -40 0 RRT [kΩ] 1.52 -60 1.51 -80 ICOMPSINK [μA] VFB [V] -40 1.5 1.49 -100 -120 1.48 -140 1.47 -160 40 80 120 -40 0 40 80 120 Ta [°C] Ta [°C] Figure 9. FB Pin Threshold Voltage www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 120 Figure 8. Soft-start Time 1.53 0 80 Ta [°C] Figure 7. Oscillation Frequency -40 40 Figure 10. COMP Pin Sink Current 8/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C 160 0.23 0.21 120 Vocth[V] ICOMPSOURCE [μA] 140 100 0.19 80 60 0.17 40 -40 0 40 80 -40 120 0 80 120 Ta [°C] Ta [°C] Figure 11. COMP Pin Source Current Figure 12. Over-Current Detection Threshold 75 75 50 50 tINFIL [ns] tINFIL [ns] 40 25 25 0 -40 0 40 80 120 Ta [°C] 4 11 18 25 32 Ta [°C] Figure 13. Logic Input Filtering Time (L pulse) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 9/35 Figure 14. Logic Input Filtering Time (H pulse) TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 1 9 0.8 8.8 VMODEH/L [V] tENAFIL [µs] BM60054FV-C 0.6 0.4 VMODEH 8.6 8.4 VMODEL 0.2 8.2 0 8 -40 0 40 80 120 -40 0 40 Ta [℃] Figure 16. MODE Input Voltage H/L 1.2 1 1 0.8 0.8 RONL [Ω] RONH [Ω] 1.2 0.6 0.6 0.4 0.4 0.2 0.2 0 0 0 40 80 120 -40 0 40 80 120 Ta [℃] Ta [℃] Figure 17. OUT1H ON-Resistance (IOUT1=40mA) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 120 Ta [℃] Figure 15. ENA Input Filtering Time -40 80 Figure 18. OUT1L ON-Resistance (IOUT1=40mA) 10/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C 105 1.45 1.25 tPONA [ns] RONPRO [Ω] 85 1.05 0.85 65 0.65 0.45 45 -40 0 40 80 120 -40 0 Ta [℃] 40 80 120 Ta [℃] Figure 19. PROOUT ON-Resistance (IPROOUT=40mA) Figure 20. Turn ON time 100 0.65 tPONA [ns] RONPRO [Ω ] 80 60 0.45 0.25 40 -40 0 40 80 120 0 40 80 120 Ta [°C] Ta [℃] Figure 21. Turn OFF time www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 Figure 22. OUT2 ON-Resistance (IOUT2=40mA) 11/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 0.53 0.26 0.52 0.24 0.51 0.22 tDESATleb [μs] VSCDET [V] BM60054FV-C 0.5 0.49 0.2 0.18 0.16 0.48 0.47 0.14 -40 0 40 80 120 -40 0 Ta [°C] 80 120 Ta [°C] Figure 23. Short Current Detection Voltage Figure 24. DESAT Leading Edge Blanking Time 0.28 0.5 0.24 0.44 tSCPPRO [μs] tSCPFIL [ns] 40 0.2 0.38 0.32 0.16 0.26 0.12 -40 0 40 80 120 0 40 80 120 Ta [°C] Ta [°C] Figure 25. Short Current Detection Filter Time www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 Figure 26. Short Current Detection Delay Time 12/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C 0.7 0.2 0.5 tPROFLT [µs] VSCPINL [V] 0.15 0.1 0.3 0.05 0.1 0 -40 0 40 80 120 Ta [°C] -40 0 40 80 120 Ta [°C] Figure 28. Output Delay Difference between PROOUT and FLT Figure 27. SCPIN Pin Low Voltage 1.77 VTSDET [V] 1.73 1.69 1.65 1.61 -40 0 40 80 120 Ta [°C] Figure 29. Thermal Detection Voltage www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Application Information 1. Description of Pins and Cautions on Layout of Board (1) V_BATT (Main Power Supply Pin) This is the main power supply pin. Connect a bypass capacitor between V_BATT and GND1 in order to suppress voltage variations. (2) GND1 (Input-side Ground Pin) The GND1 pin is a ground pin on the input side. (3) VCC2 (Output-side Positive Power Supply Pin) The VCC2 pin is a positive power supply pin on the output side. To reduce voltage fluctuations due to OUT1H/L pin output current and due to the driving current of the internal transformers, connect a bypass capacitor between VCC2 and GND2 pins. (4) VEE2 (Output-side Negative Power Supply Pin) The VEE2 pin is a power supply pin on the output side. To suppress voltage fluctuations due to OUT1H/L pin output current and due to the driving current of the internal transformers, connect a bypass capacitor between the VEE2 and the GND2 pins. Connect the VEE2 pin to the GND2 pin when no negative power supply is used, (5) GND2 (Output-side Ground Pin) The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter / source of a power device. (6) INA,INB,ENA (Control Input Terminal) The INA,INB,ENA are pins used to determine output logic. ENA INB INA L X X H H X H L L H L H OUT1H Hi-Z Hi-Z Hi-Z H OUT1L L L L Hi-Z Fault state(FLT=L output) is released in rising of ENA(L→ H). (7) FLT (Fault Output Pin) The FLT pin is an open drain pin used to output a fault signal when short circuit protection function (SCP) or thermal protection function is activated, and will be cleared at the rising edge of FLT. Status FLT While in normal operation When a fault occurs (When SCP or thermal protection is activated) Hi-Z L (8) RDY (Ready Output Pin) The RDY pin shows the status of three internal protection features which are V_BATT UVLO, VCC2 UVLO, and output state feedback (OSFB). The term ‘output state feedback’ shows whether PROOUT pin voltage (High or Low) corresponds to input logic or not. Status RDY While in normal operation Hi-Z V_BATT UVLO or VCC2 UVLO or Output state feedback L (9) MODE (Mode Selection Pin of Output-side UVLO) The MODE pin is a pin which selects internal threshold or external setting threshold for output-side UVLO. MODE Output-side UVLO threshold voltage L (=GND2) Setting by external. (Use UVLOIN pin) H (=VCC2) Fixed (=VUVLO2L). (Connect UVLOIN pin to VCC2 pin) (10) UVLOIN (Output-side UVLO Setting Input Pin) The UVLOIN pin is a pin for deciding UVLO setting value of VCC2. The threshold value of UVLO can be set by dividing the resistance voltage of VCC2 and inputting such value. UVLOIN activates only at MODE pin=L. When MODE pin=H, connect UVLOIN pin to VCC2 pin. (11) OUT1H, OUT1L(Output Pin) The OUT1H pin is a source side pin used to drive the gate of a power device, and the OUT1L pin is a sink side pin used to drive the gate of a power device. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (12) OUT2 (Miller Clamp Pin) This is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element connected to OUT1. It also functions as a pin for monitoring gate voltage for miller clamp and OUT2 pin voltage become not more than VOUT2ON(typ 2.0V), miller clamp function operates. OUT2 should be connect to VEE2 when miller clamp function is not used. (13) PROOUT (Soft Turn-OFF Pin) This is a pin for soft turn-OFF of output pin when short-circuit protection is in action. It also functions as a pin for monitoring gate voltage for output state feedback function. (14) SCPIN(Short Circuit Current Detection Pin) The SCPIN pin is a pin used to detect current for short circuit protection. When the SCPIN pin voltage exceeds VSCDET,SCP function will be activated. This may cause the IC to malfunction in an open state. To avoid such trouble, short-circuit the SCPIN pin to the GND2 pin when the short circuit protection is not used. In order to prevent the wrong detection due to noise, the noise filter time tSCPFIL is set. (15) VTSIN (Thermal Detection Pin) The VTSIN pin is a temperature sensor voltage input pin, which can be used for thermal protection of an output device. If VTSIN pin voltage becomes VTSDET or less, OUT1H/L pin is set to HiZ/L. IC may malfunction in the open status, so be sure to supply the VTSPIN more than VTSDET if the thermal protection function is not used. In order to prevent the wrong detection due to noise, the noise mask time tTSMSK is set. In addition, it can be used also as compulsive shutdown terminal other than a temperature sense by inputting a comparator output etc. (16) RT (Switching Frequency Setting Pin for Switching Controller) The RT pin is a pin used to make setting of switching frequency of switching controller. The switching frequency is determined by the resistance value connected between RT and GND1. The value of switching frequency is determined by the value of the resistor RRT. FSW kHz 1 /( 7.3 108 RRT 2.2 104 ) (17) FB (Error Amplifier Inverting Input Pin for Switching Controller) This is a voltage feedback pin of the switching controller. This pin combine with voltage monitoring at overvoltage protection function and under voltage protection function for switching controller. When overvoltage or under voltage protection is activated, switching controller will be at OFF state (FET_G pin outputs Low). When the protection holding time (tDCDCRLS) is completed, the protection function will be released. Under voltage function is not activated during soft-start. (18) COMP (Error Amplifier Output Pin for Switching Controller) This is the gain control pin of the switching controller. Connect a phase compensation capacitor and resistor. (19) VREG (Input-side internal power supply pin) This is the input-side internal power supply pin. Be sure to connect a capacitor between VREG and GND1 even when the switching controller is not used, in order to prevent oscillation and suppress voltage variation due to FET_G output current. (20) FET_G (MOS FET Control Pin for Switching Controller) This is a MOSFET control pin for the switching controller transformer drive. (21) SENSE (Connection to the Current Feedback Resistor of the Switching Controller) This is a pin connected to the resistor of the switching controller current feedback. This pin combines with current monitoring at overcurrent protection function for switching controller. When overcurrent protection is activated, switching controller will be at OFF state (FET_G pin outputs Low). When the protection holding time (tDCDCRLS) is completed, the over-current function will be released. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C 2. Description of Functions and Examples of Constant Setting (1) Miller Clamp Function When OUT1=L and PROOUT pin voltage < VOUT2ON, internal MOS of OUT2 pin is turned ON and miller clamp function operates. IN L OUT2 pin input voltage Not more than VOUT2ON H OUT2 L X Hi-Z VCC2 PREDRIV ER OUT1H/L PREDRIV ER PROOUT LOGIC PREDRIV ER OUT2 PREDRIV ER GND2 + - VOUT2ON VEE2 Figure 30. Block Diagram of Miller Clamp Function H ENA L H INA L VTSDET VTSIN VSCDET SCPIN Hi-Z FLT L H Hi-Z L OUT1H/L OUT2 VOUT2ON tPON tSTO tSTO Figure 31. Timing Chart of Miller Clamp Function www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (2) Under Voltage Lockout (UVLO) Function The BM60054FV-C incorporates the under voltage lockout (UVLO) function on V_BATT and VCC2. When the power supply voltage drops to the UVLO ON voltage, the OUT1H/L pin will output the "Hi-Z / L" and the FLT pin will output the “L” signal. When the power supply voltage rises to the UVLO OFF voltage, these pins will be reset. In addition, to prevent mis-triggers due to noise, mask time tUVLOBATTFIL and tUVLO2FIL are set on both voltage sides. H L INA VUVLOBATTH VUVLOBATTL V_BATT Hi-Z L H L H L RDY OUT1H/L FET_G Figure 32. VBATT UVLO Function Operation Timing Chart H L INA VUVLOINH VUVLOINL UVLOIN Hi-Z L H L H L RDY OUT1H/L FET_G Figure 33. VCC2 UVLO Function Operation Timing Chart (MODE=L) H L INA VUVLO2H VUVLO2L VCC2 Hi-Z L H L H L RDY OUT1H/L FET_G Figure 34. VCC2 UVLO Function Operation Timing Chart (MODE=H) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (3) Short Circuit Protection Function (SCP) When the SCPIN pin voltage exceeds VSCDET, the SCP function will be activated. When the SCP function is activated, the OUT1H/L pin voltage will be set to the “Hi-Z/Hi-Z” level and the PROOUT pin voltage will go to the “L” level first (soft turn-OFF). Next, After tSTO has passed, OUT1H/L pin become Hi-Z/L (PROOUT pin hold L). In addition, when OUT2 pin voltage < VOUT2ON, miller clamp function operates. When the rising edge is put in the ENA pin, the SCP function will be released. When OUT1H/L=Hi-Z/L or Hi-Z/Hi-Z, internal MOSFET connected to SCPIN pin turns ON to discharge CBLANK for desaturation protection function. When OUT1H/L=H/Hi-Z, internal MOSFET connected to SCPIN pin turns OFF. R3 R 2 VFD1 R3 R3 R 2 R1 VCC 2 MIN V VSCDET R3 R 2 R1 R3 R 2 R1 VSCDET t BLANKouternals R3 CBLANK ln(1 ) t DESATleb R3 R 2 R1 R3 VCC 2 VDESAT V VSCDET VDESAT 設定参考値 R1 R2 R3 4.0V 15 kΩ 39kΩ 4.7kΩ 4.5V 15 kΩ 47kΩ 5.1kΩ 5.0V 15 kΩ 51kΩ 5.1kΩ 5.5V 15 kΩ 27kΩ 2.4kΩ 6.0V 15 kΩ 33kΩ 2.7kΩ 6.5V 15 kΩ 62kΩ 4.7kΩ 7.0V 15 kΩ 47kΩ 3.3kΩ 7.5V 15 kΩ 20kΩ 1.3kΩ 8.0V 15 kΩ 82kΩ 5.1kΩ 8.5V 15 kΩ 62kΩ 3.6kΩ 9.0V 15 kΩ 33kΩ 1.8kΩ 9.5V 15 kΩ 75kΩ 3.9kΩ 10.0V 15 kΩ 68kΩ 3.3kΩ www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C VCC2 OUT1H/L FLT LOGIC PROOUT SCPIN FLT SCPFIL + VSCDET GND1 GND2 VEE2 Figure 35. Block Diagram of Short Circuit Protection VCC2 OUT1H/L FLT R1 LOGIC D1 PROOUT R2 SCPIN FLT SCPFIL + R3 VSCDET GND1 GND2 VEE2 Figure 36. Block Diagram of DESAT www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C H L IN tSCPFIL tSCPRO tSCPFIL tSCPRO VSCDET SCPIN OUT1H/L H Hi-Z L PROOUT Hi-Z L Hi-Z L FLT tSTO tSTO H ENA L >tENAFIL >tENAFIL Figure 37. SCP Operation Timing Chart Start VSCPIN>VSCDET No OUT1H/L=Hi-Z / L, PROOUT=L, OUT2=L Yes Exceed filter time No Yes ENA=L→ H OUT1H/L=Hi-Z / Hi-Z, PROOUT=L, FLT=L, OUT2=HiZ OUT2<VOUT2ON No Yes No FLT=Hi-Z Yes OUT2=L IN=H No Yes Exceed tSTO No OUT1H/L=H / Hi-Z, PROOUT=Hi-Z, OUT2=HiZ Yes Figure 38. SCP Operation Status Transition Diagram www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (4) Thermal Protection Function When the VTSIN pin voltage becomes VTSDET or less, the thermal protection function will be activated. When the thermal protection function is activated, the OUT1H/L pin voltage will be set to the “Hi-Z/Hi-Z” level and the PROOUT pin voltage will go to the “L” level first (soft turn-OFF). Next, when the VTSIN pin voltage rises to the threshold value and after tSTO has passed, OUT1H/L pin become Hi-Z/L (PROOUT pin hold L). In addition, when OUT2 pin voltage < VOUT2ON, miller clamp function operates. When the rising edge is put in the ENA pin, the thermal protection function will be released. VCC2 OUT1H/L FLT LOGIC PROOUT FLT TSFIL + VTSDET GND1 VTSIN SENSOR GND2 VEE2 Figure 39. Block Diagram of thermal protection function www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C H L IN tTSFIL tTSFIL VTSIN VTSDET OUT1H/L H Hi-Z L PROOUT Hi-Z L Hi-Z L FLT tSTO tSTO H ENA L >tENAFIL >tENAFIL Figure 40. Thermal Protection Function Operation Timing Chart START VTSIN>VTSDET No Yes Exceed filter time No OUT1H/L=Hi-Z / L, PROOUT=L, OUT2=L Yes OUT1H/L=Hi-Z / Hi-Z, PROOUT=L, FLT=L, OUT2=HiZ ENA=L→H No Yes OUT2<VOUT2ON No FLT=Hi-Z Yes VTSIN<VTSDET No IN=H Yes No Yes OUT2=L OUT1H/L=H / Hi-Z, PROOUT=Hi-Z, OUT2=HiZ Exceed tSTO No Figure 41. Thermal Protection Function Operation Status Transition Diagram www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (5) Switching Controller (a) Basic action This IC has a built-in switching power supply controller which repeats ON/OFF synchronizing with internal clock set by RT pin. When VBATT voltage is supplied (VBATT > VUVLOBATTH), FET_G pin starts switching by soft-start. Output voltage is determined by the following equation by external resistance and winding ratio “n” of flyback transformer (n= VOUT2 side winding number/VOUT1 side winding number) VOUT 2 VFB R1 R 2 / R 2 n V (b) MAX DUTY When, for example, output load is large, and voltage level of SENSE pin does not reach current detection level, output is forcibly turned OFF by Maximum On Duty (DONMAX). (c) Protection function The switching controller has protection function as overvoltage protection (OVP), under voltage protection (UVP), and over-current protection (OCP). OVP and UVP monitor the voltage of FB pin, OCP monitor the voltage of SENSE pin. When the protection function is activated, switching controller will be OFF state (FET_G pin outputs Low). The protection holding time (tDCDCRLS) is completed, the protection function will be released. Under voltage function is not activated during soft-start. VOUT1 RT OSC R1 - FB VFB R2 UVLO_BATT + OVP COMP VOUT2 UVP Maxduty V_BATT VREG VREG R Q FET_G S SENSE + COMP OSC VFB Slope OC GND1 Softstart Figure 42. Block Diagram of switching controller www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (d)The pin handling when not using switching controller When not using switching controller, please do pin handling as follows. pin no. pin name 21 RT 22 FB 23 COMP 24 V_BATT 25 VREG 26 FET_G 27 SENSE RT processing method pull down in gnd1 by 68kΩ connect to VREG connect to VREG connect power supply connect capacitor open connect to VREG OSC - FB VFB UVLO_BATT + OVP COMP UVP Maxduty V_BATT VREG VREG R Q FET_G S SENSE GND1 + COMP OSC VFB Slope OC Softstart Figure 43. The pin handling when not using switching controller (6) Gate State Monitoring Function When gate logic and input logic of output device monitored with PROOUT pin are compared, a logic L is output from RDY pin when they disaccord. In order to prevent the detection error due to delay of input and output, OSFB filter time tOSFBFIL is provided. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (7) I/O Condition Table Input No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Output I N A O U T 2 P R O O U T O U T 1 H O U T 1 L O U T 2 P R O O U T F L T R D Y L H H X Hi-Z Hi-Z Hi-Z L L Hi-Z H L H L X Hi-Z Hi-Z L L L Hi-Z H X X X H H Hi-Z L Hi-Z Hi-Z Hi-Z L L H X X X L L Hi-Z L L Hi-Z Hi-Z L UVLO L H X X X H H Hi-Z L Hi-Z Hi-Z Hi-Z L ○ UVLO L H X X X L L Hi-Z L L Hi-Z Hi-Z L ○ ○ L L X X X H X Hi-Z Hi-Z Hi-Z L L Hi-Z ○ ○ L L X X X L X Hi-Z Hi-Z L L L Hi-Z ○ ○ L H L X X H H Hi-Z L Hi-Z Hi-Z Hi-Z L ○ ○ L H L X X L L Hi-Z L L Hi-Z Hi-Z Hi-Z ○ ○ L H H H X H H Hi-Z L Hi-Z Hi-Z Hi-Z L ○ ○ L H H H X L L Hi-Z L L Hi-Z Hi-Z Hi-Z Normal Operation L Input ○ ○ L H H L L H H Hi-Z L Hi-Z Hi-Z Hi-Z L ○ ○ L H H L L L L Hi-Z L L Hi-Z Hi-Z Hi-Z Normal Operation H Input ○ ○ L H H L H H H H Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z ○ ○ L H H L H L L H Hi-Z Hi-Z Hi-Z Hi-Z L Status SCP UVLO_VBATT UVLO_VCC2 Thermal protection Disable INB active V B A T T V C C 2 S C P I N V T S I N E N A I N B ○ ○ H H H ○ ○ H H UVLO ○ L UVLO ○ ○ ○ : > UVLO, X:Don't care www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C (8) Power Supply Startup / Shutoff Sequence H L IN VUVLOBATTL V_BATT VCC2 VUVLO2H VUVLOBATTL VUVLOBATTL VUVLO2H VUVLO2H 0V 0V VEE2 H Hi-Z L Hi-Z L Hi-Z L Hi-Z L OUT1H/L OUT2 PROOUT RDY H L IN V_BATT VCC2 VUVLOBATTL VUVLOBATTH VUVLO2H VUVLOBATTH VUVLO2L 0V VUVLO2L VEE2 OUT2 PROOUT RDY H L IN V_BATT VUVLOBATTL VUVLO2H VUVLOBATTL VUVLOBATTH VUVLO2H 0V VUVLO2L VEE2 OUT2 PROOUT RDY H L IN VCC2 0V 0V H Hi-Z L Hi-Z L Hi-Z L Hi-Z L OUT1H/L V_BATT 0V 0V H Hi-Z L Hi-Z L Hi-Z L Hi-Z L OUT1H/L VCC2 0V VUVLOBATTH VUVLOBATTH VUVLO2L VUVLOBATTH 0V VUVLO2L VUVLO2L VEE2 0V 0V H Hi-Z L Hi-Z L Hi-Z L Hi-Z L OUT1H/L OUT2 PROOUT RDY : Since the VCC2 to VEE2 pin voltage is low and the output MOS does not turn ON, the output pins become Hi-Z conditions. : Since the VCC1 to GND1 pin voltage is low and the RDY output MOS does not turn ON, the output pins become Hi-Z conditions. Figure 44. Power Supply Startup / Shutoff Sequence www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Selection of Components Externally Connected Recommended ROHM MCR100JZH LTR50UZP Recommended ROHM MCR03EZP Recommended ROHM MCR03EZP Recommended SUMIDA CEER117 Recommended ROHM RB168M150 Recommended ROHM LTR18EZP Recommended ROHM MCR100JZH LTR50UZP Recommended ROHM RSR025N05 Figure 45. Recommended External Parts Power Dissipation 1.5 Power Dissiqation : Pd [W] 1.25 Measurement machine : TH156 (Kuwano Electric) Measurement condition : ROHM board Board size : 114.3×76.2×1.6mm3 1-layer board : θja=111.1°C /W 1 0.75 0.5 0.25 0 0 25 50 75 100 125 150 175 Ambient Temperature : Ta [℃] Figure 46. SSOP-B28W Derating Curve Thermal Design Please make sure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W), package power (Pd) and ambient temperature (Ta). When Tj=150°C is exceeded, the IC may malfunctions or some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) may occur. Constant use under these circumstances leads to deterioration and eventually IC may destruct. Tjmax=150°C must be strictly obeyed under all circumstances. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C I/O Equivalence Circuits Pin No. Pin Name Input Output Equivalent Circuit Diagram Pin Function VCC2 PROOUT 2 PROOUT Soft turn-off pin / Gate voltage input pin VEE2 VCC2 VTSIN 3 VTSIN Thermal detection pin GND2 VCC2 SCPIN 4 SCPIN Schort circuit current detection pin GND2 VCC2 MODE MODE 7 Mode selection pin of output-side UVLO GND2 VEE2 VCC2 UVLOIN UVLOIN 8 Output-side UVLO setting pin GND2 VEE2 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Pin Name Pin No. Input Output Equivalent Circuit Diagram Pin Function OUT1H VCC2 11 Source side output pin OUT1H OUT1L OUT1L VEE2 12 Sink side output pin VCC2 OUT2 OUT2 13 Output pin for Miller Clamp VEE2 FLT FLT RDY 16 Fault output pin RDY 20 GND1 Ready output pin VREG ENA ENA 17 Input enabling signal pin GND1 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Pin No. Pin Name Input Output Equivalent Circuit Diagram Pin Function VREG INA INA 18 Control input pin A GND1 VREG INB INB 19 Control input pin B GND1 V_BATT RT 21 RT Switching frequency setting pin for switching controller VEE2 V_BATT Internal power supply FB FB 22 GND1 Error amplifier inverting input pin for switching controller www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Pin Name Pin No. Input Output Equivalent Circuit Diagram Pin Function V_BATT Internal power supply COMP COMP 23 Error amplifier output pin for switching controller GND1 VREG V_BATT 25 Internal power supply Input-side internal power supply pin VREG FET_G FET_G 26 MOS FET control pin for switching controller GND1 V_BATT Internal power supply SENSE 27 SENSE Current detection pin for switching controller GND1 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 31/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Operational Notes 1. Reverse Connection of Power Supply Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 32/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Operational Notes – continued 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND Parasitic Elements Pin B B Parasitic Elements GND GND N Region close-by GND Figure 47. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. Ordering Information B M 6 0 0 5 Part Number 4 F V - Package FV: SSOP-B28W CE2 Rank C:Automotive Packaging and forming specification E2: Embossed tape and reel Marking Diagram SSOP-B28W (TOP VIEW) Part Number Marking BM60054 LOT Number 1PIN MARK www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 33/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Physical Dimension, Tape and Reel Information Package Name SSOP-B28W (Max 9.55 (include.BURR)) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 34/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 BM60054FV-C Revision History Date Revision 10.Apr.2015 001 Changes New Release www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 35/35 TSZ02201-0818ABH00080-1-2 10.Apr.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001