AME8851/1.5A CMOS LDO

AME
AME8851
n General Description
The AME8851 family of positive, CMOS linear regulators, provide low dropout voltage (400mV @ 1.5A) and
excellent PSRR, thus making them ideal for power-saving systems. These rugged devices have both Thermal
Shutdown, and Current limit to prevent device failure under the "Worst" of operating conditions.
1.5A CMOS LDO
n Typical Application
OUT
IN
IN
AME 8851 OUT
GND
C1
1µF
C2
4.7µF
The AME8851 is stable with an output capacitance of
4.7µF or larger.
n Features
( Fixed Versions )
l Low Dropout Voltage: 400mV @1.5A
l Guaranteed 1.5A Drive Current
OUT
IN
IN
AME 8851
l Over-Temperature Shutdown
l Current Limiting Protection
l PSRR : 50dB
l Low Temperature Coefficient
OUT
EN
GND
ADJ
R1
C1
1µF
C2
4.7µF
R2
l Input Voltage Range (2.5V ~ 5.5V)
l Output Voltage Range: Fixed Version (1.2V ~
3.3V), ADJ Version (1V ~ 4.5V)
l Green Products Meet RoHS Stangdards
(Adjustable Versions )
n Applications
l Motherboard, Desktop and Computer Peripherals
l LCD Monitor
l Handheld Device
l Data-Communication
Rev. A.01
1
AME
1.5A CMOS LDO
AME8851
n Functional Block Diagram
OUT
4
IN 2
EN 1
EN
R1
REF
AMP
OCP/OTP
R2
GND
3
( Fixed Versions )
OUT
4
IN 2
EN 1
EN
REF
R1
AMP
ADJ
5
OCP/OTP
GND
3
R2
(Adjustable Versions)
2
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Pin Configuration
3 Pin
SOT-223
Top View
SOT-223
Top View
AME 8851-AGTxxx
AME 8851-BGTxxx
1. IN
1. GND
2. GND (TAB)
AME8851
2. OUT (TAB)
AME8851
3. OUT
1
2
3
* Die Attach:
Conductive Epoxy
3. IN
1
TO-252-2
Top View
AME8851
2
3
TO-252-2
Top View
AME 8851-ACSxxx
AME 8851-BCSxxx
1. IN
1. GND
2. GND (TAB)
AME8851
3. OUT
1
2
3
* Die Attach:
Conductive Epoxy
TO-220-3
Top View
3. IN
1
2
3
AME 8851-BBTxxx
1. IN
1. GND
2. GND (TAB)
2. OUT (TAB)
3. IN
AME8851
* Die Attach:
Non-Conductive Epoxy
* Die Attach:
Conductive Epoxy
Rev. A.01
3
* Die Attach:
Non-Conductive Epoxy
AME 8851-ABTxxx
3. OUT
2
2. OUT (TAB)
TO-220-3
Top View
AME8851
1
* Die Attach:
Non-Conductive Epoxy
1
2
3
3
AME
1.5A CMOS LDO
AME8851
n Pin Configuration (Contd.)
3 Pin
TO-263-3
Top View
AME8851
TO-263-3
Top View
AME 8851-ADTxxx
AME 8851-BDTxxx
1. IN
1. GND
2. GND (TAB)
AME8851
3. OUT
1
2
3
* Die Attach:
Conductive Epoxy
TO-263-2
Top View
3. IN
1
2
3
AME 8851-BDSxxx
1. IN
2. GND (TAB)
1. GND
AME8851
3. OUT
1
4
2
3
* Die Attach:
Non-Conductive Epoxy
TO-263-2
Top View
AME 8851-ADSxxx
AME8851
2. OUT (TAB)
* Die Attach:
Conductive Epoxy
2. OUT (TAB)
3. IN
1
2
3
* Die Attach:
Non-Conductive Epoxy
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Pin Configuration (Contd.)
5 Pin
TO-263-5
Top View
AME8851
1 2 3 4 5
TO-263-5
Top View
AME 8851-ADVxxx
AME 8851-BDVADJ
1. EN
1. EN
2. IN
AME8851
3. GND (TAB)
3. GND (TAB)
4. OUT
4. OUT
5. NC
1 2 3 4 5
* Die Attach:
Conductive Epoxy
TO-263-5
Top View
AME8851
1 2 3 4 5
5. ADJ
* Die Attach:
Conductive Epoxy
TO-263-5
Top View
AME 8851-CDVxxx
AME 8851-DDVADJ
1. ENB
1. ENB
2. IN
AME8851
2. IN
3. GND (TAB)
3. GND (TAB)
4. OUT
4. OUT
5. NC
* Die Attach:
Conductive Epoxy
Rev. A.01
2. IN
1 2 3 4 5
5. ADJ
* Die Attach:
Conductive Epoxy
5
AME
1.5A CMOS LDO
AME8851
n Pin Configuration (Contd.)
8 Pin
SOP-8/PP
Top View
8
7
6
SOP-8/PP
Top View
5
2
3
4
8
7
6
5
1. ADJ
2. GND
2. GND
3. GND
3. GND
4. EN
AME8851
5. IN
5. IN
6. GND
6. GND
7. GND
7. GND
8. OUT
1
2
3
4
* Die Attach:
Conductive Epoxy
7
6
SOP-8/PP
Top View
5
2
3
AME 8851-CZAADJ
4
8
7
6
5
AME 8851-DZAxxx
1. EN
1. NC
2. IN
2. GND
3. OUT
3. GND
4. ADJ
AME8851
1
8. OUT
* Die Attach:
Conductive Epoxy
SOP-8/PP
Top View
8
AME 8851-BZAADJ
1. NC
4. EN
AME8851
1
AME 8851-AZAxxx
4. ENB
AME8851
5. GND
5. IN
6. GND
6. GND
7. GND
7. GND
8. GND
* Die Attach:
Conductive Epoxy
1
2
3
4
8. OUT
* Die Attach:
Conductive Epoxy
Note:
Connect exposed pad (heat sink on the back) to GND.
6
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Pin Configuration (Contd.)
8 Pin
SOP-8/PP
Top View
8
7
6
SOP-8/PP
Top View
5
2
3
8
4
7
6
5
AME 8851-FZAADJ
1. ADJ
1. ENB
2. GND
2. IN
3. GND
3. OUT
4. ENB
AME8851
1
AME 8851-EZAADJ
4. ADJ
AME8851
5. IN
5. GND
6. GND
6. GND
7. GND
7. GND
8. OUT
1
2
3
* Die Attach:
Conductive Epoxy
4
8. GND
* Die Attach:
Conductive Epoxy
Note:
Connect exposed pad (heat sink on the back) to GND.
n Pin Configuration
Pin Name
Rev. A.01
Pin Description
IN
Input voltage pin; should be decoupled with 1µF or greater capacitor.
EN
Enable pin, Active “high". When pulled “low”, the PMOS pass transistor turns off, current
consuming less than 1µA. When EN pin float outside, it’s weakly pulled high form internal
MOS.
ENB
Enable pin. Active “low”. When pulled “high”, the PMOS pass transistor turns off, current
consuming less than 1µA. When ENB pin float outside, it’s weakly pulled high form
internal MOS.
GND
Ground connection pin.
OUT
LDO voltage regulator output pin; should be decoupled with a 4.7µF or greater value low
ESR ceramic capacitor.
NC
No connection.
ADJ
Feedback output voltage for adjustable device.
7
AME
1.5A CMOS LDO
AME8851
n Ordering Information
AME8851 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configura tion
A
(SOT-223)
(TO-252-2)
1. IN
2. GND
3. OUT
(TO-220-3)
(TO-263-3)
(TO-263-2)
B
(SOT-223)
(TO-252-2)
P a ckage
Type
B:
C:
D:
G:
TO-220
TO-252
TO-263
SOT-223
Number of
Pins
S: 2
T: 3
V: 5
Output Voltage
100:
120:
180:
250:
300:
330:
ADJ:
1.0V
1.2V
1.8V
2.5V
3.0V
3.3V
Adjustable
1. GND
2. OUT
3. IN
(TO-220-3)
(TO-263-3)
(TO-263-2)
A
(TO-263-5)
B
(TO-263-5)
C
(TO-263-5)
D
(TO-263-5)
8
1.
2.
3.
4.
5.
EN
IN
GND
OUT
NC
1.
2.
3.
4.
5.
EN
IN
GND
OUT
ADJ
1.
2.
3.
4.
5.
ENB
IN
GND
OUT
NC
1.
2.
3.
4.
5.
ENB
IN
GND
OUT
ADJ
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Ordering Information (Contd.)
AME8851 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configuration
A
(SOP-8/PP)
B
(SOP-8/PP)
C
(SOP-8/PP)
Rev. A.01
1. NC
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
Package
Type
Z: SOP/PP
Number of
Pins
A: 8
Output Voltage
100:
120:
180:
250:
300:
330:
ADJ:
1.0V
1.2V
1.8V
2.5V
3.0V
3.3V
Adjustable
1. ADJ
2. GND
3. GND
4. EN
5. IN
6. GND
7. GND
8. OUT
1. EN
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
9
AME
1.5A CMOS LDO
AME8851
n Ordering Information (Contd.)
AME8851 - x x x xxx
Output Voltage
Number of Pins
Package Type
Pin Configuration
Pin Configuration
D
(SOP-8/PP)
E
(SOP-8/PP)
F
(SOP-8/PP)
10
1. NC
2. GND
3. GND
4. ENB
5. IN
6. GND
7. GND
8. OUT
Package
Type
Z: SOP/PP
Number of
Pins
A: 8
Output Voltage
100:
120:
180:
250:
300:
330:
ADJ:
1.0V
1.2V
1.8V
2.5V
3.0V
3.3V
Adjustable
1. ADJ
2. GND
3. GND
4. ENB
5. IN
6. GND
7. GND
8. OUT
1. ENB
2. IN
3. OUT
4. ADJ
5. GND
6. GND
7. GND
8. GND
Rev. A.01
AME
AME8851
1.5A CMOS LDO
n Availale Options
Part Number
Marking*
Output Voltage
Package
Operating Ambient
Temperature Range
AME8851-AGT120
A8851
AKyMXX
1.2V
SOT-223
- 40oC to +85oC
AME8851-AGT180
A8851
AIyMXX
1.8V
SOT-223
- 40oC to +85oC
AME8851-AGT250
A8851
AGyMXX
2.5V
SOT-223
- 40oC to +85oC
AME8851-AGT330
A8851
AByMXX
3.3V
SOT-223
- 40oC to +85oC
AME8851-BGT180
A8851
BIyMXX
1.8V
SOT-223
- 40oC to +85oC
AME8851-BGT250
A8851
BGyMXX
2.5V
SOT-223
- 40oC to +85oC
AME8851-BGT330
A8851
BByMXX
3.3V
SOT-223
- 40oC to +85oC
AME8851-AZA120
A8851
CKyMXX
1.2V
SOP-8/PP
- 40oC to +85oC
AME8851-BZAADJ
A8851
DMyMXX
ADJ
SOP-8/PP
- 40oC to +85oC
AME8851-DZA120
A8851
EKyMXX
1.2V
SOP-8/PP
- 40oC to +85oC
AME8851-EZAADJ
A8851
FMyMXX
ADJ
SOP-8/PP
- 40oC to +85oC
AME8851-ACS120
A8851
GKyMXX
1.2V
TO-252-2
- 40oC to +85oC
Note:
1. The first 2 places represent product code. It is assigned by AME such as AK.
2. y is year code and is the last number of a year. Such as the year code of 2008 is 8.
3. A bar on top of first letter represents Green Part such as A8851.
4. The last 3 places MXX represent Marking Code. It contains M as date code in "month", XX as LN code and
that is for AME internal use only. Please refer to date code rule section for detail information.
5. Please consult AME sales office or authorized Rep./Distributor for the availability of output voltage and package
type.
Rev. A.01
11
AME
1.5A CMOS LDO
AME8851
n Absolute Maximum Ratings
Parameter
Maximum
Unit
-0.3 to 6
V
Output Voltage
P D / (V IN - VOUT)
mA
Output Voltage
GND - 0.3 to VIN + 0.3
V
Input Voltage
B*
ESD Classification
Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device.
*HBM B: 2000V~3999V
n Recommended Operating Conditions
Parameter
12
Symbol
Rating
Unit
Ambient Temperature Range
TA
- 40 to +85
o
C
Junction Temperaturen Range
TJ
- 40 to +125
o
C
Storage Temperaturen Range
TSTG
- 65 to +150
o
C
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Thermal Information
Parameter
Package
Die Attach
Symbol
Maximum
Conductive Epoxy
25
Non-Conductive Epoxy
31
Conductive Epoxy
5
Non-Conductive Epoxy
30
Conductive Epoxy
6
Unit
SOT-223
TO-252-2
Thermal Resistance*
(Junction to Case)
TO-220-3
Non-Conductive Epoxy
TO-263-2
TO-263-3
TO-263-5
TO-263-2
TO-263-3
SOP-8/PP
θJC
o
24
Conductive Epoxy
5
Non-Conductive Epoxy
27
Conductive Epoxy
19
Conductive Epoxy
120
Non-Conductive Epoxy
135
Conductive Epoxy
90
Non-Conductive Epoxy
140
Conductive Epoxy
55
C/W
SOT-223
TO-252-2
Thermal Resistance
(Junction to Ambient)
TO-220-3
Non-Conductive Epoxy
TO-263-2
TO-263-3
TO-263-5
TO-263-2
TO-263-3
SOP-8/PP
θJA
o
80
Conductive Epoxy
80
Non-Conductive Epoxy
100
Conductive Epoxy
84
C/W
* Measure θJC on backside center of tab
Rev. A.01
13
AME
1.5A CMOS LDO
AME8851
n Thermal Information (Contd.)
Parameter
Package
Die Attach
Symbol
Maximum
Conductive Epoxy
900
Non-Conductive Epoxy
800
Conductive Epoxy
1200
Non-Conductive Epoxy
1000
Unit
SOT-223
TO-252-2
Conductive Epoxy
Internal Power Dissipation
TO-220-3
Non-Conductive Epoxy
TO-263-2
TO-263-3
TO-263-5
TO-263-2
TO-263-3
SOP-8/PP
Solder Iron(10 Sec)**
2200
PD
1600
Conductive Epoxy
1700
Non-Conductive Epoxy
1400
Conductive Epoxy
1450
350
mW
o
C
** MIL-STD-202G 210F
14
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Electrical Specifications
VIN=VOUT(NOM) +1V, ( for VOUT < 2V, VIN=2.5V ), IOUT=1mA, and COUT=4.7µF, CIN=1µF unless otherwise noted. Typical
values are at T A=25oC.
Parameter
Input Voltage
Output Accuracy
(For Fixed Versions)
Output Voltage Range
(For ADJ Versions)
Dropout Voltage
(Note1)
Symbol
Test Condition
VIN
V OUT,ACC
IOUT = 10mA
VOUT
VDROP
Min
Max
Units
2.5
5.5
V
-1.5
1.5
%
1.0
4.5
V
IOUT=1.5A, 1.2V ≦VOUT(NOM) ≦1.8V
Note2
IOUT=1.5A, 1.8V< VOUT(NOM) ≦2.8V
700
IOUT=1.5A, 2.8V<VOUT(NOM)
Output Current
Quiescent Current
(For Fixed Output Voltage
Options)
IOUT
IOUT=0mA
IOUT=10mA
∆VOUT
× 100%
∆VIN
VOUT
400
1V<VOUT<2V, 2.5V<VIN≦ 5V
mV
550
1.5
IQ
Line Regulation
Typ
A
70
-0.15
120
µA
0.15
REGLINE
%/V
IOUT=10mA, 2V<VOUT≦ 3.3V
V IN(MIN)<VIN ≦ 5V
-0.1
0.1
-1
1
Load Regulation
∆VOUT
× 100%
VOUT
∆I OUT
REGLOAD
VIN=V OUT+1V
10mA ≦ IOUT ≦ 1.5A
Outpu Current Limit
ILIM
VOUT = 0.9 x VOUT(NOM)
Short Circuit Current
ISC
VIN= V OUT(NOM)+1V, VOUT < 0.4V
Power Supply Rejection Ratio
Rev. A.01
PSRR
1.6
%/A
A
750
COUT=4.7uF
F=1KHz
50
IOUT=100mF
F=10KHz
30
mA
dB
15
AME
1.5A CMOS LDO
AME8851
n Electrical Specifications (Contd.)
Symbol
Test Condition
Min
Enable High (Enabled)
VEH,HI
V IN(MIN) ≦ VIN ≦ 5.5V
1.4
Enable Low (Shutdown)
V EN,LO
Parameter
IEN
Enable Input Bias Current
IENB
Shutdown Current
ISHDN
Thermal Shutdown Temperature
TSHDN
Typ
Max
Units
VIN
V
V IN(MIN) ≦ VIN ≦ 5.5V
0.4
V
VEN = VIN
0.1
VEN = 0
0.5
V ENB = VIN
0.5
VENB = 0
0.1
VEN =0V, VIN(MIN) ≦ VIN ≦5.5V
1
Shutdown, temperature increasing
150
Restore, temperature decreasing
130
µA
µA
o
C
ADJ
ADJ Reference Voltage
VREF
ADJ Input Bias Current
IADJ
0.985
VIN =5V, VADJ=1.0V
1.0
1.015
1
V
µA
Note 1. Dropout Voltage is measured at VOUT = VOUT(NOM) x 98%
Note 2. VIN(MIN) = VDROP + VOUT(NOM) or VIN(MIN) = 2.5V whichever is greater
16
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Detailed Description
The AME8851 is low-dropout; low quiescent current
linear regulator designed for motherboard, notebook and
LCD monitor applications. The output voltage range from
1.0V to 4.5V, and can drive 1.5A loading current.
Capacitor Selection and Regulator Stability
Use 1µF for input capacitor and 4.7µF or great for output capacitor on the AME8851. Larger input capacitor
value and low ESR provide better supply noise rejection
and improve line transient response. To reduce output
noise and load transient response, use output capacitor
greater than 4.7uF. In addition, AME8851 can prevent
output voltage overshoot at power-on or enabled through
the EN/ENB pin.
Calculating the Maximum Output Power
The maximum output power of the AME8851 is limited
by the maximum power dissipation of the package. By
calculation the power dissipation of the package as a
function of the input voltage, output voltage and output
current, the maximum input voltage can be obtained. The
maximum power dissipation should not exceed the
package's maximum power rating.
PMAX = (VIN(MAX)-VOUT) x IOUT
Where: VIN(MAX) = maximum input voltage
PMAX = maximum power dissipation of the package
Adjustable Version
The adjustable version uses external feedback resistors to generate an output voltage anywhere from 1.0V to
5.0V. By the equation:
VOUT = V ADJ (1 +
R1
)
R2
Feedback resistors R1 and R2 should be high enough
to keep quiescent current low, but increasing R1 + R2
will reduce stability. In general, R1 and R2 in the 10’s of
KΩ will produce adequate stability, given reasonable layout precautions. To improve stability characteristics, keep
parasites on the ADJ pin to a minimum, and lower R1 and
R2 values.
Rev. A.01
17
AME
1.5A CMOS LDO
AME8851
n Characterization Curve(For reference only)
VOUT vs Temperature
Quiesent Current vs Temperature
200
1.25
1.24
Quiescent current (µA)
1.23
VOUT(V)
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
-40
VOUT = 1.2V
180
V OUT = 1.2V
IOUT = 1mA
160
140
120
100
80
60
40
20
-15
+10
+35
+60
+85
0
-40
+110
O
-15
+10
+35
+60
Current Limit vs Temperature
Dropout Voltage vs Temperature
350
VOUT = 1.2V
VOUT = 3.3V
Dropout Volage (mV)
5
Current limit (A)
+110
Temperature(°C)
6
4
3
2
1
0
-40
+85
Temperature ( C)
-15
+10
+35
+60
+85
300
250
200
150
-40
+110
Temperature(°C)
-15
10
35
60
85
110
Temperature(°C)
Power Supply Rejection Ratio
Line Transient Response vs Temperature
90
VIN (1V/DIV)
100
VOUT = 1.2V
80
IOUT=100mA
60
50
VOUT (20mV/DIV)
PSRR (dB)
70
40
30
20
10
0
100
1K
10K
Frequency (Hz)
18
100K
VOUT = 1.2V
IOUT = 1mA
1M
Time (200µSec/DIV)
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Characterization Curve(For reference only)
Line Transient Response vs Temperature
VOUT (20mV/DIV)
V IN (1V/DIV)
VOUT = 1.2V
IOUT = 1.5A
IOUT (500mA/DIV)
VOUT (20mV/DIV)
Load Transient Response vs Temperature
Time (200µSec/DIV)
Time (200µSec/DIV)
Short Circuit Current
1.6
VOUT = 1.2V
Short Circuit Current (A)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.5
3.5
4.5
5.5
VIN(V)
Rev. A.01
19
AME
1.5A CMOS LDO
AME8851
n Date Code Rule
Month Code
1: January 7: July
2: February 8: August
3: March
9: September
4: April
A: October
5: May
B: November
6: June
C: December
n Tape and Reel Dimension
SOT-223
P
W
AME
AME
PIN 1
Carrier Tape, Number of Components Per Reel and Reel Size
20
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOT-223
12.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Tape and Reel Dimension (Contd.)
TO-252-2
P
W
PIN 1
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-252-2
16.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
TO-263-3
P
PIN 1
W
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Rev. A.01
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-3
24.0±0.1 mm
4.0±0.1 mm
800pcs
330±1 mm
21
AME
1.5A CMOS LDO
AME8851
n Tape and Reel Dimension (Contd.)
TO-263-2
P
W
PIN 1
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-2
24.0±0.1 mm
4.0±0.1 mm
800pcs
330±1 mm
TO-263-5
P
W
PIN 1
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
22
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
TO-263-5
24.0±0.1 mm
4.0±0.1 mm
800pcs
330±1 mm
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Tape and Reel Dimension (Contd.)
SOP-8/PP
P
PIN 1
W
AME
AME
Carrier Tape, Number of Components Per Reel and Reel Size
Rev. A.01
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOP-8/PP
12.0±0.1 mm
4.0±0.1 mm
2500pcs
330±1 mm
23
AME
1.5A CMOS LDO
AME8851
n Package Dimension
SOT-223
Top View
Side View
SYMBOLS
D
B1
θ
C
13 o (4X)
H
E
PIN 1
MILLIMETERS
MIN
MAX
MIN
MAX
A1
0.01
0.10
0.0004
0.0039
B
0.60
0.84
0.0236
0.0330
B1
2.90
3.15
0.1140
0.1240
C
0.24
0.38
0.0094
0.0150
D
6.20
6.71
0.2441
0.2640
E
3.30
3.71
0.1299
0.1460
2.30 BSC
e
e
Front View
13 o (4X)
F
A1
0.0906 BSC
F
1.40
1.80
0.0551
0.0709
H
6.70
7.30
0.2638
0.2874
?
0o
10o
0o
10o
B
TO-252-2
SYMBOLS
Top View
Side View
E
K
B
A
D1
L
F
E1
G
PIN 1
J
INCHES
C
H
D
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
0.43
0.58
0.0169
0.0230
B
1.60
1.95
0.0630
0.0768
C
0.51
1.78
0.0200
0.0701
D
0.43
0.60
0.0169
0.0236
E
6.35
6.80
0.2500
0.2677
F
5.36
7.20
0.2110
0.2835
G
2.20
3.00
0.0866
0.1181
H
-
* 2.30
-
*0.0906
J
-
0.97
-
0.0380
K
5.20
5.50
0.2047
0.2165
L
1.40 REF
0.0551 REF
D1
E1
3.80 REF
3.81
5.10
0.1496 REF
0.1500
0.2008
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material.
24
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Package Dimension (Contd.)
TO-220-3
Top View
G
Side View
C
D
Bottom View
A
I
P
P1
G1
PIN 1
M
O
N
E
K
TO-263-3
Side View
Bottom View
A
K
E
B1
B
H
A2
D
P
G
N
R
Front View
C
INCHES
MIN
MAX
MIN
MAX
A
5.58
7.49
0.2197
0.2949
C
2.03
4.83
0.0799
0.1902
D
0.50
1.45
0.0197
0.0571
E
0.30
1.15
0.0118
0.0453
G
9.65
10.67
0.3799
0.4201
I
3.53
4.09
0.1390
0.1610
K
0.50
1.15
0.0197
0.0453
M
1.14
1.78
0.0449
0.0701
N
2.28
2.80
0.0898
0.1102
O
12.70
14.74
0.5000
0.5803
P
14.22
16.51
0.5598
0.6500
P1
5.00
5.70
0.1969
0.2244
G1
7.30
8.05
0.2874
0.3169
SYMBOLS
Top View
PIN 1
MILLIMETERS
SYMBOLS
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
9.65
10.67
0.380
0.420
B
8.28
9.66
0.326
0.380
C
4.06
4.83
0.160
0.190
D
0.50
1.36
0.020
0.054
E
1.14
1.45
0.045
0.057
G
*
H
14.60
15.875
K
0.99
2.93
2.54
0.100
0.5748
2.28
o
R
0
B1
A2
5.00
7.30
0.625
0.03898 0.11535
0.31
N
P
*
0.012
2.80
0.08976 0.11024
0o
8o
5.70
0.197
0.224
8.05
0.287
0.317
8
o
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Minimum lead thickness is the minimum thickness of base material.
Rev. A.01
25
AME
1.5A CMOS LDO
AME8851
n Package Dimension (Contd.)
TO-263-2
MILLIMETERS
SYMBOLS
TOPVIEW
SIDEVIEW
E
B2
B
H
A2
PIN1
D
MAX
MIN
MAX
A
9.65
10.42
0.380
0.410
B
8.28
9.66
0.326
0.380
C
4.06
4.83
0.160
0.190
D
0.50
1.36
0.020
0.054
E
1.14
1.45
0.045
*
G
P
G
MIN
BOTTOMVIEW
A
K
C
FRONTVIEW
0.057
*
2.54
0.100
H
14.60
15.80
0.575
0.622
K
0.99
2.93
0.039
0.115
0.38 REF
N
N
R
INCHES
0.015 REF
P
2.28
2.80
0.090
0.110
R
0o
8o
0o
8o
B2
6.30
8.20
0.248
0.323
A2
7.30
8.95
0.287
0.352
*: Typical Value
Notes:
1. Controlling dimension: Millimeters
2. Maximum lead thickness includes lead finish thickness Minimum lead
thickness is the minimum thickness of base material.
TO-263-5
TOP VIEW
SIDE VIEW
A
K
BOTTOM VIEW
A1
E
B1
B
H
SYMBOLS
MILLIMETERS
MIN
MAX
MIN
MAX
A
9.800
10.668
0.386
0.420
B
8.200
9.169
0.323
0.361
C
4.310
4.800
0.170
0.189
D
0.660
0.910
0.026
0.036
E
1.140
1.450
0.045
0.057
1.70 REF
G
PIN 1
P
D
N
G
C
FRONT VIEW
26
R
INCHES
0.067 REF
H
14.600
15.875
0.575
0.625
K
1.143
1.760
0.045
0.069
N
0.310
0.580
0.012
0.023
P
2.280
2.800
0.090
0.110
o
o
o
R
0
8
0
8o
A1
7.500
7.700
0.295
0.303
B1
5.800
6.450
0.228
0.254
Rev. A.01
AME
1.5A CMOS LDO
AME8851
n Package Dimension (Contd.)
SOP-8/PP
TOP VIEW
SIDE VIEW
D1
θ
E1
E2
E
L1
C
SYMBOLS
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
1.350
1.750
0.053
0.069
A1
0.000
0.150
0.000
0.006
A2
1.350
1.600
0.053
0.063
C
0.100
0.250
0.004
0.010
E
3.750
4.150
0.148
0.163
E1
5.700
6.300
0.224
0.248
L1
0.300
1.270
0.012
0.050
b
0.310
0.510
0.012
0.020
D
4.720
5.120
0.186
0.202
PIN 1
D
e
A1
FRONT VIEW
Rev. A.01
A
A2
b
1.270 BSC
e
o
0.050 BSC
o
o
8o
θ
E2
2.150
2.513
0.085
0.099
D1
2.150
3.402
0.085
0.134
0
8
0
27
www.ame.com.tw
E-Mail: sales@ame.com.tw
Life Support Policy:
These products of AME, Inc. are not authorized for use as critical components in life-support
devices or systems, without the express written approval of the president
of AME, Inc.
AME, Inc. reserves the right to make changes in the circuitry and specifications of its devices and
advises its customers to obtain the latest version of relevant information.
 AME, Inc. , June 2011
Document: 1293-DS8851-A.01
Corporate Headquarter
AME, Inc.
2F, No.302, Rui-Guang Road, Nei-Hu District
Taipei 114, Taiwan .
Tel: 886 2 2627-8687
Fax: 886 2 2659-2989