Product Change Notices PCN No.: 20110802 Date: September 1, 2011 Subject: Apply Cu bonding wire on AME1117 SOT-223 package This is to inform you that Cu bonding wire will be applied on the AME1117 SOT-223 series with below conditions: 1. AME to ensure "Electrical Characteristic" of Cu bonding wire package is 100% compliance AME1117 specifications. 2. AME qualified this new material package reliability. 3. The Part Number of each product is unchanged, but identification through D/C is available. This notification is for your information and concurrence. If you require AME Qual/Rel data or samples to qualify this change, please contact AME, Inc. directly or AME’s authorized Sales Representative or Distributor. Please note this PCN will be effective after 30 days of issuing date automatically If we do not receive any response, comment or questions from you within 30 calendar days. If you have any questions concerning this change, please contact: PCN Originator: Name: Bill Chou – Director, Engineering Department I Email: [email protected] Phone: +886.2.2627.8687 # 2110 Expected 1st Device Shipment Date: 10/1/2011 Effective Year/Work Week of Changed Product: NA AME1117 SOT-223 series Part Number – Au bonding wire AME1117 SOT-223 series Part Number – Cu bonding wire Reason of Change: Add Cu bonding wire to ensure the sufficient material source. Qual/Rel Report: Test Item HTOL ESD Result Description MIL-STD-883F 1005.8 TSTRESS=125℃, Duration= 1000hrs Biased Pass MIL-STD-883G Human Body Model, Class 2, Pass Method 3015.7 2kV minimum JEDEC Machine Model, Class B, Pass EIA/JESD22-A115 200V minimum Method JESD22-C101C Charged Device Model, Class II, 200V minimum Latch-up MSL HTS JEDEC STANDARD Pass Level A, 100mA minimum Pass J-STD-020C 85/85 168 hours, IR-reflow 3 cycles Peak Temp.= 260℃ MSL1 JESD22-A103D 150℃, 1000 hrs Pass 85℃,85% RH, 1000hrs Pass Pass NO.78 MARCH 1997 IPC/JEDEC THT (85/85) JESD22-A101C PCT JESD22-A102D 121℃, 100% RH, 2atm, 168hrs TCT JESD22-A104D -65℃ ~ 150℃, 500 cycles, DWELL=15min Pass Solderability J-STD-D02C IR-reflow JESD22-A113F Temp.=260℃, Duration=5sec Pass See IR reflow Profile, Perform 3 cycles test Pass REL-1117-A-A Cu Wire Reliability Report for AME1117 SOT-223 Series Product Approved by Prepared by Amy Shen Jess Lin Quality & Reliability Dept. Manager Quality & Reliability Dept. Engineer Conclusion: The AME1117 SOT-223 series product has successfully met AME’s reliability standard that is required on all AME, Inc products. Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all AME1117 SOT-223 series product will still meet AME’s reliability standard in the future. Table of Contents I、General Description II、Product Information III、Failures In Time Calculation IV、Product Reliability Test Result V、Package Reliability Test Result VI、IR-reflow Test Result I、General Description: The AME1117 is a 1A low-dropout positive voltage regulator. It is available in fixed and adjustable output voltage versions. Over current and thermal protection are integrated onto the chip. Output current will limit as while it reaches the pre-set current or temperature limit. The dropout voltage is specified at 1.4V Maximum at full rated output current. The AME1117 series provides excellent regulation over line, load and temperature variations. II、Product Information: Product Grade or Option A: ADJ B: 2.5V C: 3.3V D: 5.0V E: 1.8V Operating Ambient Temperature Range C: 0OC to 70OC Package Type G: SOT-223 Number of Pins T: 3 Special Feature Z: Lead Free III、Failures In Time Calculation: Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below: FIT = ( x 2 (ν , CL ) × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) =106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. IV、Product Reliability Test Result: Test Item Test Condition Sample Size / Failures Result HTOL TSTRESS=125℃ 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs package pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass Duration= 1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Class 2, 2kV minimum Machine Model Pin-to-Pin test Class B, 200V minimum Charged Device Model Class II, 200V minimum Latch-up Level A, 100mA minimum V、Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 77 pcs / 0 pcs Pass 77 pcs / 0 pcs Pass 77 pcs / 0 pcs Pass 77 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260℃ IPC/JEDEC J-STD-020C HTS Precondition NOTE 2 Temp.=150℃ Duration=1000 hours Unbiased, Read at 1000 hours THT Precondition NOTE 2 Temp.=85℃, R.H.=85% Duration=1000 hours Unbiased, Read at 1000 hours PCT Precondition NOTE 2 Temp.=121℃, R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition NOTE 2 -65℃ ~ 150℃ 500 cycles Unbiased, Read at 500 cycles Solderability Temp.=260℃ (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 260℃ VI、IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5℃ of actual Peak Temperature (tp) Ramp-Down Rate Time 25℃ to Peak Temperature Pb-Free Assembly 3℃/second max. 150℃ 200℃ 60~180 seconds 217℃ 60~150 seconds 260℃ 20~40 seconds 6℃/second max. 8 minutes max.