REL-1221 - B Reliability Report for AME8500 Series Product Approved by Prepared by Amy Shen Eric Chen Quality & Reliability Dept. Manager Quality & Reliability Dept. Engineer Conclusion: The AME8500 series product has successfully met AME’s reliability standard that is required on all AME, Inc products. Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all AME8500 series product will still meet AME’s reliability standard in the future. Table of Contents: General Description Product Information Failures In Time Calculation Product Reliability Test Result Package Reliability Test Result IR-reflow Test Result General Description: The AME8500 family allows the user to customize the CPU reset function without any external components. The user has a large choice of reset voltage thresholds, reset time intervals, and output driver configurations, all of which are preset at the factory. Each wafer is trimmed to the customer' s specifications. These circuits monitor the power supply voltage of µP based systems. When the power supply voltage drops below the voltage threshold a reset is asserted immediately (within an interval TD1). The reset remains asserted after the supply voltage rises above the voltage threshold for a time interval, TD2 . The reset output may be either active high (RESET) or active low (RESETB). The reset output may be configured as either push/pull or open drain. The state of the reset output is guaranteed to be correct for supply voltages greater than 1V. Space saving SOT-23/TSOT-23 packages and micropower quiescent current (<3.0 natural for portable battery powered equipment. Product Information: A) make this family a Pin Configuration Operating Ambient Temperature Range O A O Package Type 1. GND E:-40 C to 85 C E:SOT-2X (SOT-23) 2. Reset/ F:SOT-89 (TSOT-23) ResetB I:SC-70 3. IN B 1. Reset/ (SOT-23) ResetB (TSOT-23) 2. GND 3. IN C 1. Reset/ ResetB (TSOT-23) 2. IN 3. GND (SOT-23) A (SC-70-3) A (SOT-89) B (SOT-89) C (SOT-89) B 1. Reset/ ResetB 2. IN 3. GND 1. GND 2. IN 3. Reset/ ResetB 1. Reset/ ResetB 2. IN 3. GND 1. IN 2. GND 3. Reset/ ResetB 1. Reset/ ResetB (TSOT-25) 2. IN 3. GND 4. N/C 5. N/C (SOT-25) Output Driver Number Option of Characteristic Pins of RESET or RESETB Pin T:3 V:5 A:RESETB /PP B:RESETB /OD C:RESET/ PP D:RESET/ OD (RESET = Active High) (RESETB = Active Low) (PP = Push pull out) (OD = Open drain output ) Reset Time (TD2NOM) A:1.5 ms D:30 ms E:150 ms F:210 ms VIN Threshold Voltage (VTH) Special Feature 15:VTH= 1.50V L:Low profile 16:VTH= 1.60V Y:Lead free & 18:VTH= 1.80V Low profile 19:VTH= 1.90V Z:Lead free 20:VTH= 2.00V 21:VTH= 2.10V 22:VTH= 2.20V 23:VTH= 2.32V 24:VTH= 2.40V 25:VTH= 2.50V 26:VTH= 2.63V 27:VTH= 2.70V 28:VTH= 2.80V 29:VTH= 2.93V 30:VTH= 3.00V 31:VTH= 3.08V 35:VTH= 3.50V 40:VTH= 4.00V 42:VTH= 4.20V 44:VTH= 4.38V 45:VTH= 4.50V 46:VTH= 4.63V Failures In Time Calculation: Use HTOL test information mentioned in section FIT = ( x 2 (ν , CL ) , FIT (Failures In Time) can be calculated as below: × 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 ) 9 =106.69 (pieces per 10 hours) @ 40 with 90% Confidence Level. Where AF is acceleration factor setting activation energy to 1.0eV as zero failure. Product Reliability Test Result: Test Item HTOL Test Condition Precondition TSTRESS=125 NOTE 1 Sample Size / Failures Result 77 pcs / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass 3 pcs per pin pair / 0 pcs Pass Duration=1000hrs Biased, Read at 168/504/1000 hours ESD Human Body Model Pin-to-Pin test Level 2, 2kV minimum Machine Model Pin-to-Pin test Level 2, 200V minimum Latch-up Level 3, 100mA minimum 3 pcs per pin pair / 0 pcs NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245 Pass (leaded) or 260 (lead-free). Package Reliability Test Result: Test Item Test Condition Sample Size / Failures Result MSL 85/85 168 hours 22 pcs / 0 pcs Level 1 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 45 pcs / 0 pcs Pass 5 pcs / 0 pcs Pass IR-reflow 3 cycles Peak Temp.= 260 (lead-free) IPC/JEDEC J-STD-020C HTS Precondition Temp.=150 NOTE 2 Duration=1000 hours Unbiased, Read at 1000 hours THT Precondition NOTE 2 Temp.=85 , R.H.=85% Duration=1000 hours Unbiased, Read at 1000 hours PCT Precondition NOTE 2 Temp.=121 , R.H.=100% 15PSIG, Unbiased Duration=168 hours Read at 168 hours TCT Precondition -65 ~ 150 NOTE 2 500 cycles Unbiased, Read at 500 cycles TST NOTE 2 Precondition -55 ~ 125 200 cycles Unbiased, Dwell time:5min Read at 200 cycles Solderability Temp.=245 Temp.=260 (leaded) (lead-free) Duration=5sec NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245 (leaded) or 260 (lead-free). IR-reflow Test Result: Test Item Test Condition Sample Size / Failures Result IR-reflow See IR reflow Profile 22 pcs / 0 pcs Pass Perform 3 cycles test IR reflow Profile: Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (tsmin to tsmax) Time maintained above - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 of actual Peak Temperature (tp) Ramp-Down Rate Time 25 to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3 /second max. 3 /second max. 100 150 60~120 seconds 150 200 60~180 seconds 183 60~150 seconds 245 217 60~150 seconds 260 10~30 seconds 20~40 seconds 6 /second max. 6 minutes max. 6 /second max. 8 minutes max.