Part Number: XZDG81FS 2.8X0.8mm RIGHT ANGLE SMD CHIP LED LAMP Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Standard Package: 2,000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.0039") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) DG (InGaN) Unit Reverse Voltage VR 5 V Forward Current IF 25 mA Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS Power Dissipation PD 102.5 Operating Temperature TA -40 ~ +85 Tstg -40 ~ +85 Storage Temperature 150 Electrostatic Discharge Threshold (HBM) 450 Operating Characteristics (TA=25°C) XZDG81FS Emitting Color Green Unit Forward Voltage (Typ.) (IF=20mA) VF 3.3 V Forward Voltage (Max.) (IF=20mA) VF 4.1 V Reverse Current (Max.) (VR=5V) IR 50 uA λP 515* nm °C Wavelength of Peak Emission CIE127-2007* (Typ.) (IF=20mA) λD 525* nm V Wavelength of Dominant Emission CIE127-2007* (Typ.) (IF=20mA) Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 30 nm C 45 pF mA mW Capacitance (Typ.) (VF=0V, f=1MHz) Part Number DG (InGaN) Emitting Material InGaN Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=20mA) mcd min. typ. 400* 695* Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 515* 110° *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Mar 25,2014 XDSB3988 V3-Z Layout: Maggie L. P. 1/5 Part Number: XZDG81FS 2.8X0.8mm RIGHT ANGLE SMD CHIP LED LAMP Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1.Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 2. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Mar 25,2014 XDSB3988 V3-Z Layout: Maggie L. P. 2/5 Part Number: XZDG81FS 2.8X0.8mm RIGHT ANGLE SMD CHIP LED LAMP DG LED is recommended for reflow soldering and soldering profile is shown below. Mar 25,2014 XDSB3988 V3-Z Layout: Maggie L. P. 3/5 Part Number: XZDG81FS 2.8X0.8mm RIGHT ANGLE SMD CHIP LED LAMP The device has a single mounting surface. The device must be mounted according to the specifications. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Mar 25,2014 XDSB3988 V3-Z Layout: Maggie L. P. 4/5 Part Number: XZDG81FS 2.8X0.8mm RIGHT ANGLE SMD CHIP LED LAMP PACKING & LABEL SPECIFICATIONS TERMS OF USE 1. Data presented in this document reflect statistical figures and should be treated as technical reference only. 2. Contents within this document are subject to improvement and enhancement changes without notice. 3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. User accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life. 5. The contents within this document may not be altered without prior consent by SunLED. 6. Additional technical notes are available at http://www.SunLEDusa.com/TechnicalNotes.asp Mar 25,2014 XDSB3988 V3-Z Layout: Maggie L. P. 5/5