SunLED

Part Number: ZMDKDGK55W-8
3.2x1.6mm SMD CHIP LED LAMP
www.SunLED.com
Package Schematics
Features
● Ideal for indication light on hand held products
● Long life and robust package
● Standard Package: 2,000pcs/ Reel
● MSL (Moisture Sensitivity Level): 3
● RoHS compliant
DGK
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
D
E
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. Specifications are subject to change without notice.
Absolute Maximum Ratings
(TA=25°C)
Reverse Voltage
VR
Forward Current
IF
Forward Current (Peak)
1/10 Duty Cycle
0.1ms Pulse Width
iFS
Power Dissipation
PD
Electrostatic Discharge Threshold (HBM)
Operating Temperature
Storage Temperature
MDK
(AlGaInP)
DGK
(InGaN)
Unit
5
5
L
n
V
30
25
mA
u
S
185
150
mA
75
102.5
mW
-
450
V
TA
-40 ~ +85
Tstg
-40 ~ +85
°C
Operating Characteristics
(TA=25°C)
Emitting
Color
Red
Emitting
Material
1.95
3.3
V
Forward Voltage (Max.)
(IF=20mA)
VF
2.5
4.1
V
Reverse Current (Max.)
(VR=5V)
IR
10
50
uA
Wavelength of Peak
Emission CIE127-2007* (Typ.)
(IF=20mA)
λP
645*
515*
nm
Wavelength of Dominant
Emission CIE127-2007* (Typ.)
(IF=20mA)
λD
630*
525*
nm
Spectral Line Full Width
At Half-Maximum (Typ.)
(IF=20mA)
△λ
28
35
nm
C
35
45
pF
Lens-color
Water Clear
Green
Unit
VF
AlGaInP
ZMDKDGK55W-8
DGK
(InGaN)
Forward Voltage (Typ.)
(IF=20mA)
Capacitance (Typ.)
(VF=0V, f=1MHz)
Part
Number
MDK
(AlGaInP)
InGaN
Luminous Intensity
CIE127-2007*
(IF=20mA) mcd
Wavelength
CIE127-2007*
nm λP
min.
typ.
500
200*
895
397*
645*
400
400*
647
647*
515*
Viewing
Angle
2θ 1/2
30°
*Luminous intensity value and wavelength are in accordance with CIE127-2007 standards.
Mar 07,2014
SDSA9288
V1-X
Layout: Maggie L.
P. 1/4
Part Number: ZMDKDGK55W-8
www.SunLED.com
3.2x1.6mm SMD CHIP LED LAMP
™ MDK
D
E
L
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u
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™ DGK
Mar 07,2014
SDSA9288
V1-X
Layout: Maggie L.
P. 2/4
Part Number: ZMDKDGK55W-8
3.2x1.6mm SMD CHIP LED LAMP
www.SunLED.com
LED is recommended for reflow soldering and
soldering profile is shown below.
™ The device has a single mounting surface.
The device must be mounted according to the
specifications.
™ Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
u
S
™ Tape Specification (Units : mm)
L
n
D
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™ Reel Dimension
Remarks:
If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength),
the typical accuracy of the sorting process is as follows:
1. Wavelength: +/-1nm
2. Luminous intensity / luminous flux: +/-15%
3. Forward Voltage: +/-0.1V
Note: Accuracy may depend on the sorting parameters.
Mar 07,2014
SDSA9288
V1-X
Layout: Maggie L.
P. 3/4
Part Number: ZMDKDGK55W-8
3.2x1.6mm SMD CHIP LED LAMP
www.SunLED.com
PACKING & LABEL SPECIFICATIONS
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TERMS OF USE
1. Data presented in this document reflect statistical figures and should be treated as technical reference only.
2. Contents within this document are subject to improvement and enhancement changes without notice.
3. The product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet.
User accepts full risk and responsibility when operating the product(s) beyond their intended specifications.
4. The product(s) described in this document are intended for electronic applications in which a person’s life is not reliant upon the LED. Please
consult with a SunLED representative for special applications where the LED may have a direct impact on a person’s life.
5. The contents within this document may not be altered without prior consent by SunLED.
6. Additional technical notes are available at http://www.SunLED.com/TechnicalNotes
Mar 07,2014
SDSA9288
V1-X
Layout: Maggie L.
P. 4/4