Catalog

IC Sockets
XR2
OMRON’s IC Connectors Have Excellent
Reliability and Can Tolerate Momentary
Interruptions in Power. Ideal for Highspeed Data Processing.
■ Round pins and 4-point (4-finger) contact construction
ensure long life and excellent shock and vibration durability.
■ Contact entry holes are large for easy insertion.
■ IC lead contacts placed high for solid connections.
■ No flux rise.
■ A wide product range: open-frame, closed-frame, single-row, carrier-type DIP terminals, wrap terminals, solder-sleeve terminals, and low-profile DIP terminals.
■ A new tin-plated product series offers more choice
when it comes to selecting the optimum IC Socket for
an application.
■ Conform to UL standards (file no. E 103202).
RoHS Compliant
■ Construction
■ Contact Dimensions
DIP Terminals
Inner clip
Base
Low-profile DIP
Terminals
Wrap
Terminals
1.83 dia.
1.83 dia.
1.83 dia.
Outer sleeve
Solder-sleeve
Terminals
1.83 dia.
1.35 dia.
0.79 dia.
Carrier
Inner clip
0.51 dia.
0.635 × 0.635
Outer sleeve
■ Terminology
z Carrier type
Carrier type refers to products where only terminals are
mounted by removing the carrier after mounting on the
board.
z Solder sleeve type
Solder sleeve type refers to products with a board mounting height of 0.8 mm that can be used in locations with
height restrictions.
1
„ Ratings and Characteristics
Item
Gold plated
Gold flash plated
„ Applicable Wrap Post Wire Sizes
AWG30, AWG28, AWG26, AWG24
(Solid wire: 0.25 to 0.51 mm dia.)
Rated current
1A
Rated voltage
300 VAC
Contact resistance
20 mΩ max. (at 20 mV, 100 mA max.)
Insulation resistance
1,000 MΩ min. (at 500 VDC)
Dielectric strength
1,000 VAC for 1 min (leakage current: 1 mA
max.)
„ Applicable IC Lead Dimensions
Insertion force (See
note.)
3.92 N max.
DIP, Wrap, and Solder-sleeve Terminals
Removal force (See
note.)
0.64 N min.
Insertion durability
100 times (0.75-µm
gold plating), 50 times
(0.25-µm gold plating)
Ambient operating temperature
Note:
Operating: − 55 to 125°C (with no icing)
„ Materials and Finish
Fiber-glass reinforced PBT resin (UL94V-0)/
black
Carrier
Aluminum
Inner clip
Beryllium copper/nickel base, gold plated
Beryllium copper/nickel base, gold flash plating
Outer sleeve
Note:
2
Brass/nickel base, gold flash plating
For non-standard plating, contact your OMRON representative.
IC Sockets XR2
3 wires
Depth × width (mm)
20 times (gold flash
plating)
The contact insertion force and contact removal force are for a test
gauge, t = 0.432 mm.
Base
„ Wrap Post Length
Flat lead
0.29 ±0.09 × 0.46 ±0.08 (See note 1.)
Round lead
0.53 dia. max.
0.41 dia. min.
Low-profile DIP Terminals
Depth × width (mm)
Flat lead
0.29 ±0.09 × 0.46 ±0.08 (See note 2.)
Round lead
0.50 dia. max.
0.41 dia. min.
Note: 1. Do not use wire where the diagonal is more than 0.56 mm.
2. Do not use wire where the diagonal is more than 0.52 mm.
3. IC lead length of 3 mm or more (If the lead terminal is too
long, the IC may rise up.)
XR2B Closed-frame Sockets
■ Dimensions
(unit: mm)
XR2B-1611-N
XR2B-1601-N
Mounting holes (bottom view)
0.8 ±0.05 dia. (DIP terminals)
0.51 dia.
1.33 dia.
[email protected]@11-N
[email protected]@01-N
Dimensions
No. of
contacts
Dimensions (mm)
A
B
16
7.62
17.78
24
15.24
27.94
28
15.24
33.02
32
15.24
38.10
40
15.24
48.26
0.51 dia.
1.33 dia.
■ Ordering Information
Appearance
No. of
contacts
Row pitch (A)
(mm)
Sockets with DIP terminals
With 0.25-µm gold
plating
With 0.75-µm gold
plating
16
7.62
XR2B-1611-N
XR2B-1601-N
24
15.24
XR2B-2411-N
XR2B-2401-N
28
15.24
XR2B-2811-N
XR2B-2801-N
32
15.24
XR2B-3211-N
XR2B-3201-N
40
15.24
XR2B-4011-N
XR2B-4001-N
IC Sockets
XR2
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